Shenzhen Chenda Semiconductor Co., Ltd. (MDD for short) is a national high-tech enterprise focusing on the R&D, design, packaging, testing and sales of semiconductor discrete devices. The company has been deeply involved in the semiconductor field for 16 years, always insisting on product technology as the driving force and customer needs as the core, creating a full range of high-reliability and high-performance product service matrix covering MOSFET, diodes, triodes, rectifier bridges, SiC, etc. The products are widely used in new energy vehicles, industrial control, consumer electronics, communications, home appliances, medical, lighting, security, instrumentation and other fields, serving more than 40 countries and regions around the world. The company adheres to the development concept of keeping pace with the times, based on the current advanced power device design and packaging and testing capabilities, continues to pay attention to the development trends of cutting-edge technologies and application fields, comprehensively promotes product upgrades and iterations, improves the industrialization of power devices and the ability of service closed loop, and provides customers with sustainable, all-round and differentiated one-stop product solutions. Looking to the future, the company will rely on its ability to insight the industry, through the dual-wheel drive of brand and technology, to quickly realize the development vision of "building an international leading brand of semiconductor discrete devices" and help upgrade China's semiconductor industry.
Wouldn't it be better to use the MCU to generate DAC directly through DAC0832? What are the considerations for using DAC chip DAC0832? (Generate two sets of waveforms with positive and negative invers...
The small motor starts with too much current, which resets the microcontroller. What should I do? The current of the small motor is only about 50mA. The two IO ports of the microcontroller are connect...
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C file LCD1602_Driver.c1 /**************Reference header file***************/2 #include msp430F149.h //Depending on the specific MCU model, reference different header files3 #include "LCD1602_Driver.h...
[i=s]This post was last edited by yvonneGan on 2020-2-25 17:30[/i]DesignCon 2020 article interpretation seriesAuthor | Huang Gang (member of YiBo Technology's high-speed team)Fans who are familiar wit...
DENSO Corporation (Headquartered in Kariya, Aichi Prefecture, Japan; President: Shinnosuke Hayashi; hereinafter referred to as “DENSO”) and ROHM Co., Ltd. (Headquartered in Ukyo-ku, Kyoto, Japan;...[Details]
July 16 news, MoneyDJ reported yesterday (July 15) that TSMC has formed a special team to explore a new packaging solution for fan-out panel-level packaging (FOPLP), and plans to build a small pilo...[Details]
Today (January 28), SK Hynix released its financial report for the fiscal year 2021 and the fourth quarter ending December 31, 2021. The company's combined revenue for fiscal year 2021 was 42.998 tr...[Details]
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Qualcomm is preparing to re-enter the server processor market, reducing its reliance on smartphones by tapping into a potential $28 billion market, according to people familiar with the chipmaker's p...[Details]
According to the electronic document information system on the official website of the U.S. International Trade Commission (ITC), the ITC has received complaints about Samsung Electronics, Qualcomm a...[Details]
On August 6, Taiwan media Electronic Times quoted IC (integrated circuit) design industry insiders as saying that TSMC had notified several customers in late July that the prices of the two advance...[Details]
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Report on October 22 According to a report on the US "Wall Street Journal" website on October 19, the world's largest contract chip manufacturer believes that a turnaround in the semiconductor market...[Details]
Recently, 5G SoC chips have been launched one after another. Their appearance will bring new opportunities for process and packaging. Here we comment on them: In the 5G era, the most advanced...[Details]
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Mobile device cameras are the main growth contributor to the CIS market until 2019,” asserts Pierre Cambou, Principal Analyst for Imaging at Yole Développement (Yole). “But in 2020, this is no lon...[Details]
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