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IS61LF12836EC-7.5TQLI

Description
Cache SRAM, 128KX36, 7.5ns, CMOS, PQFP100, TQFP-100
Categorystorage    storage   
File Size2MB,36 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
Environmental Compliance
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IS61LF12836EC-7.5TQLI Overview

Cache SRAM, 128KX36, 7.5ns, CMOS, PQFP100, TQFP-100

IS61LF12836EC-7.5TQLI Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Parts packaging codeQFP
package instructionLQFP, QFP100,.63X.87
Contacts100
Reach Compliance Codecompliant
ECCN code3A991.B.2.A
Factory Lead Time10 weeks
Is SamacsysN
Maximum access time7.5 ns
Maximum clock frequency (fCLK)117 MHz
I/O typeCOMMON
JESD-30 codeR-PQFP-G100
JESD-609 codee3
length20 mm
memory density4718592 bit
Memory IC TypeCACHE SRAM
memory width36
Humidity sensitivity level3
Number of functions1
Number of terminals100
word count131072 words
character code128000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128KX36
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Encapsulate equivalent codeQFP100,.63X.87
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply2.5/3.3,3.3 V
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum standby current0.085 A
Minimum standby current3.14 V
Maximum slew rate0.17 mA
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperature10
width14 mm
Base Number Matches1
IS61(4)LF12836EC/IS61(4)VF12836EC/IS61(4)LF12832EC
IS61(4)VF12832EC/IS61(4)LF25618EC/IS61(4)VF25618EC
128K x36/32 and 256K x18 4Mb, ECC, SYNCHRONOUS FLOW-THROUGH
SRAM
APRIL 2017
FEATURES
Internal self-timed write cycle
Individual Byte Write Control and Global Write
Clock controlled, registered address, data and
control
Burst sequence control using MODE input
Three chip enable option for simple depth
expansion and address pipelining
Common data inputs and data outputs
Auto Power-down during deselect
Single cycle deselect
Snooze MODE for reduced-power standby
JEDEC 100-pin QFP, 165-ball BGA and 119-ball
BGA packages
Power supply:
LF: V
DD
3.3V (± 5%), V
DDQ
3.3V/2.5V (± 5%)
VF: V
DD
2.5V (± 5%), V
DDQ
2.5V (± 5%)
JTAG Boundary Scan for BGA packages
Industrial and Automotive temperature support
Lead-free available
Error Detection and Error Correction
DESCRIPTION
The 4Mb product family features high-speed, low-power
synchronous static RAMs designed to provide burstable,
high-performance memory for communication and
networking applications. The
IS61(64)LF/VF12836EC
are
organized as
131,072
words by 36bits. The
IS61(64)LF/VF12832EC
are organized as
131,072
words by
32bits. The
IS61(64)LF/VF25618EC
are organized as
262,144
words by 18 bits. Fabricated with ISSI's advanced CMOS
technology, the device integrates a 2-bit burst counter,
high-speed SRAM core, and high-drive capability outputs
into a single monolithic circuit. All synchronous inputs pass
through registers controlled by a positive-edge-triggered
single clock input.
Write cycles are internally self-timed and are initiated by
the rising edge of the clock input. Write cycles can be one
to four bytes wide as controlled by the write control inputs.
Separate byte enables allow individual bytes to be written.
The byte write operation is performed by using the byte
write enable (/BWE) input combined with one or more
individual byte write signals (/BWx). In addition, Global
Write (/GW) is available for writing all bytes at one time,
regardless of the byte write controls.
Bursts can be initiated with either /ADSP (Address Status
Processor) or /ADSC (Address Status Cache Controller)
input pins. Subsequent burst addresses can be generated
internally and controlled by the /ADV (burst address
advance) input pin.
The mode pin is used to select the burst sequence order.
Linear burst is achieved when this pin is tied LOW.
Interleave burst is achieved when this pin is tied HIGH or
left floating.
FAST ACCESS TIME
Symbol
tKQ
tKC
Parameter
Clock Access Time
Cycle time
Frequency
-6.5
6.5
7.5
133
-7.5
7.5
8.5
117
Units
ns
ns
MHz
Copyright © 2017 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can
reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such
applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc.- www.issi.com
Rev. C2
04/14/2017
1

IS61LF12836EC-7.5TQLI Related Products

IS61LF12836EC-7.5TQLI IS64LF12832EC-7.5TQLA3 IS64LF12836EC-7.5B3LA3
Description Cache SRAM, 128KX36, 7.5ns, CMOS, PQFP100, TQFP-100 Cache SRAM, 128KX32, 7.5ns, CMOS, PQFP100, TQFP-100 Cache SRAM, 128KX36, 7.5ns, CMOS, PBGA165, TFBGA-165
Is it Rohs certified? conform to conform to conform to
Parts packaging code QFP QFP BGA
package instruction LQFP, QFP100,.63X.87 LQFP, QFP100,.63X.87 TBGA, BGA165,11X15,40
Contacts 100 100 165
Reach Compliance Code compliant compliant compliant
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Factory Lead Time 10 weeks 12 weeks 12 weeks
Maximum access time 7.5 ns 7.5 ns 7.5 ns
Maximum clock frequency (fCLK) 117 MHz 117 MHz 117 MHz
I/O type COMMON COMMON COMMON
JESD-30 code R-PQFP-G100 R-PQFP-G100 R-PBGA-B165
JESD-609 code e3 e3 e1
length 20 mm 20 mm 15 mm
memory density 4718592 bit 4194304 bit 4718592 bit
Memory IC Type CACHE SRAM CACHE SRAM CACHE SRAM
memory width 36 32 36
Humidity sensitivity level 3 3 3
Number of functions 1 1 1
Number of terminals 100 100 165
word count 131072 words 131072 words 131072 words
character code 128000 128000 128000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C
organize 128KX36 128KX32 128KX36
Output characteristics 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LQFP LQFP TBGA
Encapsulate equivalent code QFP100,.63X.87 QFP100,.63X.87 BGA165,11X15,40
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE GRID ARRAY, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260 260
power supply 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 1.6 mm 1.6 mm 1.2 mm
Maximum standby current 0.085 A 0.1 A 0.1 A
Minimum standby current 3.14 V 3.14 V 3.14 V
Maximum slew rate 0.17 mA 0.185 mA 0.185 mA
Maximum supply voltage (Vsup) 3.465 V 3.465 V 3.465 V
Minimum supply voltage (Vsup) 3.135 V 3.135 V 3.135 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level INDUSTRIAL AUTOMOTIVE AUTOMOTIVE
Terminal surface Matte Tin (Sn) Matte Tin (Sn) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form GULL WING GULL WING BALL
Terminal pitch 0.65 mm 0.65 mm 1 mm
Terminal location QUAD QUAD BOTTOM
Maximum time at peak reflow temperature 10 10 10
width 14 mm 14 mm 13 mm
Maker - Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )
Filter level - AEC-Q100 AEC-Q100
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