NXP Semiconductors
Data Sheet: Technical Data
K64P142M120SF5
Rev. 8, 10/2019
Kinetis K64 Sub-Family Data
Sheet With 1 MB Flash
120 MHz Arm® Cortex®-M4-based Microcontroller with FPU
The K64 product family features high memory densities, low
power capabilities, optimized integration, in an ultra-small
package. It shares the comprehensive enablement and
scalability of the Kinetis family.
This product offers:
• Up to 1 MB flash, with 256 KB of embedded SRAM
• 10/100 Mbit/s Ethernet MAC with MII and RMII interfaces
• Run power consumption down to 250 μA/MHz. Static
power consumption down to 5.8 μA with full state retention
and 5 μs wakeup. Lowest Static mode down to 339 nA
• USB LS/FS OTG 2.0 with embedded 3.3 V, 120 mA LDO
voltage regulator with USB device crystal-less operation
MK64FN1M0CAJ12R
142 WLCSP
4.84 x 5.58 x 0.60 mm Pitch 0.4 mm
Performance
• Up to 120 MHz Arm® Cortex®-M4 core with DSP
instructions and Floating Point Unit delivering 1.25
Dhrystone MIPS per MHz
Memories and memory interfaces
• Up to 1 MB program flash memory and 256 KB RAM
• FlexBus external bus interface
System peripherals
• Multiple low-power modes, low-leakage wakeup unit
• Memory protection unit with multi-master protection
• 16-channel DMA controller
• External watchdog monitor and software watchdog
Clocks
• 3 to 32 MHz and 32 kHz crystal oscillator
• Multi-purpose clock generator
• 1 kHz, 32 kHz, and 4 MHz internal reference clock
• 48 MHz internal reference
Security and integrity modules
• Hardware CRC module
• Hardware random-number generator
• Hardware encryption supporting DES, 3DES, AES,
MD5, SHA-1, and SHA-256 algorithms
• 128-bit unique identification (ID) number per chip
Communication interfaces
• Ethernet controller with MII and RMII interface
• USB full-/low-speed On-the-Go controller
• Controller Area Network (CAN) module
• Three SPI modules
• Three I2C modules
• Six UART modules
• Secure Digital Host Controller (SDHC)
• I2S module
Timers
• Programmable delay block
• Two 8-channel FlexTimers (PWM/Motor Control)
• Two 2-channel FlexTimer (Quad Decoder/PWM)
• IEEE 1588 timers
• PIT and 16-bit low-power timer
• Carrier modulator transmitter
• Real-time clock
Analog modules
• Two 16-bit SAR ADCs
• Two 12-bit DACs
• Three analog comparators (CMP)
• Voltage reference
Operating Characteristics
• Voltage range: 1.71 to 3.6 V
• Flash write voltage range: 1.71 to 3.6 V
• Temperature range (ambient): –40 to 85°C
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.
Ordering Information
1
Part Number
Flash
MK64FN1M0CAJ12R
1 MB
Memory
SRAM (KB)
256
100
Maximum number of I\O's
1. To confirm current availability of ordererable part numbers, go to
http://www.nxp.com
and perform a part number search.
Related Resources
Type
Selector
Guide
Product Brief
Reference
Manual
Data Sheet
Package
drawing
Description
The NXP Solution Advisor is a web-based tool that features interactive
application wizards and a dynamic product selector.
The Product Brief contains concise overview/summary information to
enable quick evaluation of a device for design suitability.
The Reference Manual contains a comprehensive description of the
structure and function (operation) of a device.
The Data Sheet includes electrical characteristics and signal
connections.
Package dimensions are provided in package drawings.
Resource
Solution Advisor
K60PB
1
K64P144M120SF5RM
1
This document
• WLCSP 142-pin:
98ASA00639D
1
1. To find the associated resource, go to
http://www.nxp.com
and perform a search using this term.
