STM32L031F4P6 datasheet, PDF - EEWORLD Datasheet

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STM32L031F4P6: DescriptionWorking voltage: 1.8V ~ 3.6V CPU bits: 32-Bit CPU core: ARM® Cortex®-M0+ Main frequency (MAX): 32MHz ROM type: FLASH; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，118 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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STM32L031F4P6 Overview

Working voltage: 1.8V ~ 3.6V CPU bits: 32-Bit CPU core: ARM® Cortex®-M0+ Main frequency (MAX): 32MHz ROM type: FLASH

STM32L031F4P6 Parametric

Parameter Name	Attribute value
Brand Name	STMicroelectronics
Maker	STMicroelectronics
package instruction	TSSOP,
Reach Compliance Code	compliant
ECCN code	3A991.A.2
Factory Lead Time	11 weeks 2 days
Samacsys Description	STMICROELECTRONICS - STM32L031F4P6 - MCU, ARM CORTEX-M0+, 32MHZ, TSSOP-20
Has ADC	YES
Address bus width
bit size	32
maximum clock frequency	25 MHz
DAC channel	NO
DMA channel	YES
External data bus width
JESD-30 code	R-PDSO-G20
length	6.5 mm
Number of I/O lines	15
Number of terminals	20
On-chip program ROM width	8
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
RAM (bytes)	8192
rom(word)	16384
ROM programmability	FLASH
Maximum seat height	1.2 mm
speed	32 MHz
Maximum supply voltage	3.6 V
Minimum supply voltage	1.8 V
Nominal supply voltage	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	4.4 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

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STM32L031x4 STM32L031x6

Access line ultra-low-power 32-bit MCU ARM

-based

Cortex

-M0+, up to 32KB Flash, 8KB SRAM, 1KB EEPROM, ADC

Datasheet

production data

Features



Ultra-low-power platform

– 1.65 V to 3.6 V power supply

– -40 to 125 °C temperature range

– 0.23 µA Standby mode (2 wakeup pins)

– 0.35 µA Stop mode (16 wakeup lines)

– 0.6 µA Stop mode + RTC + 8 KB RAM retention

– Down to 76 µA/MHz in Run mode

– 5 µs wakeup time (from Flash memory)

– 41 µA 12-bit ADC conversion at 10 ksps

Core: ARM

32-bit Cortex

-M0+

– From 32 kHz up to 32 MHz max.

– 0.95 DMIPS/MHz

Reset and supply management

– Ultra-safe, low-power BOR (brownout reset)

with 5 selectable thresholds

– Ultralow power POR/PDR

– Programmable voltage detector (PVD)

Clock sources

– 1 to 25 MHz crystal oscillator

– 32 kHz oscillator for RTC with calibration

– High speed internal 16 MHz factory-trimmed RC

(+/- 1%)

– Internal low-power 37 kHz RC

– Internal multispeed low-power 65 kHz to

4.2 MHz RC

– PLL for CPU clock

Pre-programmed bootloader

– USART, SPI supported

Development support

– Serial wire debug supported

Up to 38 fast I/Os (31 I/Os 5V tolerant)

Memories

– Up to 32 KB Flash with ECC

– 8 KB RAM

– 1 KB of data EEPROM with ECC

– 20-byte backup register

– Sector protection against R/W operation

TSSOP20

169 mils

–

UFQFPN28 4x4 mm

UFQFPN32 5x5 mm

LQFP32/48

7x7 mm

WLCSP25

2.097x2.493 mm



Rich Analog peripherals

– 12-bit ADC 1.14 Msps up to 10 channels (down

to 1.65 V)

– 2x ultra-low-power comparators (window mode

and wake up capability, down to 1.65 V)

7-channel DMA controller, supporting ADC, SPI,

I2C, USART, Timers

5x peripherals communication interface

1x USART (ISO 7816, IrDA), 1x UART (low power)

Up to 2 SPI interfaces, up to 16 Mbits/s

1x I2C (SMBus/PMBus)

8x timers: 1x 16-bit with up to 4 channels, 2x 16-bit

with up to 2 channels, 1x 16-bit ultra-low-power

timer, 1x SysTick, 1x RTC and 2x watchdogs

(independent/window)

CRC calculation unit, 96-bit unique ID

All packages are ECOPACK

Table 1. Device summary



Reference

STM32L031x4

Part number

STM32L031G4, STM32L031K4,

STM32L031C4, STM32L031E4,

STM32L031F4

STM32L031G6, STM32L031K6,

STM32L031C6, STM32L031E6,

STM32L031F6

STM32L031x6

April 2016

This is information on a product in full production.

