MT41K256M16TW-107:P TR datasheet, PDF

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MT41K256M16TW-107:P TR: DescriptionDynamic Random Access Memory DDR3 4G 256MX16 FBGA; Categorysemiconductor Memory IC Dynamic random access memory; File Size3MB，219 Pages; ManufacturerMicron; Websitehttp://www.micron.com/; Environmental Compliance

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MT41K256M16TW-107:P TR Overview

Dynamic Random Access Memory DDR3 4G 256MX16 FBGA

MT41K256M16TW-107:P TR Parametric

Parameter Name	Attribute value
Maker	Micron
Product Category	dynamic random access memory
type	SDRAM - DDR3L
Data bus width	16 bit
organize	256 M x 16
Package/box	FBGA-96
storage	4 Gbit
maximum clock frequency	933 MHz
Supply voltage - max.	1.45 V
Supply voltage - min.	1.283 V
Supply current—max.	91 mA
Minimum operating temperature	0 C
Maximum operating temperature	+ 95 C
series	MT41K
Encapsulation	Cut Tape
Encapsulation	MouseReel
Encapsulation	Reel
Installation style	SMD/SMT
Factory packaging quantity	2000

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4Gb: x4, x8, x16 DDR3L SDRAM

Description

DDR3L SDRAM

MT41K1G4 – 128 Meg x 4 x 8 banks

MT41K512M8 – 64 Meg x 8 x 8 banks

MT41K256M16 – 32 Meg x 16 x 8 banks

Description

DDR3L SDRAM (1.35V) is a low voltage version of the

DDR3 (1.5V) SDRAM. Refer to DDR3 (1.5V) SDRAM

(Die Rev :E) data sheet specifications when running in

1.5V compatible mode.

•

Self refresh temperature (SRT)

Automatic self refresh (ASR)

Write leveling

Multipurpose register

Output driver calibration

Features

• V

= V

DDQ

= 1.35V (1.283–1.45V)

• Backward compatible to V

= V

DDQ

= 1.5V ±0.075V

– Supports DDR3L devices to be backward com-

patible in 1.5V applications

• Differential bidirectional data strobe

• 8n-bit prefetch architecture

• Differential clock inputs (CK, CK#)

• 8 internal banks

• Nominal and dynamic on-die termination (ODT)

for data, strobe, and mask signals

• Programmable CAS (READ) latency (CL)

• Programmable posted CAS additive latency (AL)

• Programmable CAS (WRITE) latency (CWL)

• Fixed burst length (BL) of 8 and burst chop (BC) of 4

(via the mode register set [MRS])

• Selectable BC4 or BL8 on-the-fly (OTF)

• Self refresh mode

• T

of 105°C

– 64ms, 8192-cycle refresh up to 85°C

– 32ms, 8192-cycle refresh at >85°C to 95°C

– 16ms, 8192-cycle refresh at >95°C to 105°C

Options

• Configuration

– 1 Gig x 4

– 512 Meg x 8

– 256 Meg x 16

• FBGA package (Pb-free) – x4, x8

– 78-ball (9mm x 10.5mm) Rev. E

– 78-ball (7.5mm x 10.6mm) Rev. N

– 78-ball (8mm x 10.5mm) Rev. P

• FBGA package (Pb-free) – x16

– 96-ball (9mm x 14mm) Rev. E

– 96-ball (7.5mm x 13.5mm) Rev. N

– 96-ball (8mm x 14mm) Rev. P

• Timing – cycle time

– 938ps @ CL = 14 (DDR3-2133)

– 1.07ns @ CL = 13 (DDR3-1866)

– 1.25ns @ CL = 11 (DDR3-1600)

• Operating temperature

– Commercial (0°C T

+95°C)

– Industrial (–40°C T

+95°C)

– Automotive (–40°C T

+105°C)

• Revision

Marking

1G4

512M8

256M16

-093

-107

-125

None

:E/:N/:P

Table 1: Key Timing Parameters

Speed Grade

-093

1, 2

-107

-125

Notes:

Data Rate (MT/s)

2133

1866

1600

Target

RCD-

RP-CL

14-14-14

13-13-13

11-11-11

RCD

(ns)

CL (ns)

13.09

13.91

13.75

13.09

13.91

13.75

13.09

13.91

13.75

1. Backward compatible to 1600, CL = 11 (-125).

2. Backward compatible to 1866, CL = 13 (-107).

09005aef85af8fa8

4Gb_DDR3L.pdf - Rev. R 09/18 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Products and specifications discussed herein are subject to change by Micron without notice.

4Gb: x4, x8, x16 DDR3L SDRAM

Description

Contents

Important Notes and Warnings ....................................................................................................................... 11

State Diagram ................................................................................................................................................ 12

Functional Description ................................................................................................................................... 13

Industrial Temperature ............................................................................................................................... 13

Automotive Temperature ............................................................................................................................ 13

General Notes ............................................................................................................................................ 14

Functional Block Diagrams ............................................................................................................................. 15

Ball Assignments and Descriptions ................................................................................................................. 17

Package Dimensions ....................................................................................................................................... 23

Electrical Specifications .................................................................................................................................. 29

Absolute Ratings ......................................................................................................................................... 29

Input/Output Capacitance .......................................................................................................................... 30

Thermal Characteristics .................................................................................................................................. 31

Electrical Specifications – I

Specifications and Conditions ............................................................................ 33

Electrical Characteristics – Operating I

Specifications .................................................................................. 44

Electrical Specifications – DC and AC .............................................................................................................. 49

