High Efficiency VIOLET LED Emitter
LZ1-00UB00
Key Features
High Efficiency VIOLET (385-410nm) LED emitter
Ultra-small foot print – 4.4mm x 4.4mm
Surface mount ceramic package with integrated glass lens
Very low Thermal Resistance (4.2°C/W)
Electrically neutral thermal path
Very high Radiant Flux density
JEDEC Level 1 for Moisture Sensitivity Level
Lead (Pb) free and RoHS compliant
Emitter available on Star MCPCB (optional)
Typical Applications
Ink and adhesive curing
Dental Curing and Teeth Whitening
Counterfeit Identification
Leakage Detection
Sterilization and Medical
DNA Gel
Description
The LZ1-00UB00 VIOLET LED emitter provides superior radiometric power in the wavelength range specifically
required for sterilization, dental curing lights, and numerous medical applications. With a 4.4mm x 4.4mm ultra-
small footprint, this package provides exceptional optical power density. The radiometric power performance and
optimal peak wavelength of this LED are matched to the response curves of dental resins, inks and adhesives,
resulting in a significantly reduced curing time. The patented design has unparalleled thermal and optical
performance. The high quality materials used in the package are chosen to optimize light output, have excellent
VIOLET resistance, and minimize stresses which results in monumental reliability and radiant flux maintenance.
UV RADIATION
Avoid exposure to the beam
Wear protective eyewear
COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED.
LZ1-00UB00 (2.1 – 11/20/2018)
LED Engin
|
651 River Oaks Parkway
|
San Jose, CA 95134 USA
|
ph
+1 408 922 7200
|
em
LEDE-Sales@osram.com
|
www.osram.us/ledengin
Part number options
Base part number
Part number
LZ1-00UB00-xxxx
LZ1-10UB00-xxxx
Description
LZ1 emitter
LZ1 emitter on Standard Star MCPCB
Bin kit option codes
Single wavelength bin (5nm range)
Kit number suffix
01U4*
01U5*
01U6*
01U7*
01U8*
Min flux Bin
Ma
Ma
Ma
Lb
Lb
Color Bin Range
U4
U5
U6
U7
U8
Description
Ma minimum flux; wavelength U4 bin only
Ma minimum flux; wavelength U5 bin only
Ma minimum flux; wavelength U6 bin only
Lb minimum flux; wavelength U7 bin only
Lb minimum flux; wavelength U8 bin only
* Previous version was -00Ux, please refer to Mechanical Dimensions section on p.6, PCN 54-2 and 55 for more details.
COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED.
2
LZ1-00UB00 (2.1 – 11/20/18)
LED Engin
|
651 River Oaks Parkway
|
San Jose, CA 95134 USA
|
ph
+1 408 922 7200
|
em
LEDE-Sales@osram.com
|
www.osram.us/ledengin
Radiant Flux Bins
Table 1:
Bin Code
Minimum
Radiant Flux
(Φ)
@ I
F
= 700mA
[1,2]
(mW)
900
1000
1100
1200
1300
1400
1500
Maximum
Radiant Flux
(Φ)
@ I
F
= 700mA
[1,2]
(mW)
1000
1100
1200
1300
1400
1500
1600
Lb
Ma
Mb
Mc
Na
Nb
Nc
Notes for Table 1:
o
1.
Radiant flux performance is measured at specified current, 10ms pulse width, Tc = 25 C. LED Engin maintains a tolerance of ± 10% on flux measurements.
Peak Wavelength Bins
Table 2:
Bin Code
Minimum
Peak Wavelength (λ
P
)
@ I
F
= 700mA
[1]
(nm)
385
390
395
400
405
Maximum
Peak Wavelength (λ
P
)
@ I
F
= 700mA
[1]
(nm)
390
395
400
405
410
U4
U5
U6
U7
U8
Notes for Table 2:
o
1.
Peak wavelength is measured at specified current, 10ms pulse width, Tc=25 C. LED Engin maintains a tolerance of ± 2.0nm on peak wavelength
measurements.
