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EPC2050ENGRT

Description
TRANS GAN 350V BUMPED DIE
Categorysemiconductor    Discrete semiconductor   
File Size1017KB,8 Pages
ManufacturerEPC
Environmental Compliance
Download Datasheet Parametric Compare View All

EPC2050ENGRT Overview

TRANS GAN 350V BUMPED DIE

EPC2050ENGRT Parametric

Parameter NameAttribute value
FET typeN channel
technologyGaNFET (gallium nitride)
Drain-source voltage (Vdss)350V
Current - Continuous Drain (Id) at 25°C6.3A
Drive voltage (maximum Rds On, minimum Rds On)5V
Rds On (maximum value) when different Id, Vgs65 milliohms @ 6A, 5V
Vgs (th) (maximum value) when different Id2.5V @ 1.5mA
Gate charge (Qg) at different Vgs (maximum value)4.3nC @ 5V
Vgs (maximum value)+6V,-4V
Input capacitance (Ciss) at different Vds (maximum value)505pF @ 280V
FET function-
Power dissipation (maximum)-
Operating temperature-40°C ~ 150°C(TJ)
Installation typesurface mount
Supplier device packagingMold Section (12 Rods)
Package/casingMold
EPC2050 – Enhancement-Mode Power Transistor
Preliminary Specification Sheet
Status: Engineering
Features:
V
DS
, 350 V
Maximum R
DS(on)
, 65
mΩ
I
D
, 6.3 A
Applications:
Multi-Level AC-DC Conversion
EV Charging
Solar Power Inverters
Motor Drives
Wireless Power Class-E Amplifiers
LED Lighting
Medical Imaging
Maximum Ratings
V
DS
I
D
V
GS
T
J
T
STG
Drain-to-Source Voltage (Continuous)
Continuous (T
A
= 25˚C, R
θJA
= 26
˚C/W)
Pulsed (25˚C, T
PULSE
= 300 µs)
Gate-to-Source Voltage
Gate-to-Source Voltage
Operating Temperature
Storage Temperature
350
6.3
26
6
-4
-40 to 150
-40 to 150
V
A
V
˚C
EPC2050 eGaN® FETs are supplied in
passivated die form with solder bumps.
Die Size: 1.95 mm x 1.95 mm
Static Characteristics
(T
J
= 25˚C unless otherwise stated)
PARAMETER
BV
DSS
I
DSS
I
GSS
V
GS(TH)
R
DS(on)
V
SD
Drain-to-Source Voltage
Drain Source Leakage
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Gate Threshold Voltage
Drain-Source On Resistance
Source-Drain Forward Voltage
TEST CONDITIONS
V
GS
= 0 V, I
D
= 120 µA
V
DS
= 280 V, V
GS
= 0 V
V
GS
= 5 V
V
GS
= -4 V
V
DS
= V
GS
, I
D
= 1.5 mA
V
GS
= 5 V, I
D
= 6 A
I
S
= 0.5 A, V
GS
= 0 V
Thermal Characteristics
TYP
R
θJC
R
θJB
R
θJA
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Board
Thermal Resistance, Junction to Ambient (Note 1)
1.4
9.2
64
UNIT
˚C/W
˚C/W
˚C/W
0.8
MIN
350
2
0.1
2
1.4
42
2.2
20
1
20
2.5
65
TYP
MAX
UNIT
V
µA
mA
µA
V
mΩ
V
All measurements were done with substrate shorted to source.
Note 1: R
θ
JA
is determined with the device mounted on one square inch of copper pad, single layer 2 oz copper on FR4 board.
See
http://epc-co.com/epc/documents/product-training/Appnote_Thermal_Performance_of_eGaN_FETs.pdf
for details.
Subject to Change without Notice
www.epc-co.com
COPYRIGHT 2018
Page 1

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