DataSheet
MPF Series
•
SIP SSR
•
Ratings to 4A @ 280 VAC
•
SCR output for heavy industrial loads
•
DC control
•
Zero-crossing (resistive loads) or random-fire (inductive loads) output
PCB Mount
PRODUCT SELECTION
Control Voltage
4-10 VDC
MPF240D4
OUTPUT SPECIFICATIONS
(1)
Description
Operating Voltage (47-63Hz) [Vrms]
Transient Overvoltage [Vpk]
Maximum Off-State Leakage Current @ Rated Voltage [mArms]
Minimum Off-State dv/dt @ Maximum Rated Voltage [V/ sec]
(3)
Maximum Load Current [Arms]
Minimum Load Current [Arms]
Maximum Surge Current (16.6ms) [Apk]
Maximum On-State Voltage Drop @ Rated Current [Vpk]
Minimum Power Factor (with Maximum Load)
INPUT SPECIFICATIONS
(1)
Description
Control Voltage Range
Must Turn On Voltage
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MPF240D4
4-10 VDC
4.0 VDC
1.0 VDC
15 mAdc
300 Ohm
1/2 Cycle
1/2 Cycle
bs
Must Turn Off Voltage
Typical Input Current @ 5 VDC
Nominal Input Impedance
Maximum Turn-On Time [msec]
Maximum Turn-Off Time [msec]
GENERAL SPECIFICATIONS
Description
O
Maximum Capacitance, Input/Output
Ambient Operating Temperature Range
Ambient Storage Temperature Range
Weight (typical)
Encapsulation
Dielectric Strength, Input/Output/Base (50/60Hz)(2)
Minimum Insulation Resistance (@ 500 VDC)(2)
GENERAL NOTES
(1)
All parameters at 25°C unless otherwise specified.
(2)
Dialectric and insulation resistence are measured between input and output.
(3)
Off-State dv/dt test method per EIA/NARM standard RS-443
Do not forget to visit us at:
www.crydom.com
Copyright © 2017 Crydom Inc. Specifications subject to change without notice.
et
Zero-crossing
MPF240D4
12-280
600
0.1
500
4
0.1
40
1.5
0.5
e
Random Fire
MPF240D4R
MPF240D4R
12-280
600
0.1
500
4
0.1
40
1.5
0.5
MPF240D4R
4-10 VDC
4.0 VDC
1.0 VDC
15 mAdc
300 Ohm
0.1
1/2 Cycle
Parameter
4000 Vrms
10
9
Ohm
8 pF
-40 to 80°C
-40 to 125°C
0.7 oz.(20g)
Thermally Conductive Epoxy
DataSheet
DANGER / PELIGRO / DANGER /GEFAHR / PERICOLO /
危险
HAZARD OF
ELECTRIC
SHOCK,
EXPLOSION,
OR ARC FLASH.
•
Disconnect all
power before
installing or
working with
this equipment.
•
Verify all
connections
and replace all
covers before
turning on
power.
Failure to follow
these
instructions will
result in death
or serious injury.
PCB Mount
RIESGO DE
DESCARGA
ELECTRICA O
EXPLOSION.
•
Desconectar
todos los
suministros de
energia a este
equipo antes
de trabajar
con este equipo.
•
Verificar todas
las conexiones
y colocar todas
las tapas antes
de energizer
el equipo.
El
incumplimiento
de estas
instrucciones
puede provocar
la muerte o
lesiones serias.
RISQUE DE
DESCHARGE
ELECTRIQUE
OU EXPLOSION
•
Eteindre
toutes les
sources
d'énergie de
cet appareil
avant de
travailler
dessus de cet
appareil
GEFAHR EINES
ELEKTRISCHE
N SCHLAGES
ODER EINER
EXPLOSION.
•
Stellen Sie
jeglichen
Strom ab, der
dieses Gerät
versorgt, bevor
Sie an dem
Gerät Arbeiten
durchführen
•
Vor dem
Drehen auf
Energie alle
Anschlüsse
überprüfen
und alle
Abdeckungen
ersetzen.
RISCHIO DI
SCOSSA
ELETTRICA O
DELL’ESPLOSIONE.
•
Spenga tutta
l'alimentazione
che fornisce
questa
apparecchiatura
prima di lavorare
a questa
apparecchiatura
存在电击、
爆炸或电弧
闪烁危险
•
•
Vérifier tous
connections, et
remettre tous
couverts en
olace avant de
mettre sous
De non-suivi de
ces instructions
provoquera la
mort ou des
lésions sérieuses
sérieuses.
bs
WARNING / AVERTISSEMENT / WARNUNG /ADVERTENCIA / AVVERTENZA /
警告
RISQUE DE DOMMAGE MATERIEL ET DE
SURCHAUFFE DU BOITIER
•
Les panneaux latéraux du produit peuvent être
chauds. Laisser le produit refroidir avant de le
toucher.
