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LPAF-30-03.0-L-08-1-K-TR

Description
Board-to-Board & Mezzanine Connectors.050" LP Array High-Speed ​​High-Density Low Profile Open-Pin-Field Array, Socket
CategoryThe connector    Surface plate and sandwich connector   
File Size895KB,2 Pages
ManufacturerSAMTEC
Websitehttp://www.samtec.com/
Environmental Compliance
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LPAF-30-03.0-L-08-1-K-TR Overview

Board-to-Board & Mezzanine Connectors.050" LP Array High-Speed ​​High-Density Low Profile Open-Pin-Field Array, Socket

LPAF-30-03.0-L-08-1-K-TR Parametric

Parameter NameAttribute value
MakerSAMTEC
Product CategoryBoard-to-Board and Mezzanine Connectors
Shipping restrictionsMouser does not currently sell this product.
seriesLPAF
EncapsulationReel
Factory packaging quantity350
F-219
LPAF–20–03.5–L–06–2–K
LPAF–20–03.5–L–04–2–K
(1.27 mm) .050"
LPAF SERIES
HIGH-SPEED LOW-PROFILE OPEN-PIN-FIELD
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?LPAF
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
2.3 A per pin
(8 adjacent pins powered)
Working Voltage:
250 VAC
RoHS Compliant:
Yes
Lead-Free Solderable:
Yes
Mates with:
LPAM
Standoffs:
JSO, SO
4, 6 or 8 row standard
.050" (1.27 mm) X
.050" (1.27 mm) pitch
Dual Beam
contact
POWER/SIGNAL
APPLICATION
Solder
crimp
HIGH-SPEED CHANNEL PERFORMANCE
4 mm, 4.5 mm and
5 mm stack heights
LPAM/LPAF @ 5 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
Compatible with
UMPT/UMPS for flexible
two-piece power/signal solutions
LPAF
NO. PINS
PER ROW
LEAD
STYLE
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
K
TR
– TR
ALSO AVAILABLE
(MOQ Required)
• Tin-Lead Solder Charge
• Other pins/row and row counts
• Other Gold plating options
–10, – 20,
– 30, – 40,
– 50
(– 08 rows only)
= (3.0 mm)
.118"
–03.0
–03.5
= (3.5 mm)
.138"
= 10 µ"
(0.25 µm)
Gold on
contact area,
Matte Tin on
solder tail
–L
– 04
=Four
Rows
– 06
=Six
Rows
= Lead-Free
Solder
Crimp
–2
= Polyimide
film Pick &
Place Pad
–K
=Tape &
Reel
MATED HEIGHT
NO. OF
ROWS
–04
–06
=Eight
Rows
LPAF
LPAM
MATED
HEIGHT
– 08
B
(6.71)
.264
(9.25)
.364
(11.79)
.464
MATED HEIGHT*
LPAF
LEAD
STYLE
LPAM LEAD STYLE
–08
No. of positions x
(1.27) .050 + (5.15) .203
(1.27)
.050
–01.0
–01.5
B
–03.0
(4.00) .157 (4.50) .177
–03.5
(4.50) .177 (5.00) .197
*Processing conditions will
affect mated height.
(1.27) .050
(1.27)
.050
(1.32) .052 DIA
A
LEAD
STYLE
–03.0
–03.5
A
(2.79)
.110
(3.30)
.130
Notes:
Patent Pending
Some sizes, styles and
options are non-standard,
non-returnable.
No. of positions x
(1.27) .050 + (3.10) .122
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM

LPAF-30-03.0-L-08-1-K-TR Related Products

LPAF-30-03.0-L-08-1-K-TR LPAF-40-03.0-S-06-2-K-TR LPAF-40-03.5-L-06-2-K-TR LPAF-10-03.0-S-04-2-K-TR LPAF-10-03.5-L-06-2-K-TR LPAF-30-03.5-L-04-2-K-TR
Description Board-to-Board & Mezzanine Connectors.050" LP Array High-Speed ​​High-Density Low Profile Open-Pin-Field Array, Socket Board-to-Board & Mezzanine Connectors.050" LP Array High-Speed ​​High-Density Low Profile Open-Pin-Field Array, Socket Board-to-Board & Mezzanine Connectors.050" LP Array High-Speed ​​High-Density Low Profile Open-Pin-Field Array, Socket Board-to-Board & Mezzanine Connectors.050" LP Array High-Speed ​​High-Density Low Profile Open-Pin-Field Array, Socket Board-to-Board & Mezzanine Connectors.050" LP Array High-Speed ​​High-Density Low Profile Open-Pin-Field Array, Socket Board-to-Board & Mezzanine Connectors.050" LP Array High-Speed ​​High-Density Low Profile Open-Pin-Field Array, Socket
Maker SAMTEC SAMTEC SAMTEC SAMTEC SAMTEC SAMTEC
Product Category Board-to-Board and Mezzanine Connectors Board-to-Board and Mezzanine Connectors Board-to-Board and Mezzanine Connectors Board-to-Board and Mezzanine Connectors - -
Shipping restrictions Mouser does not currently sell this product. Mouser does not currently sell this product. Mouser does not currently sell this product. Mouser does not currently sell this product. - -
series LPAF LPAF LPAF LPAF - -
Encapsulation Reel Reel Reel Reel - -
Factory packaging quantity 350 550 500 700 - -
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