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SMMBT2369LT1G

CategoryDiscrete semiconductor    The transistor   
File Size130KB,6 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
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SMMBT2369LT1G Parametric

Parameter NameAttribute value
Brand NameON Semiconductor
Is it lead-free?Lead free
MakerON Semiconductor
package instructionSMALL OUTLINE, R-PDSO-G3
Contacts3
Manufacturer packaging code318-08
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time4 weeks
Maximum collector current (IC)0.2 A
Collector-emitter maximum voltage15 V
ConfigurationSINGLE
Minimum DC current gain (hFE)20
JEDEC-95 codeTO-236AB
JESD-30 codeR-PDSO-G3
JESD-609 codee3
Humidity sensitivity level1
Number of components1
Number of terminals3
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Polarity/channel typeNPN
Maximum power dissipation(Abs)0.3 W
GuidelineAEC-Q101
surface mountYES
Terminal surfaceTin (Sn)
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
transistor applicationsSWITCHING
Transistor component materialsSILICON
Maximum off time (toff)18 ns
Maximum opening time (tons)12 ns
MMBT2369L, MMBT2369AL
Switching Transistors
NPN Silicon
Features
S Prefix for Automotive and Other Applications Requiring Unique
www.onsemi.com
MARKING
DIAGRAM
SOT−23
CASE 318
STYLE 6
1
xxx MG
G
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
MAXIMUM RATINGS
Rating
Collector
−Emitter
Voltage
Collector
−Emitter
Voltage
Collector
−Base
Voltage
Emitter
−Base
Voltage
Collector Current
Continuous
Symbol
V
CEO
V
CES
V
CBO
V
EBO
I
C
Value
15
40
40
4.5
200
Unit
Vdc
Vdc
Vdc
Vdc
mAdc
xxx = M1J or 1JA
M = Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR− 5 Board
(Note 1) T
A
= 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient
Total Device Dissipation Alumina
Substrate, (Note 2) T
A
= 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature
Symbol
P
D
Max
225
1.8
556
300
2.4
417
−55
to +150
Unit
mW
mW/°C
°C/W
mW
mW/°C
°C/W
°C
1
BASE
COLLECTOR
3
R
qJA
P
D
2
EMITTER
R
qJA
T
J
, T
stg
ORDERING INFORMATION
Device
MMBT2369LT1G
MMBT2369LT3G
SMMBT2369LT1G
MMBT2369ALT1G
SMMBT2369ALT1G
Package
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
Shipping
3,000 /
Tape & Reel
10,000 /
Tape & Reel
3,000 /
Tape & Reel
3,000 /
Tape & Reel
3,000 /
Tape & Reel
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR− 5 = 1.0

0.75

0.062 in.
2. Alumina = 0.4

0.3

0.024 in. 99.5% alumina.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
1
Publication Order Number:
MMBT2369LT1/D
©
Semiconductor Components Industries, LLC, 2016
October, 2018
Rev. 11

SMMBT2369LT1G Related Products

SMMBT2369LT1G MMBT2369LT1G
Description Rated power: 225mW Collector current Ic: 200mA Collector-emitter breakdown voltage Vce: 15V Transistor type: NPN
Brand Name ON Semiconductor ON Semiconductor
Is it lead-free? Lead free Lead free
package instruction SMALL OUTLINE, R-PDSO-G3 SMALL OUTLINE, R-PDSO-G3
Contacts 3 3
Manufacturer packaging code 318-08 318-08
Reach Compliance Code compliant compliant
ECCN code EAR99 EAR99
Factory Lead Time 4 weeks 1 week
Maximum collector current (IC) 0.2 A 0.2 A
Collector-emitter maximum voltage 15 V 15 V
Configuration SINGLE SINGLE
Minimum DC current gain (hFE) 20 20
JEDEC-95 code TO-236AB TO-236AB
JESD-30 code R-PDSO-G3 R-PDSO-G3
JESD-609 code e3 e3
Humidity sensitivity level 1 1
Number of components 1 1
Number of terminals 3 3
Maximum operating temperature 150 °C 150 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED 260
Polarity/channel type NPN NPN
Maximum power dissipation(Abs) 0.3 W 0.225 W
surface mount YES YES
Terminal surface Tin (Sn) Tin (Sn)
Terminal form GULL WING GULL WING
Terminal location DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED 40
transistor applications SWITCHING SWITCHING
Transistor component materials SILICON SILICON
Maximum off time (toff) 18 ns 18 ns
Maximum opening time (tons) 12 ns 12 ns
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