2
NXP Semiconductors
Kinetis K64 Sub-Family Data Sheet With 1 MB Flash, Rev. 8, 10/2019
Kinetis K64 Family
Arm
®
Cortex™-M4
Core
System
Internal
and external
watchdogs
Memory
protection
Memories and Memory Interfaces
Program
flash
FlexMemory
Serial
programming
interface
RAM
Clocks
Phase-
locked loop
Frequency-
locked loop
Low/high
frequency
oscillators
Debug
interfaces
Interrupt
controller
DSP
Floating-
point unit
External
bus
DMA
Low-leakage
wakeup
Internal
reference
clocks
and Integrity
CRC
Random
number
generator
Hardware
encryption
Security
Analog
16-bit ADC
x2
Timers
Timers
x2 (8ch)
x2 (2ch)
Programmable
Communication Interfaces
I
C
x3
UART
x6
SPI
x3
CAN
x1
IEEE 1588
Ethernet
2
Human-Machine
Interface (HMI)
GPIO
I
S
2
Analog
comparator
x3
6-bit DAC
x3
12-bit DAC
x2
delay block
Secure
Digital
USB OTG
LS/FS
Periodic
interrupt
timers
Low power
timer
USB LS/FS
transceiver
USB charger
detect
USB voltage
regulator
Voltage
reference
Independent
real-time
clock
IEEE 1588
Timers
Figure 1. K64 block diagram
Kinetis K64 Sub-Family Data Sheet With 1 MB Flash, Rev. 8, 10/2019
3
NXP Semiconductors
Table of Contents
1 Ratings.................................................................................... 5
1.1 Thermal handling ratings................................................. 5
1.2 Moisture handling ratings................................................ 5
1.3 ESD handling ratings....................................................... 5
1.4 Voltage and current operating ratings............................. 5
2 General................................................................................... 6
2.1 AC electrical characteristics.............................................6
2.2 Nonswitching electrical specifications..............................6
2.2.1
Voltage and current operating requirements.....6
2.2.2
LVD and POR operating requirements............. 8
2.2.3
Voltage and current operating behaviors.......... 8
2.2.4
Power mode transition operating behaviors......10
2.2.5
Power consumption operating behaviors.......... 11
2.2.6
EMC radiated emissions operating behaviors...16
2.2.7
Designing with radiated emissions in mind....... 17
2.2.8
Capacitance attributes...................................... 17
2.3 Switching specifications...................................................17
2.3.1
Device clock specifications............................... 17
2.3.2
General switching specifications....................... 18
2.4 Thermal specifications..................................................... 19
2.4.1
Thermal operating requirements....................... 19
2.4.2
Thermal attributes............................................. 20
3 Peripheral operating requirements and behaviors.................. 21
3.1 Core modules.................................................................. 21
3.1.1
Debug trace timing specifications..................... 21
3.1.2
JTAG electricals................................................ 21
3.2 System modules.............................................................. 24
3.3 Clock modules................................................................. 24
3.3.1
MCG specifications........................................... 24
3.3.2
IRC48M specifications...................................... 27
3.3.3
Oscillator electrical specifications..................... 27
3.3.4
32 kHz oscillator electrical characteristics.........30
3.4 Memories and memory interfaces................................... 30
3.4.1
Flash (FTFE) electrical specifications............... 30
3.4.2
EzPort switching specifications......................... 32
3.4.3
Flexbus switching specifications....................... 33
3.5 Security and integrity modules........................................ 36
3.6 Analog............................................................................. 36
3.6.1
ADC electrical specifications.............................37
3.6.2
3.6.3
CMP and 6-bit DAC electrical specifications.....41
12-bit DAC electrical characteristics................. 43
3.6.4
Voltage reference electrical specifications........ 46
3.7 Timers..............................................................................47
3.8 Communication interfaces............................................... 47
Ethernet switching specifications...................... 48
USB electrical specifications............................. 49
USB DCD electrical specifications.................... 50
USB VREG electrical specifications..................50
CAN switching specifications............................ 51
DSPI switching specifications (limited voltage
range)................................................................51
3.8.7
DSPI switching specifications (full voltage
range)................................................................53
3.8.8
Inter-Integrated Circuit Interface (I2C) timing....54
3.8.9
UART switching specifications.......................... 56
3.8.10 SDHC specifications......................................... 56
3.8.11 I2S switching specifications.............................. 57
Dimensions............................................................................. 63
4.1 Obtaining package dimensions....................................... 63
Pinout...................................................................................... 63
5.1 K64 Signal Multiplexing and Pin Assignments.................63
5.2 Unused analog interfaces................................................ 69
5.3 K64 Pinouts..................................................................... 70
Ordering parts......................................................................... 71
6.1 Determining valid orderable parts....................................71
Part identification.....................................................................71
7.1 Description.......................................................................71
7.2 Format............................................................................. 71
7.3 Fields............................................................................... 71
7.4 Example...........................................................................72
Terminology and guidelines.................................................... 72
8.1 Definitions........................................................................ 72
8.2 Examples......................................................................... 73
8.3 Typical-value conditions.................................................. 73
8.4 Relationship between ratings and operating
requirements....................................................................74
3.8.1
3.8.2
3.8.3
3.8.4
3.8.5
3.8.6
4
5
6
7
8
8.5 Guidelines for ratings and operating requirements..........74
9 Revision History...................................................................... 74
4
NXP Semiconductors
Kinetis K64 Sub-Family Data Sheet With 1 MB Flash, Rev. 8, 10/2019
Ratings
1 Ratings
1.1 Thermal handling ratings
Symbol
T
STG
T
SDR
Description
Storage temperature
Solder temperature, lead-free
Solder temperature, leaded
Min.
–55
—
—
Max.
150
260
245
Unit
°C
°C
Notes
1
2
1. Determined according to JEDEC Standard JESD22-A103,
High Temperature Storage Life.
2. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
1.2 Moisture handling ratings
Symbol
MSL
Description
Moisture sensitivity level
Min.
—
Max.
1
Unit
—
Notes
1
1. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
1.3 ESD handling ratings
Symbol
V
HBM
V
CDM
I
LAT
Description
Electrostatic discharge voltage, human body model
Electrostatic discharge voltage, charged-device
model
Latch-up current at ambient temperature of 105°C
Min.
-2000
-500
-100
Max.
+2000
+500
+100
Unit
V
V
mA
Notes
1
2
3
1. Determined according to JEDEC Standard JESD22-A114,
Electrostatic Discharge (ESD) Sensitivity Testing Human
Body Model (HBM).
2. Determined according to JEDEC Standard JESD22-C101,
Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components.
3. Determined according to JEDEC Standard JESD78,
IC Latch-Up Test.
1.4 Voltage and current operating ratings
Kinetis K64 Sub-Family Data Sheet With 1 MB Flash, Rev. 8, 10/2019
5
NXP Semiconductors
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