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TSM036N03PQ56 RLG

Description
MOSFET Power MOSFET, N-CHAN 30V, 95A, 3.6mOhm
Categorysemiconductor    Discrete semiconductor    The transistor    MOSFET   
File Size357KB,7 Pages
ManufacturerTaiwan Semiconductor
Websitehttp://www.taiwansemi.com/
Environmental Compliance
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TSM036N03PQ56 RLG Overview

MOSFET Power MOSFET, N-CHAN 30V, 95A, 3.6mOhm

TSM036N03PQ56 RLG Parametric

Parameter NameAttribute value
MakerTaiwan Semiconductor
Product CategoryMOSFET
technologySi
Installation styleSMD/SMT
Package/boxPDFN-56-8
Number of channels1 Channel
Transistor polarityN-Channel
Vds - drain-source breakdown voltage30 V
Id-continuous drain current124 A
Rds On - drain-source on-resistance3.6 mOhms
Vgs th-gate-source threshold voltage1.2 V
Vgs - gate-source voltage20 V
Qg-gate charge50 nC
Minimum operating temperature- 55 C
Maximum operating temperature+ 150 C
Pd-power dissipation83 W
ConfigurationSingle
channel modeEnhancement
EncapsulationCut Tape
EncapsulationMouseReel
EncapsulationReel
seriesTSM
Forward transconductance - minimum44 S
Fall time10.6 ns
Rise Time10.4 ns
Factory packaging quantity2500
Typical shutdown delay time25.2 ns
Typical switch-on delay time4.8 ns
TSM036N03PQ56
Taiwan Semiconductor
N-Channel Power MOSFET
30V, 124A, 3.6mΩ
FEATURES
● Low R
DS(ON)
to minimize conductive losses
● Low gate charge for fast power switching
● 100% UIS and R
g
tested
● Compliant to RoHS directive 2011/65/EU and in
accordance to WEEE 2002/96/EC
● Halogen-free according to IEC 61249-2-21
KEY PERFORMANCE PARAMETERS
PARAMETER
V
DS
R
DS(on)
(max)
Q
g
V
GS
= 10V
V
GS
= 4.5V
VALUE
30
3.6
5.5
25
nC
UNIT
V
APPLICATIONS
● DC-DC Converters
● Battery Power Management
● ORing FET/Load Switch
PDFN56
Note:
MSL 1 (Moisture Sensitivity Level) per J-STD-020
ABSOLUTE MAXIMUM RATINGS
(T
A
= 25°C unless otherwise noted)
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
Single Pulse Avalanche Current
(Note 2)
Single Pulse Avalanche Energy
Total Power Dissipation
Total Power Dissipation
(Note 2)
(Note 1)
SYMBOL
V
DS
V
GS
T
C
= 25°C
T
A
= 25°C
I
D
I
DM
I
AS
E
AS
T
C
= 25°C
T
C
= 125°C
T
A
= 25°C
T
A
= 125°C
P
D
P
D
T
J
, T
STG
LIMIT
30
±20
124
22
496
27
109
83
17
2.6
0.5
- 55 to +150
UNIT
V
V
A
A
A
mJ
W
W
°C
Operating Junction and Storage Temperature Range
THERMAL PERFORMANCE
PARAMETER
Junction to Case Thermal Resistance
Junction to Ambient Thermal Resistance
SYMBOL
R
ӨJC
R
ӨJA
LIMIT
1.5
48
UNIT
°C/W
°C/W
Thermal Performance Note:
R
ӨJA
is the sum of the junction-to-case and case-to-ambient thermal resistances. The case-
thermal reference is defined at the solder mounting surface of the drain pins. R
ӨJA
is guaranteed by design while R
ӨCA
is
determined by the user’s board design.
1
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