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SY87700VHCTR

Description
CLOCK RECOVERY CIRCUIT, PDSO28
CategoryWireless rf/communication    Telecom circuit   
File Size143KB,15 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
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SY87700VHCTR Overview

CLOCK RECOVERY CIRCUIT, PDSO28

SY87700VHCTR Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeQFP
package instructionHTQFP, TQFP32,.35SQ,32
Contacts32
Reach Compliance Code_compli
appATM;SDH;SONET
JESD-30 codeS-PQFP-G32
JESD-609 codee0
length7 mm
Humidity sensitivity level3
Number of functions1
Number of terminals32
Maximum operating temperature85 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeHTQFP
Encapsulate equivalent codeTQFP32,.35SQ,32
Package shapeSQUARE
Package formFLATPACK, HEAT SINK/SLUG, THIN PROFILE
Peak Reflow Temperature (Celsius)240
power supply3.3/5 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum slew rate0.23 mA
Nominal supply voltage3.3 V
surface mountYES
Telecom integrated circuit typesATM/SONET/SDH CLOCK RECOVERY CIRCUIT
Temperature levelOTHER
Terminal surfaceTin/Lead (Sn85Pb15)
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width7 mm
Base Number Matches1

SY87700VHCTR Related Products

SY87700VHCTR SY87700V_06 SY87700VZCTR SY87700VZHTR SY87700VHHTR
Description CLOCK RECOVERY CIRCUIT, PDSO28 CLOCK RECOVERY CIRCUIT, PDSO28 CLOCK RECOVERY CIRCUIT, PDSO28 CLOCK RECOVERY CIRCUIT, PDSO28 CLOCK RECOVERY CIRCUIT, PDSO28
Number of functions 1 1 1 1 1
Number of terminals 32 28 28 28 32
Maximum operating temperature 85 °C 85 Cel 85 °C 85 °C 85 °C
surface mount YES Yes YES YES YES
Temperature level OTHER OTHER OTHER OTHER OTHER
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal location QUAD DUAL DUAL DUAL QUAD
Is it Rohs certified? incompatible - incompatible conform to conform to
package instruction HTQFP, TQFP32,.35SQ,32 - SOP, SOP28,.4 0.300 INCH, LEAD FREE, SOIC-28 LEAD FREE, TQFP-32
Reach Compliance Code _compli - _compli compli compli
JESD-30 code S-PQFP-G32 - R-PDSO-G28 R-PDSO-G28 S-PQFP-G32
JESD-609 code e0 - e0 e4 e3
length 7 mm - 17.93 mm 17.93 mm 7 mm
Humidity sensitivity level 3 - 1 2 3
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HTQFP - SOP SOP HTQFP
Package shape SQUARE - RECTANGULAR RECTANGULAR SQUARE
Package form FLATPACK, HEAT SINK/SLUG, THIN PROFILE - SMALL OUTLINE SMALL OUTLINE FLATPACK, HEAT SINK/SLUG, THIN PROFILE
Peak Reflow Temperature (Celsius) 240 - 240 260 260
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm - 2.65 mm 2.65 mm 1.2 mm
Nominal supply voltage 3.3 V - 3.3 V 3.3 V 3.3 V
Telecom integrated circuit types ATM/SONET/SDH CLOCK RECOVERY CIRCUIT - ATM/SONET/SDH CLOCK RECOVERY CIRCUIT ATM/SONET/SDH CLOCK RECOVERY CIRCUIT ATM/SONET/SDH CLOCK RECOVERY CIRCUIT
Terminal surface Tin/Lead (Sn85Pb15) - Tin/Lead (Sn75Pb25) NICKEL PALLADIUM GOLD MATTE TIN
Terminal pitch 0.8 mm - 1.27 mm 1.27 mm 0.8 mm
Maximum time at peak reflow temperature 30 - 30 40 40
width 7 mm - 7.52 mm 7.52 mm 7 mm
Maker - - Microchip Microchip Microchip

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