|
SST25VF040B-50-4I-S2AF |
SST25VF040B_07 |
SST25VF040B-50-4I-QAF |
SST25VF040B-50-4C-SAF |
SST25VF040B-50-4C-S2AF |
SST25VF040B-50-4C-QAF |
Description |
4M X 1 FLASH 2.7V PROM, PDSO8 |
4M X 1 FLASH 2.7V PROM, PDSO8 |
4M X 1 FLASH 2.7V PROM, PDSO8 |
4M X 1 FLASH 2.7V PROM, PDSO8 |
4M X 1 FLASH 2.7V PROM, PDSO8 |
4M X 1 FLASH 2.7V PROM, PDSO8 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
8 |
8 |
8 |
8 |
8 |
8 |
Maximum operating temperature |
85 Cel |
85 Cel |
85 Cel |
70 Cel |
70 Cel |
70 Cel |
Minimum operating temperature |
-40 Cel |
-40 Cel |
-40 Cel |
0.0 Cel |
0.0 Cel |
0.0 Cel |
Maximum supply/operating voltage |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
Minimum supply/operating voltage |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
Rated supply voltage |
3 V |
3 V |
3 V |
3 V |
3 V |
3 V |
maximum clock frequency |
50 MHz |
50 MHz |
50 MHz |
50 MHz |
50 MHz |
50 MHz |
Processing package description |
5.20 × 8 MM, ROHS COMPLIANT, SOIC-8 |
5.20 × 8 MM, ROHS COMPLIANT, SOIC-8 |
6 X 5 MM, ROHS COMPLIANT, WSON-8 |
5 X 6 MM, ROHS COMPLIANT, MS-012AA, SOIC-8 |
5.20 × 8 MM, ROHS COMPLIANT, SOIC-8 |
6 X 5 MM, ROHS COMPLIANT, WSON-8 |
Lead-free |
Yes |
Yes |
Yes |
Yes |
Yes |
Yes |
EU RoHS regulations |
Yes |
Yes |
Yes |
Yes |
Yes |
Yes |
state |
ACTIVE |
ACTIVE |
ACTIVE |
ACTIVE |
TRANSFERRED |
ACTIVE |
Craftsmanship |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
packaging shape |
SQUARE |
SQUARE |
RECTANGULAR |
RECTANGULAR |
SQUARE |
RECTANGULAR |
Package Size |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
surface mount |
Yes |
Yes |
Yes |
Yes |
Yes |
Yes |
Terminal form |
GULL WING |
GULL WING |
NO LEAD |
GULL WING |
GULL WING |
NO LEAD |
Terminal spacing |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
terminal coating |
MATTE Tin |
MATTE Tin |
NICKEL PALLADIUM GOLD |
NICKEL PALLADIUM GOLD |
Nickel Palladium |
NICKEL PALLADIUM GOLD |
Terminal location |
pair |
pair |
DUAL |
DUAL |
pair |
DUAL |
Packaging Materials |
Plastic/Epoxy |
Plastic/Epoxy |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
Plastic/Epoxy |
PLASTIC/EPOXY |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
memory width |
1 |
1 |
1 |
1 |
1 |
1 |
organize |
4M × 1 |
4M × 1 |
4M X 1 |
4M X 1 |
4M × 1 |
4M X 1 |
storage density |
4.19E6 deg |
4.19E6 deg |
4.19E6 deg |
4.19E6 deg |
4.19E6 deg |
4.19E6 deg |
operating mode |
Synchronize |
Synchronize |
SYNCHRONOUS |
SYNCHRONOUS |
Synchronize |
SYNCHRONOUS |
Memory IC type |
FLASH 2.7V programmable read-only memory |
FLASH 2.7V programmable read-only memory |
FLASH 2.7V PROM |
FLASH 2.7V PROM |
FLASH 2.7V programmable read-only memory |
FLASH 2.7V PROM |
serial parallel |
serial |
serial |
SERIAL |
SERIAL |
serial |
SERIAL |
China RoHS regulations |
Yes |
Yes |
Yes |
Yes |
- |
Yes |
Number of digits |
4M |
4M |
4M |
4M |
4M |
4M |