EEWORLDEEWORLDEEWORLD

Part Number

Search

GA0603A2R2DBAAR31G

Description
CAP CER 2.2PF 50V C0G/NP0 0603
CategoryPassive components   
File Size178KB,20 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance
Download Datasheet Parametric View All

GA0603A2R2DBAAR31G Overview

CAP CER 2.2PF 50V C0G/NP0 0603

GA0603A2R2DBAAR31G Parametric

Parameter NameAttribute value
capacitance2.2pF
Tolerance±0.5pF
Voltage - Rated50V
Temperature CoefficientC0G,NP0
Operating temperature-55°C ~ 150°C
characteristic-
gradeAEC-Q200
applicationAutomotive grade
failure rate-
Installation typeSurface mount, MLCC
Package/casing0603 (1608 Metric)
size/dimensions0.063" long x 0.032" wide (1.60mm x 0.80mm)
Height - Installation (maximum)-
Thickness (maximum)0.038"(0.97mm)
lead spacing-
Lead form-
GA....31G Automotive MLCC
www.vishay.com
Vishay Vitramon
Surface Mount Multilayer Ceramic Chip Capacitors
for Automotive Applications
FEATURES
• AEC-Q200 qualified with PPAP available
• Available in 0402 to 1812 body size
• 100 % matte tin termination for soldering
process
• High operating temperature
• Wet build process
• Reliable Noble Metal Electrode (NME) system
• Parts compliant with ELV directive
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
For more than 25 years Vishay Vitramon has supported the automotive industry with robust, highly reliable MLCCs that have
made it a leader in this segment. All Vishay Vitramon MLCCs are manufactured in “Precious Metal Technology” (PMT / NME)
and a wet build process. They are qualified according to AEC-Q200 with PPAP available on request. Applications for these
devices include automotive “under the hood”, safety and comfort electronics. Their termination finish is 100 % matte tin plate
finish. A polymer (flexible) termination with 100 % matte tin plate finish is offered for boardflex sensitive applications.
C0G (NP0) DIELECTRIC
GENERAL SPECIFICATION
Note
Electrical characteristics at +25 °C unless otherwise specified
X7R, X8R DIELECTRIC
GENERAL SPECIFICATION
Note
Electrical characteristics at +25 °C unless otherwise specified
Operating Temperature:
-55 °C to +150 °C
(above +125 °C changed characteristics, see 2.2)
Capacitance Range:
1 pF to 22 nF
Voltage Range:
25 V
DC
to 3000 V
DC
Temperature Coefficient of Capacitance (TCC):
0 ppm/°C ± 30 ppm/°C from -55 °C to +125 °C
Dissipation Factor (DF):
0.1 % maximum at 1.0 V
RMS
and
1 MHz for values
1000 pF
0.1 % maximum at 1.0 V
RMS
and
1 kHz for values > 1000 pF
Insulating Resistance:
at +25 °C 100 000 M min. or 1000
F
whichever is less
at +125 °C 10 000 M min. or 100
F
whichever is less
Aging:
0 % maximum per decade
Dielectric Strength Test:
performed per method 103 of EIA 198-2-E.
Applied test voltages
250 V
DC
-rated:
250 % of rated voltage
500 V
DC
-rated:
200 % of rated voltage
630 V
DC
, 1000 V
DC
-rated:
150 % of rated voltage
3000 V
DC
-rated:
120 % of rated voltage
Operating Temperature:
-55 °C to +150 °C
(X7R above +125 °C changed characteristics, see 2.2)
Capacitance Range:
120 pF to 1.0 μF
Voltage Range:
16 V
DC
to 630 V
DC
Temperature Coefficient of Capacitance (TCC):
X7R: ± 15 % from -55 °C to +125 °C, with 0 V
DC
applied
X8R: ± 15 % from -55 °C to +150 °C, with 0 V
DC
applied
Dissipation Factor (DF):
16 V, 25 V ratings: 3.5 % maximum at 1.0 V
RMS
and 1 kHz
> 25 V ratings: 2.5 % maximum at 1.0 V
RMS
and 1 kHz
Insulating Resistance:
at +25 °C 100 000 M min. or 1000
F
whichever is less
at +125 °C 10 000 M min. or 100
F
whichever is less
Aging Rate:
1 % maximum per decade
Dielectric Strength Test:
performed per method 103 of EIA 198-2-E.
Applied test voltages
250 V
DC
-rated:
250 % of rated voltage
500 V
DC
-rated:
min. 150 % of rated voltage
630 V
DC
:
min. 120 % of rated voltage
Revision: 29-May-2018
Document Number: 45230
1
For technical questions, contact:
mlcc@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
C6000TM Multicore DSP + Arm SoC Open Source
The DSP + Arm solution is optimized for embedded systems with a focus on power efficiency and real-time performance and includes OMAP-L1x and 66AK2x devices. OMAP-L1x devices are ideal for application...
Aguilera DSP and ARM Processors
【TI recommended course】#Lecture on basic knowledge of electronic circuits#
//training.eeworld.com.cn/TI/show/course/3818...
笑容在面 TI Technology Forum
Breakthrough TI BAW technology advances big data amidst the flood of information
[align=center][color=rgb(85, 85, 85)][font="][size=14px][color=rgb(204, 0, 0)][url=https://e2echina.ti.com/cfs-file/__key/communityserver-blogs-components-weblogfiles/00-00-00-01-15/3302.asasas.jpg][i...
alan000345 TI Technology Forum
FPGA Learning Notes-----FPGA Competition Adventure
...
至芯科技FPGA大牛 FPGA/CPLD
Share: Component Failure Analysis Methods
[i=s]This post was last edited by qwqwqw2088 on 2021-10-29 12:57[/i]Once a device breaks down, don't stay away from it, but treat it as a treasure.Everyone who drives knows where is the best place to ...
qwqwqw2088 Power technology
7 good habits of PCB layout engineers
In the eyes of some people, the work of PCB layout engineers is a bit boring. Every day, they have to deal with thousands of wiring on the board, various packages, and repeat the work of pulling wires...
mwkjhl PCB Design

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号