GS81302T07GE-300I datasheet, PDF

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GS81302T07GE-300I: DescriptionStatic random access memory 1.8 or 1.5V 16M x 8 144M; Categorystorage storage; File Size2MB，31 Pages; ManufacturerGSI Technology; Websitehttp://www.gsitechnology.com/; Environmental Compliance

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GS81302T07GE-300I Overview

Static random access memory 1.8 or 1.5V 16M x 8 144M

GS81302T07GE-300I Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	GSI Technology
Parts packaging code	BGA
package instruction	LBGA,
Contacts	165
Reach Compliance Code	compliant
ECCN code	3A991.B.2.B
Factory Lead Time	12 weeks
Maximum access time	0.45 ns
Other features	PIPELINED ARCHITECTURE
JESD-30 code	R-PBGA-B165
JESD-609 code	e1
length	17 mm
memory density	134217728 bit
Memory IC Type	DDR SRAM
memory width	8
Humidity sensitivity level	3
Number of functions	1
Number of terminals	165
word count	16777216 words
character code	16000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	16MX8
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	1.5 mm
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15 mm

GS81302T07GE-300I Related Products

	GS81302T07GE-300I	GS81302T10E-300I	GS81302T07E-300	GS81302T10GE-300	GS81302T19E-350	GS81302T19GE-300
Description	Static random access memory 1.8 or 1.5V 16M x 8 144M	Static random access memory 1.8 or 1.5V 16M x 9 144M	Static random access memory 1.8 or 1.5V 16M x 8 144M	Static random access memory 1.8 or 1.5V 16M x 9 144M	Static random access memory 1.8 or 1.5V 8M x 18 144M	Static random access memory 1.8 or 1.5V 8M x 18 144M
Is it lead-free?	Lead free	Contains lead	Contains lead	Lead free	Contains lead	Lead free
Is it Rohs certified?	conform to	incompatible	incompatible	conform to	incompatible	conform to
Maker	GSI Technology	GSI Technology	GSI Technology	GSI Technology	GSI Technology	GSI Technology
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	LBGA,	LBGA,	LBGA,	LBGA,	LBGA,	LBGA,
Contacts	165	165	165	165	165	165
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B
Maximum access time	0.45 ns	0.45 ns	0.45 ns	0.45 ns	0.45 ns	0.45 ns
Other features	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
JESD-30 code	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165
length	17 mm	17 mm	17 mm	17 mm	17 mm	17 mm
memory density	134217728 bit	150994944 bit	134217728 bit	150994944 bit	75497472 bit	75497472 bit
Memory IC Type	DDR SRAM	DDR SRAM	DDR SRAM	DDR SRAM	DDR SRAM	DDR SRAM
memory width	8	9	8	9	18	18
Number of functions	1	1	1	1	1	1
Number of terminals	165	165	165	165	165	165
word count	16777216 words	16777216 words	16777216 words	16777216 words	4194304 words	4194304 words
character code	16000000	16000000	16000000	16000000	4000000	4000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	70 °C	70 °C	70 °C	70 °C
organize	16MX8	16MX9	16MX8	16MX9	4MX18	4MX18
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LBGA	LBGA	LBGA	LBGA	LBGA	LBGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	260	NOT SPECIFIED	NOT SPECIFIED	260	NOT SPECIFIED	260
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.5 mm	1.5 mm	1.5 mm	1.5 mm	1.5 mm	1.5 mm
Maximum supply voltage (Vsup)	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V
Minimum supply voltage (Vsup)	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	15 mm	15 mm	15 mm	15 mm	15 mm	15 mm
Factory Lead Time	12 weeks	12 weeks	12 weeks	12 weeks	12 weeks	-

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