DocID027063 Rev 4

1/118

www.st.com

Contents

STM32L031x4/6

Contents

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2.1

2.2

Device overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

Ultra-low-power device continuum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

3.1

3.2

3.3

3.4

Low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Interconnect matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

ARM® Cortex®-M0+ core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Reset and supply management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

3.4.1

3.4.2

3.4.3

3.4.4

Power supply schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Power supply supervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

3.5

3.6

3.7

3.8

3.9

3.10

3.11

3.12

3.13

3.14

Clock management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Low-power real-time clock and backup registers . . . . . . . . . . . . . . . . . . . 25

General-purpose inputs/outputs (GPIOs) . . . . . . . . . . . . . . . . . . . . . . . . . 25

Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Direct memory access (DMA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Analog-to-digital converter (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

3.11.1

Internal voltage reference (V

REFINT

) . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Ultra-low-power comparators and reference voltage . . . . . . . . . . . . . . . . 28

System configuration controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Timers and watchdogs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

3.14.1

3.14.2

3.14.3

3.14.4

3.14.5

General-purpose timers (TIM2, TIM21 and TIM22) . . . . . . . . . . . . . . . . 29

Low-power Timer (LPTIM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

SysTick timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Independent watchdog (IWDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Window watchdog (WWDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

3.15

Communication interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

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3.15.1

3.15.2

3.15.3

3.15.4

Contents

I2C bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Universal synchronous/asynchronous receiver transmitter (USART) . . 31

Low-power universal asynchronous receiver transmitter (LPUART) . . . 32

Serial peripheral interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

3.16

3.17

Cyclic redundancy check (CRC) calculation unit . . . . . . . . . . . . . . . . . . . 32

Serial wire debug port (SW-DP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

6.1

Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

6.1.1

6.1.2

6.1.3

6.1.4

6.1.5

6.1.6

6.1.7

Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

6.2

6.3

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

6.3.1

6.3.2

6.3.3

6.3.4

6.3.5

6.3.6

6.3.7

6.3.8

6.3.9

6.3.10

6.3.11

6.3.12

6.3.13

6.3.14

6.3.15

General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Embedded reset and power control block characteristics . . . . . . . . . . . 52

Embedded internal reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . 54

Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

Wakeup time from low-power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73

Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

Electrical sensitivity characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77

I/O current injection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78

I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

12-bit ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

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STM32L031x4/6

List of tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Table 9.

Table 10.

Table 11.

Table 12.

Table 13.

Table 14.

Table 15.

Table 16.

Table 17.

Table 18.

Table 19.

Table 20.

Table 21.

Table 22.

Table 23.

Table 24.

Table 25.

Table 26.

Table 27.

Table 28.

Table 29.

Table 30.

Table 31.

Table 32.

Table 33.

Table 34.

Table 35.

Table 36.

Table 37.

Table 38.

Table 39.

Table 40.

Table 41.

Table 42.

Table 43.

Table 44.

Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Ultra-low-power STM32L031x4/x6 device features and peripheral counts. . . . . . . . . . . . . 11

Functionalities depending on the operating power supply range . . . . . . . . . . . . . . . . . . . . 17

CPU frequency range depending on dynamic voltage scaling . . . . . . . . . . . . . . . . . . . . . . 17

Functionalities depending on the working mode

(from Run/active down to standby) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

STM32L0xx peripherals interconnect matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Temperature sensor calibration values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Internal voltage reference measured values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Timer feature comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Comparison of I2C analog and digital filters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

STM32L031x4/6 I

C implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

USART implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

SPI implementation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Legend/abbreviations used in the pinout table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

Alternate functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Embedded reset and power control block characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 52

Embedded internal reference voltage calibration values . . . . . . . . . . . . . . . . . . . . . . . . . . 54

Embedded internal reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

Current consumption in Run mode, code with data processing running

from Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

Current consumption in Run mode vs code type,

code with data processing running from Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

Current consumption in Run mode, code with data processing running from RAM . . . . . . 58

Current consumption in Run mode vs code type,

code with data processing running from RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

Current consumption in Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

Current consumption in Low-power run mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

Current consumption in Low-power Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

