EEWORLDEEWORLDEEWORLD

Part Number

Search

PIC32MX174F256BT-V/MM

Description
IC MCU 32BIT 256KB FLASH
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size447KB,18 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Download Datasheet Download user manual Parametric Compare View All

PIC32MX174F256BT-V/MM Overview

IC MCU 32BIT 256KB FLASH

PIC32MX174F256BT-V/MM Parametric

Parameter NameAttribute value
MakerMicrochip
package instructionQFN-28
Reach Compliance Codecompliant
Factory Lead Time18 weeks
Has ADCYES
Other features12 KB BOOT FLASH MEMORY AVAILABLE
Address bus width
bit size32
maximum clock frequency50 MHz
DAC channelNO
DMA channelYES
External data bus width
JESD-30 codeS-PQCC-N28
length6 mm
Number of I/O lines21
Number of terminals28
On-chip program ROM width8
Maximum operating temperature105 °C
Minimum operating temperature-40 °C
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeHVQCCN
Package shapeSQUARE
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
ROM programmabilityFLASH
Filter levelAEC-Q100; TS 16949
Maximum seat height1 mm
speed72 MHz
Maximum supply voltage3.6 V
Minimum supply voltage2.5 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formNO LEAD
Terminal pitch0.65 mm
Terminal locationQUAD
width6 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER, RISC
Base Number Matches1
PIC32MX1XX/2XX 28/44-PIN XLP
PIC32MX1XX/2XX 28/44-pin XLP Family
Silicon Errata and Data Sheet Clarification
The PIC32MX1XX/2XX 28/44-pin XLP family devices
that you have received conform functionally to the
current Device Data Sheet (DS60001404B), except for
the anomalies described in this document.
The silicon issues discussed in the following pages are
for silicon revisions with the Device and Revision IDs
listed in
Table 1.
The silicon issues are summarized in
Table 2.
The errata described in this document will be
addressed in future revisions of the PIC32MX1XX/
2XX 28/44-pin XLP family silicon.
Note:
This document summarizes all silicon
errata issues from all revisions of silicon,
previous as well as current. Only the
issues indicated in the last column of
Table 2
apply to the current silicon revision
(A1).
For example, to identify the silicon revision level
using MPLAB X IDE in conjunction with a hardware
debugger:
1.
2.
3.
4.
Using the appropriate interface, connect the
device to the hardware debugger.
Open an MPLAB X IDE project.
Configure the MPLAB X IDE project for the
appropriate device and hardware debugger.
Select
Window > Dashboard,
and then click
the
Refresh Debug Tool Status
icon
(
).
The part number and the Device and
Revision ID values appear in the
Output
window.
If you are unable to extract the silicon
revision level, please contact your local
Microchip sales office for assistance.
5.
Note:
Data Sheet clarifications and corrections start on
page
13.
The silicon revision level can be identified using the
current version of MPLAB
®
X IDE and Microchip’s
programmers, debuggers and emulation tools, which
are available at the Microchip corporate web site
(www.microchip.com).
The Device and Revision ID values for the various
PIC32MX1XX/2XX 28/44-pin XLP family silicon
revisions are shown in
Table 1.
TABLE 1:
SILICON DEVREV VALUES
Part Number
Device
ID
(1)
Revision ID for Silicon Revision
(1)
A1
PIC32MX154F128B
PIC32MX174F256B
PIC32MX254F128B
PIC32MX274F256B
PIC32MX154F128D
PIC32MX174F256D
PIC32MX254F128D
PIC32MX274F256D
Note 1:
0x07800053
0x07801053
0x07808053
0x07803053
0x07804053
0x07805053
0x07806053
0x07807053
0x1
Refer to the
“Memory Organization”
and
“Special Features”
chapters in the current Device Data Sheet
(DS60001404B) for a detailed information on Device and Revision IDs for your specific device.
2017-2018 Microchip Technology Inc.
DS80000739C-page 1

