Memory interface type: I2C Memory capacity: 1Mb (128K x 8) Working voltage: 2.5V ~ 5.5V Memory type: Non-Volatile 1-Mbit (128K x 8bit), I2C interface, working voltage: 2.5V to 5.5V
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Parts packaging code | SOIC |
package instruction | SOP, SOP8,.25 |
Contacts | 8 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Factory Lead Time | 10 weeks |
Maximum clock frequency (fCLK) | 0.4 MHz |
Data retention time - minimum | 200 |
Durability | 1000000 Write/Erase Cycles |
I2C control byte | 1010DDMR |
JESD-30 code | R-PDSO-G8 |
JESD-609 code | e3 |
length | 4.9 mm |
memory density | 1048576 bit |
Memory IC Type | EEPROM |
memory width | 8 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 8 |
word count | 131072 words |
character code | 128000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 128KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Encapsulate equivalent code | SOP8,.25 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Parallel/Serial | SERIAL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 3/5 V |
Certification status | Not Qualified |
reverse pinout | NO |
Maximum seat height | 1.75 mm |
Serial bus type | I2C |
Maximum standby current | 0.000005 A |
Maximum slew rate | 0.005 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 2.5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Matte Tin (Sn) - annealed |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 40 |
width | 3.9 mm |
Maximum write cycle time (tWC) | 5 ms |
write protect | HARDWARE |
Base Number Matches | 1 |