Typical and maximum current consumptions in Stop mode . . . . . . . . . . . . . . . . . . . . . . . . 62

Typical and maximum current consumptions in Standby mode . . . . . . . . . . . . . . . . . . . . . 63

Average current consumption during wakeup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

Peripheral current consumption in Run or Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

Peripheral current consumption in Stop and Standby mode . . . . . . . . . . . . . . . . . . . . . . . 65

Low-power mode wakeup timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

High-speed external user clock characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

HSE oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

LSE oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

16 MHz HSI16 oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

LSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

MSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73

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STM32L031F4P6 Related Products

	STM32L031F4P6	STM32L031G6U6	STM32L031K6T6	STM32L031F6P6	STM32L031C4T7
Description	Working voltage: 1.8V ~ 3.6V CPU bits: 32-Bit CPU core: ARM® Cortex®-M0+ Main frequency (MAX): 32MHz ROM type: FLASH	Working voltage: 1.8V ~ 3.6V CPU bits: 32-Bit CPU core: ARM® Cortex®-M0+ Main frequency (MAX): 32MHz ROM type: FLASH Extremely low power consumption Cortex-M0+ integrates 32-KB Flash, 32 MHz CPU	Working voltage: 1.8V ~ 3.6V CPU bits: 32-Bit CPU core: ARM® Cortex®-M0+ Main frequency (MAX): 32MHz ROM type: FLASH 125℃ 32MHz 76uA/MHz Built-in ECC 32K-flash 1K-EEPROM 8K -RAM extremely low power consumption cortex-M0+	Working voltage: 1.8V ~ 3.6V CPU bits: 32-Bit CPU core: ARM® Cortex®-M0+ Main frequency (MAX): 32MHz ROM type: FLASH	RISC MICROCONTROLLER
package instruction	TSSOP,	HVQCCN,	LQFP,	TSSOP,	LQFP-48
Reach Compliance Code	compliant	compliant	compliant	compliant	compli
Has ADC	YES	YES	YES	YES	YES
bit size	32	32	32	32	32
maximum clock frequency	25 MHz	25 MHz	25 MHz	25 MHz	25 MHz
DMA channel	YES	YES	YES	YES	YES
length	6.5 mm	4 mm	7 mm	6.5 mm	7 mm
Number of I/O lines	15	21	25	15	38
Number of terminals	20	28	32	20	48
PWM channel	YES	YES	YES	YES	YES
encapsulated code	TSSOP	HVQCCN	LQFP	TSSOP	LFQFP
Package shape	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	SQUARE
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	FLATPACK, LOW PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	FLATPACK, LOW PROFILE, FINE PITCH
speed	32 MHz	32 MHz	32 MHz	32 MHz	32 MHz
Maximum supply voltage	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
Nominal supply voltage	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal form	GULL WING	NO LEAD	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.5 mm	0.8 mm	0.65 mm	0.5 mm
Terminal location	DUAL	QUAD	QUAD	DUAL	QUAD
width	4.4 mm	4 mm	7 mm	4.4 mm	7 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
Brand Name	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	-
Maker	STMicroelectronics	STMicroelectronics	STMicroelectronics	-	STMicroelectronics
ECCN code	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	-
Factory Lead Time	11 weeks 2 days	10 weeks 3 days	10 weeks 5 days	10 weeks 2 days	-
Samacsys Description	STMICROELECTRONICS - STM32L031F4P6 - MCU, ARM CORTEX-M0+, 32MHZ, TSSOP-20	ARM Microcontrollers - MCU Ultra-low-power ARM Cortex-M0+ MCU with 32-Kbytes Flash, 32 MHz CPU	STMICROELECTRONICS - STM32L031K6T6 - MCU, ARM CORTEX-M0+, 32MHZ, LQFP-32	-	-
DAC channel	NO	-	NO	NO	NO
JESD-30 code	R-PDSO-G20	-	S-PQFP-G32	R-PDSO-G20	S-PQFP-G48
On-chip program ROM width	8	-	8	8	8
Maximum operating temperature	85 °C	-	85 °C	85 °C	105 °C
Minimum operating temperature	-40 °C	-	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
RAM (bytes)	8192	-	8192	8192	8192
rom(word)	16384	-	32768	32768	16384
ROM programmability	FLASH	-	FLASH	FLASH	FLASH
Maximum seat height	1.2 mm	-	1.6 mm	1.2 mm	1.6 mm
Temperature level	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-

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