EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

MC14052BDG

CategoryAnalog mixed-signal IC    The signal circuit   
File Size150KB,11 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
Environmental Compliance
Download Datasheet Parametric Compare View All

MC14052BDG Online Shopping

Suppliers Part Number Price MOQ In stock  
MC14052BDG - - View Buy Now

MC14052BDG Parametric

Parameter NameAttribute value
Brand NameON Semiconductor
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerON Semiconductor
Parts packaging codeSOIC
package instructionROHS COMPLIANT, PLASTIC, SOIC-16
Contacts16
Manufacturer packaging code751B-05
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time4 weeks
Samacsys Confidence3
Samacsys StatusReleased
Samacsys PartID225154
Samacsys Pin Count16
Samacsys Part CategoryIntegrated Circuit
Samacsys Package CategorySmall Outline Packages
Samacsys Footprint NameSOIC-16 CASE751B-05
Samacsys Released Date2015-08-07 08:50:30
Is SamacsysN
Analog Integrated Circuits - Other TypesDIFFERENTIAL MULTIPLEXER
JESD-30 codeR-PDSO-G16
JESD-609 codee3
length9.9 mm
Humidity sensitivity level1
Number of channels4
Number of functions1
Number of terminals16
Nominal off-state isolation50 dB
On-state resistance matching specifications25 Ω
Maximum on-state resistance (Ron)1050 Ω
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP16,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
power supply5/15 V
Certification statusNot Qualified
Maximum seat height1.75 mm
Maximum signal current0.025 A
Maximum supply voltage (Vsup)18 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)5 V
surface mountYES
Maximum disconnect time600 ns
Maximum connection time600 ns
switchBREAK-BEFORE-MAKE
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin (Sn)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width3.9 mm
Base Number Matches1