PIC32MX174F256BT-V/MM Related Products

PIC32MX174F256BT-V/MM PIC32MX154F128D-I/ML PIC32MX174F256DT-V/ML PIC32MX254F128DT-V/ML PIC32MX174F256B-V/SO PIC32MX174F256BT-I/SO PIC32MX154F128BT-V/SO PIC32MX254F128BT-I/MM PIC32MX174F256DT-I/ML PIC32MX174F256BT-V/SO
Description IC MCU 32BIT 256KB FLASH IC MCU 32BIT 128KB FLASH IC MCU 32BIT 256KB FLASH IC MCU 32BIT 128KB FLASH IC MCU 32BIT 256KB FLASH IC MCU 32BIT 256KB FLASH IC MCU 32BIT 128KB FLASH IC MCU 32BIT 128KB FLASH IC MCU 32BIT 256KB FLASH IC MCU 32BIT 256KB FLASH
speed 72 MHz 72 MHz 72 MHz 72 MHz 72 MHz 72 MHz 72MHz 72MHz 72 MHz 72 MHz
Maker Microchip Microchip Microchip Microchip Microchip Microchip - - Microchip Microchip
package instruction QFN-28 QFN-44 HVQCCN, QFN-44 SOIC-28 SOP, - - HVQCCN, SOIC-28
Reach Compliance Code compliant compliant compliant compliant compliant compliant - - compliant compliant
Factory Lead Time 18 weeks 19 weeks 19 weeks 19 weeks 5 weeks 5 weeks - - 19 weeks 5 weeks
Has ADC YES YES YES YES YES YES - - YES YES
Other features 12 KB BOOT FLASH MEMORY AVAILABLE 12 KB BOOT FLASH MEMORY AVAILABLE 12 KB BOOT FLASH MEMORY AVAILABLE 12 KB BOOT FLASH MEMORY AVAILABLE 12 KB BOOT FLASH MEMORY AVAILABLE 12 KB BOOT FLASH MEMORY AVAILABLE - - 12 KB BOOT FLASH MEMORY AVAILABLE 12 KB BOOT FLASH MEMORY AVAILABLE
bit size 32 32 32 32 32 32 - - 32 32
maximum clock frequency 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz - - 50 MHz 50 MHz
DAC channel NO NO NO NO NO NO - - NO NO
DMA channel YES YES YES YES YES YES - - YES YES
JESD-30 code S-PQCC-N28 S-PQCC-N44 S-PQCC-N44 S-PQCC-N44 R-PDSO-G28 R-PDSO-G28 - - S-PQCC-N44 R-PDSO-G28
length 6 mm 8 mm 8 mm 8 mm 17.9 mm 17.9 mm - - 8 mm 17.9 mm
Number of I/O lines 21 35 35 35 21 21 - - 35 21
Number of terminals 28 44 44 44 28 28 - - 44 28
On-chip program ROM width 8 8 8 8 8 8 - - 8 8
Maximum operating temperature 105 °C 85 °C 105 °C 105 °C 105 °C 85 °C - - 85 °C 105 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C - - -40 °C -40 °C
PWM channel YES YES YES YES YES YES - - YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HVQCCN HVQCCN HVQCCN HVQCCN SOP SOP - - HVQCCN SOP
Package shape SQUARE SQUARE SQUARE SQUARE RECTANGULAR RECTANGULAR - - SQUARE RECTANGULAR
Package form CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE SMALL OUTLINE - - CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE
ROM programmability FLASH FLASH FLASH FLASH FLASH FLASH - - FLASH FLASH
Filter level AEC-Q100; TS 16949 TS 16949 AEC-Q100; TS 16949 AEC-Q100; TS 16949 AEC-Q100; TS 16949 TS 16949 - - TS 16949 AEC-Q100; TS 16949
Maximum seat height 1 mm 1 mm 1 mm 1 mm 2.65 mm 2.65 mm - - 1 mm 2.65 mm
Maximum supply voltage 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V - - 3.6 V 3.6 V
Minimum supply voltage 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V - - 2.5 V 2.5 V
Nominal supply voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V - - 3.3 V 3.3 V
surface mount YES YES YES YES YES YES - - YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS - - CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL - - INDUSTRIAL INDUSTRIAL
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD GULL WING GULL WING - - NO LEAD GULL WING
Terminal pitch 0.65 mm 0.65 mm 0.65 mm 0.65 mm 1.27 mm 1.27 mm - - 0.65 mm 1.27 mm
Terminal location QUAD QUAD QUAD QUAD DUAL DUAL - - QUAD DUAL
width 6 mm 8 mm 8 mm 8 mm 7.5 mm 7.5 mm - - 8 mm 7.5 mm
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC - - MICROCONTROLLER, RISC MICROCONTROLLER, RISC
[Nucleo G071 Review] PWM breathing light
The easiest way to evaluate the timer function of a development board is to evaluate its breathing light function. The breathing light is realized by PWM wave, and PWM is generated by the timer. Open ...
donatello1996 stm32/stm8
[EETalk] Why do smart homes not use ZigBee but are keen on Bluetooth and Wi-Fi?
ZigBee is a low-speed, short-distance wireless network protocol. Its underlying layer is the media access layer and physical layer that adopt the IEEE 802.15.4 standard. Its main features are low spee...
okhxyyo RF/Wirelessly
Selection of the discharge resistor of the X capacitor
I saw two X capacitors on a power supply, one with two 1M resistors in series, and the other with VR selected. I would like to ask what the difference is...
lx331lx Power technology
Is there anything that can sense the slight vibration when the solenoid valve is actuated?
I am planning to implement an application where the solenoid valve is buried deep inside. Since the valve may fail sometimes, I hope to get information about whether the valve has been actuated after ...
天涯海角sr Analog electronics
Double 11 development board recommendation: MSP430 LaunchPad
The MSP430 Launchpad, is an easy-to-use Flash programmer tool with 14/20-pin and DIP socket target boards with integrated emulation capabilities.For more details, please refer to EE's previous activit...
高进 Embedded System
Characteristics and research analysis of wireless communications with examples
The most elusive thing in wireless communication is the invisible and intangible wireless channel. However, it is precisely because of its unpredictable changes that wireless communication has a uniqu...
火辣西米秀 Wireless Connectivity

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号