Model 1722B50-100J
Rev A
Ultra Low Profile 0805 Balun
50Ω to 200Ω Balanced
Description
The 1722B50-100J is a low profile sub-miniature balanced to unbalanced
transformer designed for differential inputs and output locations on next generation
wireless chipsets in an easy to use surface mount package covering the UMTS,
PCS, DCS and CDMA frequencies. The 1722B50-100J is ideal for high volume
manufacturing and is higher performance than traditional ceramic, and lumped
element baluns. The 1722B50-100J has an unbalanced port impedance of 50Ω and
a 200Ω balanced port impedance**. This transformation enables single ended
signals to be applied to differential ports on modern semiconductors. The output
ports have equal amplitude (-3dB) with 180 degree phase differential. The 1722B50-
100J is available on tape and reel for pick and place high volume manufacturing.
Detailed Electrical Specifications*:
Specifications subject to change without notice.
ROOM (25°C)
•
•
•
•
•
•
•
•
•
Features:
1.7 – 2.2 GHz
0.7mm Height Profile
50 Ohm to 2 x 100 Ohm
DCS/PCS/ UMTS/CDMA
Low Insertion Loss
Input to Output DC Isolation
Surface Mountable
Tape & Reel
Non-conductive Surface
Parameter
Frequency
Unbalanced Port Impedance
Balanced Port Impedance**
Return Loss
Insertion Loss***
Amplitude Balance
Phase Balance
Power Handling
Thermal Resistance
Operating Temperature
Min.
1.7
Typ.
50
200
20
0.5
±0.6
±4
Max
2.2
15
-55
0.7
±0.9
±8
0.5
TBD
+85
Unit
GHz
Ω
Ω
dB
dB
dB
Degrees
Watts
ºC / Watt
ºC
*Specification based on performance of unit properly installed on micro-strip printed circuit boards with 50
Ω
nominal impedance.
** 100
Ω
reference to ground. *** Insertion Loss stated at room temperature (0.8 dB Max at +85 ºC)
Pin Configuration
Balun Pin Configruation
λ
4
The internal configuration of the ultra-low profile balun is diagramed to
the left; the unbalanced port is terminated in an open-circuit and the
two balanced ports are connected to ground. The ground connection
for the two balanced ports are connected together and brought out on
a common pin of the balun. This pin is labeled “DC/RF ground”. For
many chipset applications there is an opportunity to use this
configuration as a single bias point if applicable.
The use of differential circuits is increasing in highly integrated circuits,
because of its inherent noise immunity properties. Differential circuits
have superior performance when looking at properties like cross
coupling, immunity to external noise sources and power supply noise.
When designing power amplifiers differential circuits also help
nd
rd
minimize 2 and 3 order intermodulation products.
The construction of the ultra-low profile balun is bonded multi-layered
stripline made of low loss dielectric material with plated through vias
connecting the internal circuitry to the external printed circuit board,
similar to that of other Xinger hybrids and directional couplers
.
λ
4
Available on Tape
and Reel for Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe
:
(315) 432-8909
(800) 411-6596
+44 2392-232392
Model 1722B50-100J
Rev A
Outline Drawing
Top View (Near-side)
.080
±.005
[2.03
±0.13
]
Side View
Bottom View (Far-side)
2X .014
±.004
[0.35
±0.10
]
3
6X .009
±.004
[0.22
±0.10
]
.027
±.003
[0.70
±0.08
]
.050
±.005
[1.27
±0.13
]
.030
±.004
[0.76
±0.10
]
1
2
Orientation
Marker Denotes
Pin Location
Dimensions are in Inches [Millimeters]
Mechanical Outline
Pin Designation
1 In
2 GND / DC Feed
+ RF GND
3 Out 1
4 Out 2
5 GND
6 NC
Orientation
Marker Denotes
Pin Location
6
5
6X .012
±.004
[0.30
±0.10
]
4
Tolerances are Non-Cumulative
Typical Broadband Performance: 0 GHz. to 6.0 GHz.
