Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Maxim |
Parts packaging code | DIP |
package instruction | DIP, DIP32,.6 |
Contacts | 32 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.2.A |
Factory Lead Time | 6 weeks |
Is Samacsys | N |
Maximum access time | 70 ns |
JESD-30 code | R-XDIP-P32 |
JESD-609 code | e3 |
length | 43.053 mm |
memory density | 1048576 bit |
Memory IC Type | NON-VOLATILE SRAM MODULE |
memory width | 8 |
Humidity sensitivity level | 1 |
Number of functions | 1 |
Number of terminals | 32 |
word count | 131072 words |
character code | 128000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 128KX8 |
Package body material | UNSPECIFIED |
encapsulated code | DIP |
Encapsulate equivalent code | DIP32,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 10.922 mm |
Maximum standby current | 0.0006 A |
Maximum slew rate | 0.085 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Matte Tin (Sn) |
Terminal form | PIN/PEG |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 15.24 mm |
Base Number Matches | 1 |