Flash Card, 8MX16, 150ns, CARD
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Microsemi |
| Parts packaging code | DIE |
| package instruction | CARD |
| Reach Compliance Code | compliant |
| ECCN code | 3A991.B.1.A |
| Maximum access time | 150 ns |
| Other features | 5 V OPERATION IS ALSO POSSIBLE |
| JESD-30 code | R-XUUC-N |
| memory density | 134217728 bit |
| Memory IC Type | FLASH CARD |
| memory width | 16 |
| Number of functions | 1 |
| word count | 8388608 words |
| character code | 8000000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 8MX16 |
| Package body material | UNSPECIFIED |
| encapsulated code | DIE |
| Package shape | RECTANGULAR |
| Package form | UNCASED CHIP |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Programming voltage | 3.3 V |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | NO LEAD |
| Terminal location | UPPER |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| type | SLC NAND TYPE |
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