Static random access memory 1.2/1.5V 4M x 18 72M
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | GSI Technology |
| package instruction | HBGA, |
| Reach Compliance Code | compliant |
| ECCN code | 3A991.B.2.B |
| Factory Lead Time | 12 weeks |
| Maximum access time | 0.4 ns |
| JESD-30 code | R-PBGA-B260 |
| length | 22 mm |
| memory density | 75497472 bit |
| Memory IC Type | DDR SRAM |
| memory width | 18 |
| Number of functions | 1 |
| Number of terminals | 260 |
| word count | 4194304 words |
| character code | 4000000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | |
| organize | 4MX18 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | HBGA |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, HEAT SINK/SLUG |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Maximum seat height | 2.3 mm |
| Maximum supply voltage (Vsup) | 1.4 V |
| Minimum supply voltage (Vsup) | 1.3 V |
| Nominal supply voltage (Vsup) | 1.35 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | OTHER |
| Terminal form | BALL |
| Terminal pitch | 1 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 14 mm |
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