DC Operating Conditions ........................................................................................................................... 49

Input Operating Conditions ........................................................................................................................ 50

DDR3L 1.35V AC Overshoot/Undershoot Specification ................................................................................ 54

DDR3L 1.35V Slew Rate Definitions for Single-Ended Input Signals .............................................................. 57

DDR3L 1.35V Slew Rate Definitions for Differential Input Signals ................................................................. 59

ODT Characteristics ....................................................................................................................................... 60

1.35V ODT Resistors ................................................................................................................................... 61

ODT Sensitivity .......................................................................................................................................... 62

ODT Timing Definitions ............................................................................................................................. 62

Output Driver Impedance ............................................................................................................................... 66

34 Ohm Output Driver Impedance .............................................................................................................. 67

DDR3L 34 Ohm Driver ................................................................................................................................ 68

DDR3L 34 Ohm Output Driver Sensitivity .................................................................................................... 69

DDR3L Alternative 40 Ohm Driver ............................................................................................................... 70

DDR3L 40 Ohm Output Driver Sensitivity .................................................................................................... 70

Output Characteristics and Operating Conditions ............................................................................................ 72

Reference Output Load ............................................................................................................................... 75

Slew Rate Definitions for Single-Ended Output Signals ................................................................................. 75

Slew Rate Definitions for Differential Output Signals .................................................................................... 77

Speed Bin Tables ............................................................................................................................................ 78

Electrical Characteristics and AC Operating Conditions ................................................................................... 83

Command and Address Setup, Hold, and Derating .......................................................................................... 103

Data Setup, Hold, and Derating ...................................................................................................................... 110

Commands – Truth Tables ............................................................................................................................. 118

Commands ................................................................................................................................................... 121

DESELECT ................................................................................................................................................ 121

NO OPERATION ........................................................................................................................................ 121

ZQ CALIBRATION LONG ........................................................................................................................... 121

ZQ CALIBRATION SHORT .......................................................................................................................... 121

ACTIVATE ................................................................................................................................................. 121

READ ........................................................................................................................................................ 121

WRITE ...................................................................................................................................................... 122

PRECHARGE ............................................................................................................................................. 123

REFRESH .................................................................................................................................................. 123

09005aef85af8fa8

4Gb_DDR3L.pdf - Rev. R 09/18 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

4Gb: x4, x8, x16 DDR3L SDRAM

Description

SELF REFRESH .......................................................................................................................................... 124

DLL Disable Mode ..................................................................................................................................... 125

Input Clock Frequency Change ...................................................................................................................... 129

Write Leveling ............................................................................................................................................... 131

Write Leveling Procedure ........................................................................................................................... 133

Write Leveling Mode Exit Procedure ........................................................................................................... 135

Initialization ................................................................................................................................................. 136

Voltage Initialization/Change ........................................................................................................................ 138

Voltage Switching ............................................................................................................................... 139

Mode Registers .............................................................................................................................................. 140

Mode Register 0 (MR0) ................................................................................................................................... 141

Burst Length ............................................................................................................................................. 141

Burst Type ................................................................................................................................................. 142

DLL RESET ................................................................................................................................................ 143

Write Recovery .......................................................................................................................................... 144

Precharge Power-Down (Precharge PD) ...................................................................................................... 144

CAS Latency (CL) ....................................................................................................................................... 144

Mode Register 1 (MR1) ................................................................................................................................... 146

DLL Enable/DLL Disable ........................................................................................................................... 146

Output Drive Strength ............................................................................................................................... 147

OUTPUT ENABLE/DISABLE ...................................................................................................................... 147

TDQS Enable ............................................................................................................................................. 147

On-Die Termination .................................................................................................................................. 148

WRITE LEVELING ..................................................................................................................................... 148

POSTED CAS ADDITIVE Latency ................................................................................................................ 148

Mode Register 2 (MR2) ................................................................................................................................... 149

CAS Write Latency (CWL) ........................................................................................................................... 150

AUTO SELF REFRESH (ASR) ....................................................................................................................... 150

SELF REFRESH TEMPERATURE (SRT) ........................................................................................................ 150

SRT vs. ASR ............................................................................................................................................... 151

DYNAMIC ODT ......................................................................................................................................... 151

Mode Register 3 (MR3) ................................................................................................................................... 151

MULTIPURPOSE REGISTER (MPR) ............................................................................................................ 152

MPR Functional Description ...................................................................................................................... 153

MPR Register Address Definitions and Bursting Order ................................................................................. 154

MPR Read Predefined Pattern .................................................................................................................... 159

MODE REGISTER SET (MRS) Command ........................................................................................................ 159

ZQ CALIBRATION Operation ......................................................................................................................... 160

ACTIVATE Operation ..................................................................................................................................... 161

READ Operation ............................................................................................................................................ 163

WRITE Operation .......................................................................................................................................... 174

DQ Input Timing ....................................................................................................................................... 182

PRECHARGE Operation ................................................................................................................................. 184

SELF REFRESH Operation .............................................................................................................................. 184

Extended Temperature Usage ........................................................................................................................ 186

Power-Down Mode ........................................................................................................................................ 187

RESET Operation ........................................................................................................................................... 195

On-Die Termination (ODT) ............................................................................................................................ 197

Functional Representation of ODT ............................................................................................................. 197

Nominal ODT ............................................................................................................................................ 197

Dynamic ODT ............................................................................................................................................... 199

Dynamic ODT Special Use Case ................................................................................................................. 199

09005aef85af8fa8

4Gb_DDR3L.pdf - Rev. R 09/18 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

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