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MT45W256KW16BEGB-708 WT TR

Description
IC PSRAM 4M PARALLEL 54VFBGA
Categorystorage   
File Size2MB,58 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Environmental Compliance
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MT45W256KW16BEGB-708 WT TR Overview

IC PSRAM 4M PARALLEL 54VFBGA

MT45W256KW16BEGB-708 WT TR Parametric

Parameter NameAttribute value
memory typeVolatile
memory formatPSRAM
technologyPSRAM (pseudo-SRAM)
storage4Mb (256K x 16)
Write cycle time - words, pages70ns
interview time70ns
memory interfacein parallel
Voltage - Power1.7 V ~ 1.95 V
Operating temperature-30°C ~ 85°C(TC)
Installation typesurface mount
Package/casing54-VFBGA
Supplier device packaging54-VFBGA(6x8)
4Mb: 256K x 16 Async/Page/Burst CellularRAM 1.0 Memory
Features
Async/Page/Burst
CellularRAM
®
1.0 Memory
MT45W256KW16BEGB
Features
• Single device supports asynchronous, page, and
burst operations
• Random access time: 70ns
• V
CC
, V
CC
Q voltages
1.7–1.95V V
CC
1.7–3.6V
1
V
CC
Q
• Page mode read access
16-word page size
Interpage read access: 70ns
Intrapage read access: 20ns
• Burst mode write access: continuous burst
• Burst mode read access
4, 8, or 16 words or continuous burst
MAX clock rate: 104 MHz (
t
CLK = 9.62ns)
Burst initial latency: 38.5ns (4 clocks) at 104 MHz
t
ACLK: 7ns at 104 MHz
• Low power consumption
Asynchronous read: <20mA
Intrapage read: <15mA
Intrapage read initial access, burst read:
(38.5ns [4 clocks] at 104 MHz) <35mA
Continuous burst read: <28mA
Standby: <60µA
Deep power-down (DPD): <10µA (TYP at 25°C)
• Low-power features
Partial-array refresh (PAR)
DPD mode
Figure 1:
54-Ball VFBGA Ball Assignment
1
A
B
C
D
E
F
G
H
J
LB#
2
OE#
3
A0
4
A1
5
A2
6
CRE
DQ8
UB#
A3
A4
CE#
DQ0
DQ9
DQ10
A5
A6
DQ1
DQ2
V
SS
Q
DQ11
A17
A7
DQ3
V
CC
V
CC
Q
DQ12
NC
A16
DQ4
V
SS
DQ14
DQ13
A14
A15
DQ5
DQ6
DQ15
NC
A12
A13
WE#
DQ7
DNU
A8
A9
A10
A11
NC
WAIT
CLK
ADV#
NC
NC
NC
Top view
(Ball down)
Options
• Configuration
256K x 16
• Package
54-ball VFBGA (“green”)
• Access time
70ns
• Frequency
80 MHz
104 MHz
• Standby power
Standard
Designator
MT45W256KW16BE
GB
-70
8
1
None
Options (continued)
• Operating temperature range
Wireless (–30°C to +85°C)
1
Industrial (–40°C to +85°C)
2
Designator
WT
IT
Notes: 1. The 3.6V I/O and the –30°C wireless temper-
ature exceed the CellularRAM Workgroup 1.0
specification.
2. Contact factory for availability.
Part Number Example:
MT45W256KW16BEGB-701WT
PDF: 09005aef8329f3e3 / Source: 09005aef82e419a5
8mb_4mb_burst_cr1_0_p22z__1.fm - Rev. B 4/ 08 EN
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2008 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.

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MT45W256KW16BEGB-708 WT TR MT45W256KW16BEGB-708IT MT45W256KW16BEGB-701IT MT45W256KW16BEGB-701WT
Description IC PSRAM 4M PARALLEL 54VFBGA Pseudo Static RAM, 256KX16, 70ns, CMOS, PBGA54, 6 X 8 MM, 1 MM HEIGHT 0.75 MM PITCH, GREEN, VFBGA-54 Pseudo Static RAM, 256KX16, 70ns, CMOS, PBGA54, 6 X 8 MM, 1 MM HEIGHT 0.75 MM PITCH, GREEN, VFBGA-54 Pseudo Static RAM, 256KX16, 70ns, CMOS, PBGA54, 6 X 8 MM, 1 MM HEIGHT 0.75 MM PITCH, GREEN, VFBGA-54
technology PSRAM (pseudo-SRAM) CMOS CMOS CMOS
Is it Rohs certified? - conform to conform to conform to
Parts packaging code - BGA BGA BGA
package instruction - VFBGA, BGA54,6X9,30 VFBGA, BGA54,6X9,30 VFBGA, BGA54,6X9,30
Contacts - 54 54 54
Reach Compliance Code - compliant unknown compliant
ECCN code - 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time - 70 ns 70 ns 70 ns
I/O type - COMMON COMMON COMMON
JESD-30 code - R-PBGA-B54 R-PBGA-B54 R-PBGA-B54
JESD-609 code - e1 e1 e1
length - 8 mm 8 mm 8 mm
memory density - 4194304 bit 4194304 bit 4194304 bit
Memory IC Type - PSEUDO STATIC RAM PSEUDO STATIC RAM PSEUDO STATIC RAM
memory width - 16 16 16
Number of functions - 1 1 1
Number of terminals - 54 54 54
word count - 262144 words 262144 words 262144 words
character code - 256000 256000 256000
Operating mode - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature - 85 °C 85 °C 85 °C
Minimum operating temperature - -40 °C -40 °C -40 °C
organize - 256KX16 256KX16 256KX16
Output characteristics - 3-STATE 3-STATE 3-STATE
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - VFBGA VFBGA VFBGA
Encapsulate equivalent code - BGA54,6X9,30 BGA54,6X9,30 BGA54,6X9,30
Package shape - RECTANGULAR RECTANGULAR RECTANGULAR
Package form - GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial - PARALLEL PARALLEL PARALLEL
power supply - 1.8,1.8/3.3 V 1.8,1.8/3.3 V 1.8,1.8/3.3 V
Certification status - Not Qualified Not Qualified Not Qualified
Maximum seat height - 1 mm 1 mm 1 mm
Maximum standby current - 0.00001 A 0.00001 A 0.00001 A
Maximum slew rate - 0.035 mA 0.035 mA 0.035 mA
Maximum supply voltage (Vsup) - 1.95 V 1.95 V 1.95 V
Minimum supply voltage (Vsup) - 1.7 V 1.7 V 1.7 V
surface mount - YES YES YES
Temperature level - INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface - TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER
Terminal form - BALL BALL BALL
Terminal pitch - 0.75 mm 0.75 mm 0.75 mm
Terminal location - BOTTOM BOTTOM BOTTOM
width - 6 mm 6 mm 6 mm
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