Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Packaging C-Spec Ordering Options Table
Packaging Type
Commercial Grade
1
Bulk Bag
7" Reel/Unmarked
13" Reel/Unmarked
7" Reel/Unmarked/2 mm pitch
2
13" Reel/Unmarked/2 mm pitch
2
7" Reel
13" Reel/Unmarked
7" Reel/Unmarked/2 mm pitch
2
13" Reel/Unmarked/2 mm pitch
2
1
1
Packaging/Grade
Ordering Code (C-Spec)
Not Required (Blank)
TU
7411 (EIA 0603 and smaller case sizes)
7210 (EIA 0805 and larger case sizes)
7081
7082
Automotive Grade
3
AUTO
AUTO7411 (EIA 0603 and smaller case sizes)
AUTO7210 (EIA 0805 and larger case sizes)
3190
3191
Default packaging is “Bulk Bag”. An ordering code C-Spec is not required for “Bulk Bag” packaging.
The terms “Marked” and “Unmarked” pertain to laser marking option of capacitors. All packaging options labeled as “Unmarked” will contain
capacitors that have not been laser marked.
2
The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”.
3
Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L” x W”) and thickness dimension. See “Chip Thickness/Tape & Reel
Packaging Quantities” and “Tape & Reel Packaging Information”.
3
For additional Information regarding “AUTO” C-Spec options, see “Automotive C-Spec Information”.
3
All Automotive packaging C-Specs listed exclude the option to laser mark components. Please contact KEMET if you require a laser marked option. For
more information see “Capacitor Marking”.
Benefits
−55°C to +150°C operating temperature range
Lead (Pb)-Free, RoHS and REACH compliant
EIA 0402, 0603, 0805, 1206, 1210, and 1812 case sizes
DC voltage ratings of 10 V, 16 V, 25 V, 50 V and 100 V
Capacitance offerings ranging from 0.5 pF to 0.22 μF
Available capacitance tolerances of ±0.10 pF, ±0.25 pF,
±0.5 pF, ±1%, ±2%, ±5%, ±10%, and ±20%
• Extremely low ESR and ESL
• High thermal stability
• High ripple current capability
•
•
•
•
•
•
• No capacitance change with respect to applied rated DC
There are several problems when ADC samples two sets of DAC output voltages, as shown in the figure. In addition, if the signal is about 1uA, do we need a 20-bit ADC chip? Do we need to consider the f...
.main .content are separated by a space, indicating a descendant selector, which selects the element containing pp within the .main element.For example:
div class="main"div class="content"Selected ele...
I recently used STM32F767 in a project. The internal AD is 12 bits, which does not meet the requirements. I looked for ADS1274, which has 64 pins, but it has too many pins. I also looked for other AD ...
Connection Establishment
To handle data transmission that is more complex than broadcasting, or to achieve reliable data delivery between devices, all of these rely on connections. Connections use dat...
Today at 10:00 AM, there will be a prize live broadcast [TI’s GaN-based application introduction] [url=https://en.eeworld.com/bbs/huodongform/index.php?id=217&sid=107][b][size=4]>>Click here to enter ...
According to relevant reports from Omdia and CLT, the global automotive semiconductor market size (TAM) will grow from US$40 billion to US$76 billion from 2020 to 2023. In 2023, ST's revenue accoun...[Details]
According to media reports, Tesla’s Shanghai factory has begun laying off employees related to battery assembly. This layoff mainly involves employees in the first phase of battery assembly, and more...[Details]
On September 18, metamaterials have properties that similar natural materials do not have. Researchers at the University of Glasgow in the UK have developed a new, cheap, easy-to-manufacture ultra-...[Details]
SKiN, a chip interconnect technology It is not inevitable that the autumn air will be miserable, but the mild cold is just a pleasant thing. In the last quarter of 2023, the weather is getting cooler...[Details]
Regarding the evolution of automotive electronic and electrical architecture, the most discussed in the industry is the six stages of electronic and electrical architecture development proposed by ...[Details]
1. WM9876 interface and working principle This section uses the JZ2440 development board to transplant the WM9876 driver. Its structure is shown in the figure below. Finally, the madplay tool is us...[Details]
In S7-1200PLC, in addition to the data type conversion instruction CONV shared in the "Siemens S7-1200PLC Processing Instructions: Conversion Instruction CONV" section, you can also use the floatin...[Details]
GIC is an important component in the ARM system. After understanding the composition and function of GIC, we can understand the general process of IRQ, from the arrival of hardware IRQ to the end o...[Details]
1. The difference between traditional medical masks and smart masks
Smart masks are equipped with a chip on the nose clip to automatically sense moisture, scatter far infrared rays to dry it i...[Details]
Nowadays, the automotive industry has higher and higher requirements for reliability and safety. In the process of application of in-vehicle Ethernet, in order to ensure its reliability and safety,...[Details]
"Starting from this chip" Cixin Technology released its AI PC strategy and first chip
Laying out the end-side AI ecosystem Cixin Technology released heterogeneous AI PC chips
O...[Details]
On March 1, Nvidia had a good start, with a 4% increase on the day and a closing price of US$822.79, and its market value exceeded the 2 trillion mark for the first time.
At the same time, Nvi...[Details]
In March of this year, Yu Chengdong really wanted to use "Huawei" as the core and flex his muscles under the Wenjie brand, but the result was half success and half failure. Huawei still has the Wen...[Details]