MC33HB2000
Rev. 8 — 24 February 2020
10 A H-bridge, SPI programmable brushed DC motor driver
Product data sheet
1
General description
The MC33HB2000 is a SMARTMOS monolithic H-Bridge Power IC, enhanced with SPI
configurability and diagnostic capabilities. It is designed primarily for DC motor or servo
motor control applications within the specified current and voltage limits.
The MC33HB2000 is able to control inductive loads with peak currents greater than 10 A.
The nominal continuous average load current is 3.0 A. A current mirror output provides
an analog feedback signal proportional to the load current.
This part is designed to specifically address the ISO 26262 safety requirements. It meets
the stringent requirements of automotive applications and is fully AEC-Q100 grade 1
qualified.
2
Simplified application diagram
Figure 1. Simplified application diagram
3
Features and benefits
•
Advanced diagnostic reporting via a serial peripheral interface (SPI): charge pump
undervoltage, overvoltage, and undervoltage on VPWR, short to ground and short
to VPWR for each output, open load, temperature warning and overtemperature
shutdown
•
Thermal management: Excellent thermal resistance of <1.0 °C/W between junction and
case (exposed pad)
•
Eight selectable slew rates via the SPI: 0.25 V/μs to more than 16 V/μs for EMI and
thermal performance optimization
NXP Semiconductors
10 A H-bridge, SPI programmable brushed DC motor driver
•
Four selectable current limits via the SPI: 5.4/7.0/8.8/10.7 A covering a wide range of
applications
•
Three package sizes available in SOIC, PQFN and HVQFN to meet footprint and
application requirement
•
Can be operated without SPI with default slew rate of 2.0 V/μs and a 7.0 A current limit
threshold
•
Highly accurate real-time current feedback through a current mirror output signal with
less than 5.0 % error
•
Drives inductive loads in a full H-bridge or Half-bridge configuration
•
Overvoltage protection places the load in high-side recirculation (braking) mode with
notification in H-bridge mode
•
Wide operating range: 5.0 V to 28 V operation
•
Low R
DS(on)
integrated MOSFETs: Maximum of 235 mΩ (T
J
= 150 °C) for each
MOSFET
•
Internal protection for overtemperature, undervoltage, and short-circuit by signaling the
error condition and disabling the outputs
•
I/O pins can withstand up to 36 V
•
AEC-Q100 grade 1 qualified
MC33HB2000
4
Applications
•
•
•
•
Electronic throttle control
Exhaust gas recirculation control (EGR)
Turbo, swirl and whirl and waste flap control
Electric pumps, motor control and auxiliaries
5
Ordering information
This section describes the part numbers available to be purchased along with their
differences.
Table 1. Orderable parts
Part number
[1]
Operating temperature
T
A
= –40 °C to 125 °C
T
J
= –40 °C to 150 °C
Package
28-pin HVQFN exposed pad
32-pin SOICW exposed pad
32-pin PQFN exposed pad
MC33HB2000AES
MC33HB2000EK
MC33HB2000FK
[1]
To order parts in tape and reel, add the R2 suffix to the part number.
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to
http://www.nxp.com
and perform a part number search.
MC33HB2000
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2020. All rights reserved.
Product data sheet
Rev. 8 — 24 February 2020
2 / 55
NXP Semiconductors
10 A H-bridge, SPI programmable brushed DC motor driver
MC33HB2000
6
Internal block diagram
Figure 2. Internal block diagram
MC33HB2000
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2020. All rights reserved.
Product data sheet
Rev. 8 — 24 February 2020
3 / 55
NXP Semiconductors
10 A H-bridge, SPI programmable brushed DC motor driver
MC33HB2000
7
Pinning information
7.1 Pinning
Figure 3. Pin configuration for 32-pin SOICW
Figure 4. Pin configuration for 32-pin PQFN
MC33HB2000
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2020. All rights reserved.
Product data sheet
Rev. 8 — 24 February 2020
4 / 55
NXP Semiconductors
10 A H-bridge, SPI programmable brushed DC motor driver
VPWR
terminal 1
index area
AGND
MISO
SCLK
MOSI
DGND
AGND
ENBL
DIS
AGND
AGND
1
2
3
4
5
6
7
CFB 10
VPWR 12
OUT1 13
OUT1 14
11
8
9
AGND
VPWR
MC33HB2000
AGND
VDDQ
AGND
AGND
21
20
19
18
17
16
15
AGND
PGND
PGND
PGND
PGND
PGND
FS_B
AGND
AGND
aaa-035615
OUT2
23
28
27
26
25
24
Transparent top view
Figure 5. Pin configuration for 28-pin HVQFN
7.2 Pin description
For functional description of each pin see
Section 7.3 "Functional pin description".
Table 2. Pin description
Symbol
AGND
ENBL
32-pin
SOICW
1, 19
2
32-pin PQFN
6, 24
7
28-pin
HVQFN
5
6
Pin
function
GND
D_In
Definition
Ground for analog
[1]
When ENBL is logic HIGH, the H-bridge is
operational. When ENBL is logic LOW, the H-
bridge outputs are tri-stated and placed in Sleep
mode.
When DIS is logic HIGH, both OUT1 and OUT2
are tri-stated
Logic input control of OUT2
Logic input control of OUT1
The load current feedback output provides ground
referenced 0.25 % of the high-side output current.
Open drain active LOW status flag output
These pins must be connected together physically
as close as possible and directly soldered down
to a wide, thick, low resistance supply plane on
the PCB.
Source of HS1 and drain of LS1
No connection to die or substrate
Power ground for OUT1 and OUT2
Source of HS2 and drain of LS2
© NXP B.V. 2020. All rights reserved.
DIS
IN2
IN1
CFB
FS_B
VPWR
3
4
5
6
7
8, 9, 24, 25
8
9
10
11
18
7
8
9
10
15
D_In
D_In
D_In
A_Out
D_Out
12, 13, 29, 30 11, 12, 24, 25 Supply
OUT1
NC
PGND
OUT2
MC33HB2000
10, 11
14, 15
13, 14
A_Out
NC
12, 13, 14, 20, 16, 17, 19, 25, —
21
26
VPWR
IN2
IN1
22
OUT2
CS_B
CCP
15, 16, 17, 18 20, 21, 22, 23 16, 17, 18, 19, GND
20
22, 23
27, 28
22, 23
A_Out
[1]
All information provided in this document is subject to legal disclaimers.
Product data sheet
Rev. 8 — 24 February 2020
5 / 55
Analog electronics
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