S71PL254JC0BAWTZ2 datasheet, PDF

S71PL254JC0BAWTZ2: DescriptionBased MCPs; Categorystorage storage; File Size285KB，24 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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S71PL254JC0BAWTZ2 Overview

Based MCPs

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SPANSION
Parts packaging code	BGA
package instruction	LFBGA, BGA84,10X12,32
Contacts	84
Reach Compliance Code	compli
Is Samacsys	N
Maximum access time	65 ns
Other features	PSRAM IS ORGANIZED AS 4M X 16
JESD-30 code	R-PBGA-B84
length	11.6 mm
memory density	268435456 bi
Memory IC Type	MEMORY CIRCUIT
memory width	16
Mixed memory types	FLASH+PSRAM
Number of functions	1
Number of terminals	84
word count	16777216 words
character code	16000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
organize	16MX16
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Encapsulate equivalent code	BGA84,10X12,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3 V
Certification status	Not Qualified
Maximum seat height	1.4 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL EXTENDED
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	8 mm
Base Number Matches	1

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