CLOCK RECOVERY CIRCUIT, PDSO28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Microchip |
| Parts packaging code | SOIC |
| package instruction | SOP, SOP28,.4 |
| Contacts | 28 |
| Reach Compliance Code | _compli |
| app | ATM;SDH;SONET |
| JESD-30 code | R-PDSO-G28 |
| JESD-609 code | e0 |
| length | 17.93 mm |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 28 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP28,.4 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | 240 |
| power supply | 3.3/5 V |
| Certification status | Not Qualified |
| Maximum seat height | 2.65 mm |
| Maximum slew rate | 0.23 mA |
| Nominal supply voltage | 3.3 V |
| surface mount | YES |
| Telecom integrated circuit types | ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
| Temperature level | OTHER |
| Terminal surface | Tin/Lead (Sn75Pb25) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| width | 7.52 mm |
| SY87700VZCTR | SY87700V_06 | SY87700VZHTR | SY87700VHHTR | SY87700VHCTR | |
|---|---|---|---|---|---|
| Description | CLOCK RECOVERY CIRCUIT, PDSO28 | CLOCK RECOVERY CIRCUIT, PDSO28 | CLOCK RECOVERY CIRCUIT, PDSO28 | CLOCK RECOVERY CIRCUIT, PDSO28 | CLOCK RECOVERY CIRCUIT, PDSO28 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 28 | 28 | 28 | 32 | 32 |
| Maximum operating temperature | 85 °C | 85 Cel | 85 °C | 85 °C | 85 °C |
| surface mount | YES | Yes | YES | YES | YES |
| Temperature level | OTHER | OTHER | OTHER | OTHER | OTHER |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal location | DUAL | DUAL | DUAL | QUAD | QUAD |
| Is it Rohs certified? | incompatible | - | conform to | conform to | incompatible |
| Maker | Microchip | - | Microchip | Microchip | - |
| package instruction | SOP, SOP28,.4 | - | 0.300 INCH, LEAD FREE, SOIC-28 | LEAD FREE, TQFP-32 | HTQFP, TQFP32,.35SQ,32 |
| Reach Compliance Code | _compli | - | compli | compli | _compli |
| JESD-30 code | R-PDSO-G28 | - | R-PDSO-G28 | S-PQFP-G32 | S-PQFP-G32 |
| JESD-609 code | e0 | - | e4 | e3 | e0 |
| length | 17.93 mm | - | 17.93 mm | 7 mm | 7 mm |
| Humidity sensitivity level | 1 | - | 2 | 3 | 3 |
| Package body material | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | - | SOP | HTQFP | HTQFP |
| Package shape | RECTANGULAR | - | RECTANGULAR | SQUARE | SQUARE |
| Package form | SMALL OUTLINE | - | SMALL OUTLINE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE |
| Peak Reflow Temperature (Celsius) | 240 | - | 260 | 260 | 240 |
| Certification status | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 2.65 mm | - | 2.65 mm | 1.2 mm | 1.2 mm |
| Nominal supply voltage | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V |
| Telecom integrated circuit types | ATM/SONET/SDH CLOCK RECOVERY CIRCUIT | - | ATM/SONET/SDH CLOCK RECOVERY CIRCUIT | ATM/SONET/SDH CLOCK RECOVERY CIRCUIT | ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
| Terminal surface | Tin/Lead (Sn75Pb25) | - | NICKEL PALLADIUM GOLD | MATTE TIN | Tin/Lead (Sn85Pb15) |
| Terminal pitch | 1.27 mm | - | 1.27 mm | 0.8 mm | 0.8 mm |
| Maximum time at peak reflow temperature | 30 | - | 40 | 40 | 30 |
| width | 7.52 mm | - | 7.52 mm | 7 mm | 7 mm |
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