THGBMHG6C1LBAIL datasheet, PDF

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THGBMHG6C1LBAIL: DescriptionTechnology: NAND Flash Clock frequency: 52MHz Memory architecture (format): FLASH Memory interface type: MMC Memory capacity: 64Gb (8G x 8) Memory type: Non-Volatile eMMC 8GB; Categorystorage storage; File Size1MB，33 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/

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THGBMHG6C1LBAIL Overview

Technology: NAND Flash Clock frequency: 52MHz Memory architecture (format): FLASH Memory interface type: MMC Memory capacity: 64Gb (8G x 8) Memory type: Non-Volatile eMMC 8GB

THGBMHG6C1LBAIL Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
package instruction	BGA,
Reach Compliance Code	unknown
JESD-30 code	R-PBGA-B153
memory density	68719476736 bit
Memory IC Type	MEMORY CIRCUIT
memory width	8
Number of functions	1
Number of terminals	153
word count	8589934592 words
character code	8000000000
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
organize	8GX8
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	RECTANGULAR
Package form	GRID ARRAY
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	BALL
Terminal location	BOTTOM
Base Number Matches	1

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THGBMHG6C1LBAIL

TOSHIBA e-MMC Module

8GB THGBMHG6C1LBAIL

INTRODUCTION

THGBMHG6C1LBAIL is 8GB density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized

advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMHG6C1LBAIL

has an industry standard MMC protocol for easy use.

FEATURES

THGBMHG6C1LBAIL Interface

THGBMHG6C1LBAIL has the JEDEC/MMCA Version 5.1 interface with 1-I/O, 4-I/O and 8-I/O mode.

Pin Connection

P-WFBGA153-1113-0.50 (11.5mm x 13mm, H0.8mm max. package)

RFU

VccQ

VSF VSF RFU

Vss

VSF

RFU

Vcc

RFU

Vcc

Vss

RFU

CLK

RFU

VssQ

Top View

Vss

Vcc

RFU

Vcc

RFU

Vss

DAT2

DAT7

RFU

DAT6

VssQ

Vss

RST_n

CMD

VssQ VccQ

VccQ

VssQ

DAT1

DAT5

index

DAT0

DAT4

RFU

VssQ

VccQ

DAT3 VDDi

Pin Number

Name

DAT0

DAT1

DAT2

Vss

DAT3

DAT4

DAT5

DAT6

DAT7

Pin Number

H10

Name

VDDi

VssQ

VccQ

Vcc

Vss

Vcc

Vss

Pin Number

J10

Name

Vss

Vcc

RST_n

Vss

Vcc

VccQ

CMD

CLK

VssQ

Pin Number

Name

VccQ

VssQ

VccQ

VssQ

VccQ

VssQ

NC: No Connect, shall be connected to ground or left floating.

RFU: Reserved for Future Use, shall be left floating for future use.

VSF: Vendor Specific Function, shall be left floating.

Jul. 31th, 2015

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