MTCH6102T-I/MV datasheet, PDF - EEWORLD Datasheet

MTCH6102T-I/MV: DescriptionCapacitive Touch SensorLow Power Projected Cap Touch Controller; CategoryThe embedded processor and controller Microcontrollers and processors; File Size887KB，46 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com; Environmental Compliance

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MTCH6102T-I/MV Overview

Capacitive Touch SensorLow Power Projected Cap Touch Controller

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Microchip
package instruction	5.30 MM, PLASTIC, SSOP-28
Reach Compliance Code	compliant
Factory Lead Time	13 weeks
JESD-30 code	R-PDSO-G28
JESD-609 code	e3
length	10.2 mm
Humidity sensitivity level	1
Number of terminals	28
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	HSSOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260
Maximum seat height	2 mm
Maximum supply voltage	3.6 V
Minimum supply voltage	1.8 V
Nominal supply voltage	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn) - annealed
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
width	5.3 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT

	MTCH6102T-I/MV	MTCH6102-I/SS
Description	Capacitive Touch SensorLow Power Projected Cap Touch Controller	Capacitive Touch SensorLow Power Projected Cap Touch Controller
Is it Rohs certified?	conform to	conform to
Maker	Microchip	Microchip
package instruction	5.30 MM, PLASTIC, SSOP-28	4 X 4 MM, 0.50 MM HEIGHT, PLASTIC, QFN-28
Reach Compliance Code	compliant	compliant
Factory Lead Time	13 weeks	20 weeks
JESD-30 code	R-PDSO-G28	S-PQCC-N28
JESD-609 code	e3	e3
length	10.2 mm	4 mm
Humidity sensitivity level	1	2
Number of terminals	28	28
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HSSOP	VQCCN
Package shape	RECTANGULAR	SQUARE
Package form	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	CHIP CARRIER, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260	260
Maximum seat height	2 mm	0.55 mm
Maximum supply voltage	3.6 V	3.6 V
Minimum supply voltage	1.8 V	1.8 V
Nominal supply voltage	3 V	3 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal surface	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed
Terminal form	GULL WING	NO LEAD
Terminal pitch	0.65 mm	0.4 mm
Terminal location	DUAL	QUAD
Maximum time at peak reflow temperature	40	40
width	5.3 mm	4 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT

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