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FX11LB-140S-SV(22)

Description
CONN RECEPT 140POS W/O POSTS SMD
CategoryThe connector   
File Size692KB,16 Pages
ManufacturerHirose Electric
Environmental Compliance
Download Datasheet Parametric View All

FX11LB-140S-SV(22) Overview

CONN RECEPT 140POS W/O POSTS SMD

FX11LB-140S-SV(22) Parametric

Parameter NameAttribute value
Connector typeSocket with central contact
Number of pins140
spacing0.020"(0.50mm)
Number of rows2
Installation typesurface mount
characteristicFixed solder tail
Contact platinggold
Contact plating thickness3.90µin(0.099µm)
Joint stack height2mm
board height0.065"(1.65mm)
0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm
High-Speed Board-to-Board Connections
FX11 Series
Stacking height : 2mm
Stacking height : 2.5mm, 3mm
Oct.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
■Features
1. Low Profile Design
The board-to-board mating height of 2mm, 2.5mm and 3mm suits
smaller, thinner case designs. (Fig.2)
10 Signal : 1 Ground Arrangement
2. Improved Transmission Efficiency Between Boards
Transmission characteristics have been improved through a design
that fixes ground plates to both sides of the header and receptacle.
Housing
m
5m
0.7
Ground Plate
Signal contact
m
5m
0.7
mm
0.5
3. 10 Signal:1 Ground Arrangement
Signal and ground are arranged in a ratio of 10 : 1 with the ground plate connected to
the board Via SMT. The ground stability achieved serves to reduce noise. (Fig.1)
Metal fitting
Ground plate and metal fitting make contact
Fig.1
4. Metal Fittings for Added Strength
Metal fittings provide for greater adhesion to the board, which
protects the connector against sheaning forces. The unique
connector design provides a connection between the fitting and the
ground plate for a stronger ground.
Stacking Height Variation
5. Suited to High-Density Applications
The signal contact pitch of 0.5mm affords a compact connector,
and reduces mounting space on the board.
Note: 2.0mm type product cannot be used or interchanged
with the 2.5mm or 3.0mm type product.
Fig.2
6. Structure Prevents Solder Wicking
A solder gap has been designed into the contact SMT portion to
prevent solder wicking. (Fig.3)
Structure Prevent Solder Wicking
7. High Contact Reliability
Effective wipe length is 0.55mm (2mm height) and 1mm(2.5mm,
3mm height) for signal contacts.
8. Optional Ground Plate
An alternate style is also available without the ground plate. The
space provided by the absence of the ground plate is filled with
additional signal contacts.
Fig.3
Signal Integrity Features
●Insertion-Loss-to-Crosstalk
Ratio (ICR)
The insertion-loss-to-crosstalk
ratio (ICR) with five differential
FEXT aggressors meets the
extrapolated IEEE802.3ap
specification to 10
+
Gbps.
●Differential
Impedance
The differential impedance is
100 + /- 10ø for FX11 at 50 ps
rise time(20% to 80%).
ICR 3mm(Without GND)
60
50
40
30
20
10
0
ICR
IEEEspec
0
1
2
3
4
5
6
7
8
9
10
120
115
110
105
Impedance 3mm(Without GND)
ICR(dB)
Z(ø)
100
95
90
85
80
0.8
FX11- 3mm DifferentialTDR
0.9
1
1.1
1.2
1.3
1.4
1.5
Frequency(GHz)
Time(ns)
In cases where the application will demand a high level of reliability, such as automotive,
please contact a company representative for further information.
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