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 411-6596
+44 2392-232392
Available on Tape and
Reel for Pick and Place
Manufacturing.
Model 1722B50-100J
Rev A
Typical Performance: 1.7 GHz. to 2.2 GHz.
Mounting Configuration:
In order for Xinger surface mount components to work optimally, there must be a 50Ω transmission line to the
unbalanced port and 100
Ω
transmission lines from the balanced ports. If this condition is not satisfied, amplitude
balance, insertion loss and VSWR may not meet published specifications.
All of the Xinger components are constructed from ceramic filled PTFE composites which possess excellent electrical
and mechanical stability having X and Y thermal coefficient of expansion (CTE) of 17 ppm/
o
C.
An example of the PCB footprint used in the testing of these parts is shown on the next page. An example of a DC-
biased footprint is also shown on the next page. In specific designs, the transmission line widths need to be adjusted to
the unique dielectric coefficients and thicknesses as well as varying pick and place equipment tolerances.
Available on Tape
and Reel for Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe
:
(315) 432-8909
(800) 411-6596
+44 2392-232392
Model 1722B50-100J
Rev A
No Bias Footprint
6X .016
[0.35]
4X .010
[0.25]
DC Bias Footprint
6X .016
[0.35]
DC Bias
6X .013
[0.33]
6X .002
[0.05]
.026
[0.66]
6X .013
[0.33]
6X .002
[0.05]
.026
[0.66]
3X Transmission
Line
Circuit Pattern
Footprint Pad (s)
Solder Resist
Dimensions are in Inches [Millimeters]
Mounting Footprint
Plated thru
holes to
ground
3X Transmission
Line
Circuit Pattern
Footprint Pad (s)
Solder Resist
Dimensions are in Inches [Millimeters]
Mounting Footprint
Plated thru
hole to
ground
4X .010
[0.25]
Manufacturing Instructions
This section contains mounting instructions for hand soldering components in a lab environment and high volume pick
and place operations.
Mounting parts in a lab environment
The following steps outline the process for hand soldering Anaren’s components to pre-populated PWBs.
3. The picture to the right shows the mounting location
1. The picture to the right shows the mounting location
with excess solder removed.
for the component to be installed.
2. Using solder wick and water-soluble flux, remove
excess solder from pads where component will be
mounted.
4. There needs to be exposed copper/plated area to
place solder iron to transfer heat to the component
pads. The picture to the right shows areas of exposed
tin-lead plating where the soldering tip will be placed for
heat transfer.
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 411-6596
+44 2392-232392
Available on Tape and
Reel for Pick and Place
Manufacturing.
Model 1722B50-100J
Rev A
5. Clean excess flux from board, and any other
debris. Apply small amounts of solder paste
(SN63PB37 or equivalent) to each pad on
board.
7. Using a hand held soldering iron with Metcal solder
tip STTC-042 or equivalent, place tweezers on top of
component for support, place iron on exposed plated
area reflowing solder paste and tin-lead plating on part.
(Repeat for each pad) If necessary apply water-soluble
liquid flux to each pad and touch solder iron to exposed
plated area to complete the proper solder connection.
6. Place component on solder paste and align to pads.
8. Inspect all pads to ensure solder connection to
component pads and PWB pads. Clean excess flux
from component and PWB.
.
Mounting parts in High Volume Pick and Place
Component Mounting Process
The process for assembling this component in a conventional surface mount process is shown below. This process
is conducive to both low and high volume usage.
Clean
Substrate
Apply
Solder Paste
to Substrate
Place
component
on substrate
Reflow
component
to substrate
Clean &
Inspect
Surface Mounting Process Steps
Storage of Components:
Commonly used storage procedures used to control oxidation should be followed for
these surface mount components. The storage temperatures should be held between 15
O
C and 60
O
C.
Available on Tape
and Reel for Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe
:
(315) 432-8909
(800) 411-6596
+44 2392-232392
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