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GS8672D20BGE-450

Description
Static random access memory 1.8 or 1.5V 4M x 18 72M
Categorystorage    storage   
File Size333KB,30 Pages
ManufacturerGSI Technology
Websitehttp://www.gsitechnology.com/
Environmental Compliance
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GS8672D20BGE-450 Overview

Static random access memory 1.8 or 1.5V 4M x 18 72M

GS8672D20BGE-450 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerGSI Technology
Parts packaging codeBGA
package instructionLBGA, BGA165,11X15,40
Contacts165
Reach Compliance Codecompliant
ECCN code3A991.B.2.B
Factory Lead Time12 weeks
Maximum access time0.45 ns
Other featuresPIPELINE ARCHITECTURE
Maximum clock frequency (fCLK)450 MHz
I/O typeSEPARATE
JESD-30 codeR-PBGA-B165
length17 mm
memory density75497472 bit
Memory IC TypeQDR SRAM
memory width18
Number of functions1
Number of terminals165
word count4194304 words
character code4000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize4MX18
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Encapsulate equivalent codeBGA165,11X15,40
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply1.5,1.8 V
Certification statusNot Qualified
Maximum seat height1.5 mm
Minimum standby current1.7 V
Maximum slew rate1.49 mA
Maximum supply voltage (Vsup)1.9 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width15 mm
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