•
Respecter les consignes de montage, et
notamment les couples de serrage.
•
Ne pas laisser pénétrer de liquide ni de corps
étrangers à l'intérieur du produit.
GEFAHR VON MATERIALSCHÄDEN UND
GEHÄUSEERHITZUNG
•
Die Seitenwände können heiß sein. Lassen Sie
das Produkt abkühlen, bevor Sie es berühren.
•
Beachten Sie die Montageanweisungen,
•
Führen Sie keine Flüssigkeiten oder
Fremdkörper in das Produkt ein.
RISK OF MATERIAL DAMAGE AND HOT
ENCLOSURE
•
The product's side panels may be hot, allow
the product to cool before touching.
•
Follow proper mounting instructions including
torque values.
•
Do not allow liquids or foreign objects to enter
this product.
O
Le non-respect de cette directive peut entraîner,
Failure to follow these instructions can result in des lésions corporelles graves ou des
serious injury, or equipment damage.
dommages matériels.
RIESGO DE DAÑOS MATERIALES Y DE
SOBRECALENTAMIENTO DE LA UNIDAD
•
Los paneles laterales del producto pueden
estar calientes. Esperar que el producto se
enfríe antes de tocarlo.
•
Respetar las instrucciones de montaje, y en
particular los pares de apretado.
•
No dejar que penetren líquidos o cuerpos
extraños en el producto.
Si no se respetan estas precauciones pueden
producirse graves lesiones, daños materiales.
Do not forget to visit us at:
www.crydom.com
Copyright © 2017 Crydom Inc. Specifications subject to change without notice.
ol
RISCHIO DI DANNI MATERIALI E D'INVOLUCRO
CALDO
•
I pannelli laterali dell'apparecchio possono
scottare; lasciar quindi raffreddare il prodotto
prima di toccarlo.
•
Seguire le istruzioni di montaggio corrette.
•
Non far entrare liquidi o oggetti estranei in questo
apparecchio.
La mancata osservanza di questa precauzione può
causare gravi rischi per l'incolumità personale o
danni alle apparecchiature.
et
Unterlassung
dieser
Anweisungen
können zum
Tode oder zu
schweren
Verletzungen
führen.
L'omissione di
queste istruzioni
provocherà la
morte o
lesioni serie
Die Nichtbeachtung dieser Anweisung kann
Körperverletzung oder Materialschäden
zur Folge haben.
e
•
Verificare tutti
i collegamenti
e sostituire
tutte le coperture
prima
dell’accensione
在操½此设
备之前请先
关闭电源。
若不遵守这些说明，
可½会导致严重的
人身伤害甚至死亡。
材料损坏和高温外壳的危险性
•
产品的一侧面板可½很热，在其冷却前请
不要触碰。
•
遵照正确的安装说明，包括扭矩值。
•
请勿让液½及其他异物进入本产品。
如不½正确执行这些操½说明，
极有可½造成严重人½伤害或者设备的损坏。
DataSheet
ANNEX - ENVIROMENTAL INFORMATION
The environmental information disclosed in this annex including the EIP Pollution logo are in compliance with People’s Republic of China
Electronic Industry Standard SJ/T11364 – 2006, Marking for Control of Pollution Caused by Electronic Information Products.
PCB Mount
Semiconductor die
Solder
附件 - 环保信息
此附件所标示的包括电子信息产品污染图标的环保信息符合中华人民共和½电子行业标准 SJ/T11364 - 2006,
电子信息产品污染控制标识要求。
部件
名称
半导½芯片
焊接点
铅
ol
汞
镉
有毒有害物质或元素
六价铬
多溴联苯
(Cr (VI))
(PBB)
(Hg)
(Cd)
(Pb)
O
Do not forget to visit us at:
www.crydom.com
Copyright © 2017 Crydom Inc. Specifications subject to change without notice.
bs
et
(PBDE)
50
e
多溴二苯醚
Part
Name
Toxic or hazardous Substance and Elements
Lead
(Pb)
Mercury
(Hg)
Cadmium
(Cd)
Hexavalent
Chromium
(Cr (VI))
Polybrominated
biphenyls
(PBB)
Polybrominated
diphenyl ethers
(PBDE)
PCB Design
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