TMS32C6711DGDPA167 datasheet, PDF

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TMS32C6711DGDPA167: DescriptionFloating-Point Digital Signal Processors 272-BGA -40 to 105; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，109 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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TMS32C6711DGDPA167 Overview

Floating-Point Digital Signal Processors 272-BGA -40 to 105

TMS32C6711DGDPA167 Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	BGA, BGA272,20X20,50
Contacts	272
Reach Compliance Code	not_compliant
ECCN code	3A991.A.2
Factory Lead Time	1 week
Other features	ALSO REQUIRES 3.3V SUPPLY
Address bus width	22
barrel shifter	NO
bit size	32
boundary scan	YES
maximum clock frequency	167 MHz
External data bus width	32
Format	FLOATING POINT
Integrated cache	YES
Internal bus architecture	MULTIPLE
JESD-30 code	S-PBGA-B272
JESD-609 code	e0
length	27 mm
low power mode	YES
Humidity sensitivity level	3
Number of DMA channels	16
Number of external interrupt devices	4
Number of terminals	272
Number of timers	2
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA272,20X20,50
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	220
power supply	1.2,3.3 V
Certification status	Not Qualified
RAM (number of words)	17408
ROM programmability	FLASH
Maximum seat height	2.57 mm
Maximum supply voltage	1.32 V
Minimum supply voltage	1.14 V
Nominal supply voltage	1.2 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	27 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches	1

TMS32C6711DGDPA167 Related Products

	TMS32C6711DGDPA167	TMS320C6711DGDP200	TMS320C6711DGDP250	TMS320C6711DZDP200	TMS320C6711DZDP250	TMS32C6711DZDPA167
Description	Floating-Point Digital Signal Processors 272-BGA -40 to 105	Floating-Point Digital Signal Processors 272-BGA 0 to 90	Floating-Point Digital Signal Processors 272-BGA 0 to 90	Floating-Point Digital Signal Processors 272-BGA 0 to 90	Floating-Point Digital Signal Processors 272-BGA 0 to 90	Floating-Point Digital Signal Processors 272-BGA -40 to 105
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	BGA, BGA272,20X20,50	BGA, BGA272,20X20,50	BGA, BGA272,20X20,50	BGA, BGA272,20X20,50	BGA, BGA272,20X20,50	BGA, BGA272,20X20,50
Contacts	272	272	272	272	272	272
Reach Compliance Code	not_compliant	_compli	_compli	compli	compli	compliant
ECCN code	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2
Factory Lead Time	1 week	1 week	1 week	1 week	1 week	1 week
Other features	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY
Address bus width	22	22	22	22	22	22
barrel shifter	NO	NO	NO	NO	NO	NO
bit size	32	32	32	32	32	32
boundary scan	YES	YES	YES	YES	YES	YES
maximum clock frequency	167 MHz	200 MHz	250 MHz	200 MHz	250 MHz	167 MHz
External data bus width	32	32	32	32	32	32
Format	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
Integrated cache	YES	YES	YES	YES	YES	YES
Internal bus architecture	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE
JESD-30 code	S-PBGA-B272	S-PBGA-B272	S-PBGA-B272	S-PBGA-B272	S-PBGA-B272	S-PBGA-B272
JESD-609 code	e0	e0	e0	e1	e1	e1
length	27 mm	27 mm	27 mm	27 mm	27 mm	27 mm
low power mode	YES	YES	YES	YES	YES	YES
Humidity sensitivity level	3	3	3	3	3	3
Number of DMA channels	16	16	16	16	16	16
Number of external interrupt devices	4	4	4	4	4	4
Number of terminals	272	272	272	272	272	272
Number of timers	2	2	2	2	2	2
Maximum operating temperature	105 °C	90 °C	90 °C	90 °C	90 °C	105 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA	BGA
Encapsulate equivalent code	BGA272,20X20,50	BGA272,20X20,50	BGA272,20X20,50	BGA272,20X20,50	BGA272,20X20,50	BGA272,20X20,50
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	220	220	220	260	260	260
power supply	1.2,3.3 V	1.2,3.3 V	1.4,3.3 V	1.2,3.3 V	1.4,3.3 V	1.2,3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ROM programmability	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
Maximum seat height	2.57 mm	2.57 mm	2.57 mm	2.57 mm	2.57 mm	2.57 mm
Maximum supply voltage	1.32 V	1.32 V	1.47 V	1.32 V	1.47 V	1.32 V
Minimum supply voltage	1.14 V	1.14 V	1.33 V	1.14 V	1.33 V	1.14 V
Nominal supply voltage	1.2 V	1.2 V	1.4 V	1.2 V	1.4 V	1.2 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	OTHER	OTHER	OTHER	OTHER	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	27 mm	27 mm	27 mm	27 mm	27 mm	27 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches	1	1	1	1	1	1
RAM (number of words)	17408	17408	65536	65536	65536	-

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