MC14052BDG Related Products

MC14052BDG PRA100I2-196RBBNT31 PRA100I4-218RBBNT MC14053BDR2G MC14052BDR2G MC14053BDTR2G MC14053BDG MC14052BDTR2G PTN0402H2290DBTF
Description Array/Network Resistor, Isolated, Thin Film, 0.1W, 196ohm, 50V, 0.1% +/-Tol, -10,10ppm/Cel, 0806, Array/Network Resistor, Isolated, Thin Film, 0.1W, 218ohm, 50V, 0.1% +/-Tol, -10,10ppm/Cel, 1606, Logic Type: SPDT Additional Features:- Logical Type:- Extra Features:- Analog switches, multiplexers 8 in and 2 out, analog switch, RESISTOR, THIN FILM, 0.05 W, 0.5 %, 50 ppm, 229 ohm, SURFACE MOUNT, 0402, CHIP
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to conform to incompatible
package instruction ROHS COMPLIANT, PLASTIC, SOIC-16 SMT, 0806 SMT, 1606 ROHS COMPLIANT, PLASTIC, SOIC-16 ROHS COMPLIANT, PLASTIC, SOIC-16 ROHS COMPLIANT, PLASTIC, TSSOP-16 ROHS COMPLIANT, PLASTIC, SOIC-16 ROHS COMPLIANT, PLASTIC, TSSOP-16 SMT, 0402
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant compliant
JESD-609 code e3 e2 e2 e3 e3 e4 e3 e4 e0
Number of terminals 16 4 8 16 16 16 16 16 2
Maximum operating temperature 125 °C 155 °C 155 °C 125 °C 125 °C 125 °C 125 °C 125 °C 155 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
Package form SMALL OUTLINE SMT SMT SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMT
technology CMOS THIN FILM THIN FILM CMOS CMOS CMOS CMOS CMOS THIN FILM
Terminal surface Tin (Sn) Tin/Silver (Sn/Ag) - with Nickel (Ni) barrier Tin/Silver (Sn/Ag) - with Nickel (Ni) barrier Tin (Sn) Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au) Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Brand Name ON Semiconductor - - ON Semiconductor ON Semiconductor ON Semiconductor ON Semiconductor ON Semiconductor -
Is it lead-free? Lead free - - Lead free Lead free Lead free Lead free Lead free Contains lead
Maker ON Semiconductor - - ON Semiconductor ON Semiconductor ON Semiconductor ON Semiconductor ON Semiconductor -
Parts packaging code SOIC - - SOIC SOIC TSSOP SOIC TSSOP -
Contacts 16 - - 16 16 16 16 16 -
Manufacturer packaging code 751B-05 - - 751B-05 751B-05 948F-01 751B-05 948F-01 -
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 - - - EAR99
Factory Lead Time 4 weeks - - 1 week 1 week 1 week 1 week 45 weeks -
Is Samacsys N - - N N N N N -
Analog Integrated Circuits - Other Types DIFFERENTIAL MULTIPLEXER - - SINGLE-ENDED MULTIPLEXER DIFFERENTIAL MULTIPLEXER SINGLE-ENDED MULTIPLEXER SINGLE-ENDED MULTIPLEXER DIFFERENTIAL MULTIPLEXER -
JESD-30 code R-PDSO-G16 - - R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 -
length 9.9 mm - - 9.9 mm 9.9 mm 5 mm 9.9 mm 5 mm -
Humidity sensitivity level 1 - - 1 1 1 1 1 -
Number of channels 4 - - 2 4 2 2 4 -
Number of functions 1 - 4 3 1 3 3 1 -
Nominal off-state isolation 50 dB - - 50 dB 50 dB 50 dB 50 dB 50 dB -
On-state resistance matching specifications 25 Ω - - 25 Ω 25 Ω 25 Ω 25 Ω 25 Ω -
Maximum on-state resistance (Ron) 1050 Ω - - 1050 Ω 1050 Ω 1050 Ω 1050 Ω 1050 Ω -
Package body material PLASTIC/EPOXY - - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code SOP - - SOP SOP TSSOP SOP TSSOP -
Encapsulate equivalent code SOP16,.25 - - SOP16,.25 SOP16,.25 TSSOP16,.25 SOP16,.25 TSSOP16,.25 -
Package shape RECTANGULAR - - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR -
Peak Reflow Temperature (Celsius) 260 - - 260 NOT SPECIFIED 260 260 260 -
power supply 5/15 V - - 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V -
Certification status Not Qualified - - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
Maximum seat height 1.75 mm - - 1.75 mm 1.75 mm 1.2 mm 1.75 mm 1.2 mm -
Maximum signal current 0.025 A - - 0.025 A 0.025 A 0.025 A 0.025 A 0.025 A -
Maximum supply voltage (Vsup) 18 V - - 18 V 18 V 18 V 18 V 18 V -
Minimum supply voltage (Vsup) 3 V - - 3 V 3 V 3 V 3 V 3 V -
Nominal supply voltage (Vsup) 5 V - - 5 V 5 V 5 V 5 V 5 V -
surface mount YES - YES YES YES YES YES YES YES
Maximum disconnect time 600 ns - - 550 ns 600 ns 550 ns 550 ns 600 ns -
Maximum connection time 600 ns - - 550 ns 600 ns 550 ns 550 ns 600 ns -
switch BREAK-BEFORE-MAKE - - BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE -
Temperature level MILITARY - - MILITARY MILITARY MILITARY MILITARY MILITARY -
Terminal form GULL WING - - GULL WING GULL WING GULL WING GULL WING GULL WING -
Terminal pitch 1.27 mm - - 1.27 mm 1.27 mm 0.65 mm 1.27 mm 0.65 mm -
Terminal location DUAL - - DUAL DUAL DUAL DUAL DUAL -
Maximum time at peak reflow temperature 40 - - 40 NOT SPECIFIED 40 40 40 -
width 3.9 mm - - 3.9 mm 3.9 mm 4.4 mm 3.9 mm 4.4 mm -
Base Number Matches 1 - - 1 1 1 1 1 -
Analog circuits and digital circuits and their applications review materials
Digital Circuits and Their Applications Review Materials 2005-6-10 (Although it is not a professional course, it is related to the professional "Analog Circuits of Digital Circuits"In today's era, dig...
fighting Analog electronics
Battery Pack BMS Coulomb Counter Chip Solution
ADI-Maxim's battery pack BMS coulomb meter chip is relatively expensive, and most companies will not use it. Can anyone recommend a domestic chip? Taiwan, Japan, and Korea are also OK. In the past, co...
QWE4562009 DIY/Open Source Hardware
New member, please take care of me
As title...
日晶电子 WindowsCE
Application of TI current detection device INA series in TWS battery box
With the explosive growth of TWS earphones, higher requirements are placed on the battery life of earphones and battery boxes. Generally, the battery life can be improved from the following points. 1)...
qwqwqw2088 Analogue and Mixed Signal
DM365 CMEM allocated memory
#define ALIGN(x, y)(((x + (y-1))/y)*y)// 内存对齐数,不设可分配任意大小 struct buf_info {void *user_addr;unsigned long phy_addr; }; struct buf_info dhavbuffer;static int allocate_dhavbuffer(int size){CMEM_AllocParam...
Jacktang Microcontroller MCU
How to distinguish between pads and vias_Differences between vias and pads
[b][b]Pad and via design[/b][/b][p=24, 2, left][color=rgb(0, 0, 0)][font=宋体, arial][size=14px]Components are fixed on the printed circuit board by soldering the leads to the pads. The function of vias...
luoxiao1116 PCB Design

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号