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MC9S08GB60ACFUE

Description
Freescale 8-bit MCU
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size7MB,302 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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MC9S08GB60ACFUE Overview

Freescale 8-bit MCU

MC9S08GB60ACFUE Parametric

Parameter NameAttribute value
Brand NameFreescale
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeQFP
package instruction10 X 10 MM, 1.40 MM HEIGHT, 0.5 MM PITCH, MS-026BCD, LQFP-64
Contacts64
Reach Compliance Codeunknown
ECCN codeEAR99
Samacsys DescriptionMicrocontrollers
Has ADCYES
Other featuresOPERATES AT 1.8V MINIMUM SUPPLY
Address bus width
bit size8
maximum clock frequency40 MHz
DAC channelNO
DMA channelNO
External data bus width
JESD-30 codeS-PQFP-G64
JESD-609 codee3
length10 mm
Humidity sensitivity level3
Number of I/O lines56
Number of terminals64
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeLFQFP
Encapsulate equivalent codeQFP64,.47SQ,20
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)260
power supply2/3.3 V
Certification statusNot Qualified
RAM (bytes)4096
rom(word)61440
ROM programmabilityFLASH
Maximum seat height1.6 mm
speed40 MHz
Maximum slew rate7.5 mA
Maximum supply voltage3.6 V
Minimum supply voltage2.08 V
Nominal supply voltage3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature40
width10 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER
Base Number Matches1

MC9S08GB60ACFUE Related Products

MC9S08GB60ACFUE MC9S08GT60ACB
Description Freescale 8-bit MCU MICROPROCESSOR, PDIP42, SDIP-42
Is it lead-free? Lead free Contains lead
Is it Rohs certified? conform to incompatible
Maker NXP NXP
Parts packaging code QFP DIP
package instruction 10 X 10 MM, 1.40 MM HEIGHT, 0.5 MM PITCH, MS-026BCD, LQFP-64 SDIP, SDIP42,.6
Contacts 64 42
Reach Compliance Code unknown compliant
bit size 8 8
maximum clock frequency 40 MHz 40 MHz
JESD-30 code S-PQFP-G64 R-PDIP-T42
length 10 mm 36.83 mm
Humidity sensitivity level 3 1
Number of terminals 64 42
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFQFP SDIP
Encapsulate equivalent code QFP64,.47SQ,20 SDIP42,.6
Package shape SQUARE RECTANGULAR
Package form FLATPACK, LOW PROFILE, FINE PITCH IN-LINE, SHRINK PITCH
Peak Reflow Temperature (Celsius) 260 225
power supply 2/3.3 V 2/3.3 V
Certification status Not Qualified Not Qualified
RAM (bytes) 4096 4096
rom(word) 61440 61440
ROM programmability FLASH FLASH
Maximum seat height 1.6 mm 5.08 mm
speed 40 MHz 40 MHz
Maximum slew rate 7.5 mA 7.5 mA
Maximum supply voltage 3.6 V 3.6 V
Minimum supply voltage 2.08 V 1.8 V
Nominal supply voltage 3 V 2 V
surface mount YES NO
technology CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL
Terminal form GULL WING THROUGH-HOLE
Terminal pitch 0.5 mm 1.778 mm
Terminal location QUAD DUAL
Maximum time at peak reflow temperature 40 NOT SPECIFIED
width 10 mm 15.24 mm
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER MICROPROCESSOR
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