Forward Voltage Bins
Table 3:
Bin Code
Minimum
Forward Voltage (V
F
)
@ I
F
= 700mA
[1]
(V)
3.20
Maximum
Forward Voltage (V
F
)
@ I
F
= 700mA
[1]
(V)
4.20
0
Notes for Table 3:
o
1.
Forward voltage is measured at specified current, 10ms pulse width, Tc=25 C. LED Engin maintains a tolerance of ± 0.04V for forward voltage measurements.
COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED.
3
LZ1-00UB00 (2.1 – 11/20/18)
LED Engin
|
651 River Oaks Parkway
|
San Jose, CA 95134 USA
|
ph
+1 408 922 7200
|
em
LEDE-Sales@osram.com
|
www.osram.us/ledengin
Absolute Maximum Ratings
Table 4:
Parameter
DC Forward Current
[1]
Peak Pulsed Forward Current
Reverse Voltage
Storage Temperature
Junction Temperature
Soldering Temperature
[4]
[2]
Symbol
I
F
I
FP
V
R
T
stg
T
J
T
sol
Value
1000
1000
See Note 3
-40 ~ +150
130
260
Unit
mA
mA
V
°C
°C
°C
Notes for Table 4:
1.
Maximum DC forward current is determined by the overall thermal resistance and ambient temperature.
Follow the curves in Figure 11 for current derating.
2:
Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%.
3.
LEDs are not designed to be reverse biased.
4.
Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 3
5.
LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZ1-00UB00 in an electrostatic protected area (EPA).
An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1.
Optical Characteristics @ T
C
= 25°C
Table 5:
Parameter
Radiant Flux (@ I
F
= 700mA)
Radiant Flux (@ I
F
= 1000mA)
Peak Wavelength
Viewing Angle
[1]
Symbol
Φ
Φ
λ
P
2Θ
1/2
[3]
Typical
385-390nm
1150
1570
385
390-400nm
1150
1570
395
68
100
400-410nm
1050
1430
405
Unit
mW
mW
nm
Degrees
Degrees
[2]
Total Included Angle
Θ
0.9V
Notes for Table 5:
1.
When operating the VIOLET LED, observe safety precaution given in IEC 62471 Risk Group 3. Avoid eye and skin exposure to unshielded product.
2.
Viewing Angle is the off axis angle from emitter centerline where the radiometric power is ½ of the peak value.
3.
Total Included Angle is the total angle that includes 90% of the total radiant flux.
Electrical Characteristics @ T
C
= 25°C
Table 6:
Parameter
Forward Voltage (@ I
F
= 700mA)
Forward Voltage (@ I
F
= 1000mA)
Temperature Coefficient
of Forward Voltage
Thermal Resistance
(Junction to Case)
Symbol
V
F
V
F
ΔV
F
/ΔT
J
RΘ
J-C
Typical
3.7
3.9
-2.2
4.2
Unit
V
V
mV/°C
°C/W
COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED.
4
LZ1-00UB00 (2.1 – 11/20/18)
LED Engin
|
651 River Oaks Parkway
|
San Jose, CA 95134 USA
|
ph
+1 408 922 7200
|
em
LEDE-Sales@osram.com
|
www.osram.us/ledengin
IPC/JEDEC Moisture Sensitivity Level
Table 7 - IPC/JEDEC J-STD-20D.1 MSL Classification:
Soak Requirements
Floor Life
Level
1
Time
Unlimited
Conditions
≤ 30°C/
85% RH
168
+5/-0
Standard
Time (hrs)
Conditions
85°C/
85% RH
Accelerated
Time (hrs)
n/a
Conditions
n/a
Notes for Table 7:
1.
The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag and the
floor life of maximum time allowed out of the bag at the end user of distributor’s facility.
COPYRIGHT © 2018 LED ENGIN. ALL RIGHTS RESERVED.
5
LZ1-00UB00 (2.1 – 11/20/18)
LED Engin
|
651 River Oaks Parkway
|
San Jose, CA 95134 USA
|
ph
+1 408 922 7200
|
em
LEDE-Sales@osram.com
|
www.osram.us/ledengin
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