EEWORLDEEWORLDEEWORLD

Part Number

Search

ATS-06F-79-C1-R0

Description
HEATSINK 30X30X10MM R-TAB
CategoryThermal management products   
File Size118KB,1 Pages
ManufacturerERP
Environmental Compliance
Download Datasheet Parametric View All

ATS-06F-79-C1-R0 Overview

HEATSINK 30X30X10MM R-TAB

ATS-06F-79-C1-R0 Parametric

Parameter NameAttribute value
typetop installation
cooling packageClassification (BGA, LGA, CPU, ASIC...)
Joining methodPush your feet
shapesquare, fins
length1.181"(30.00mm)
width1.181"(30.00mm)
diameter-
Height from base (fin height)0.394"(10.00mm)
Power dissipation at different temperature rises-
Thermal resistance at different forced airflows26.32°C/W @ 100 LFM
Thermal resistance under natural conditions-
Materialaluminum
Material platingblue anodized
pushPIN™ Heat Sink Assembly
ATS Part#:
ATS-06F-79-C1-R0
Description:
pushPIN™ HS ASMBLY,FINE-PITCH,STRAIGHT, HOLE PATTERN:RIGHT-TABBED,BLUE,NO TIM
Heat Sink Type:
pushPIN™ Heat Sink Assembly
Heat Sink Attachment:
pushPIN™ / Spring Kit
Features & Benefits
»
Quick Attachment – Push pins feature a flexible barb at the end designed to
engage with pre-drilled holes in a PCB.
»
Compression Springs add the necessary force to hold the assembly together
for secure attachment. Select from over 21 different springs to achieve
precise force required.
»
Push Pin Material available in brass or plastic in 10 sizes ranging from 9-
20mm in length. Stainless steel hardware kit available for more secure
attachment. Visit www.qats.com for available options.
»
Heat Sinks Designed for All Airflow Conditions. Select from over 112 fine
pitch HS designed for high velocity air flows and 98 course pitch HS
designed for low velocity air flow conditions.
»
Pre-assembled with phase-changing material for increased thermal
performance. Double-sided thermal tape and no TIM options available to
meet application-specific requirements.
»
Lightweight, aluminum HS extruded from AL6063 provide optimal heat
transfer with a blue anodized finish.
»
All components are RoHS and REACH compliant.
»
Industry standard hole pattern. Recommended through hole size is 3.175mm
For Illustration Purposes ONLY.
Bill of Material
Heat Sink:
ATS-FPX030030010-79-C1-R0
Push Pin:
Springs:
ATS-PP-06
ATS-PPS-06
Qty
1
2
2
Thermal Performance
100
AIR VELOCITY - LFM (m/s)
(0.5)
Thermal Resistance
°C/W
Unducted Flow
Ducted Flow
26.32
5.41
200
(1.0)
11.65
3.68
300
(1.5)
7.05
3.05
400
(2.0)
5.29
2.69
500
(2.5)
4.41
2.45
600
(3.0)
3.88
2.27
700
(3.5)
3.52
Fin
Pitch
FINE-PITCH
Fin
Type
STRAIGHT
Hole
Pattern
RIGHT-
TABBED
2.13
Product Detail
P/N
ATS-06F-79-C1-R0
A
30
Dimensions
B
C
E
30
10
35
F
35
NOTES:
Push Pin
ATS-PP-06
Spring
ATS-PPS-06
TIM
NO TIM
Finish
BLUE ANODIZED
1) Dimension A is the length of the heat sink in the direction of the flow.
2) Dimension B is the width of the heat sink perpendicular to the flow direction.
3) Dimension C is the heat sink height from the bottom of the base to the top of the fin
field.
4) Dimension E is the distance between holes perpendicular to the direction of flow.
5) Dimension F is the distance between holes in the direction of flow.
6) Thermal performance data are provided for reference only. Actual performance may
vary by application.
7) ATS reserves the right tp update or change its products without notice to improve the
design or performance.
8) ATS certifies that this heat sink assemby is RoHS-6 and REACH compliant.
9) Contact ATS to learn about custom options available.
For Illustration Purposes ONLY.
For further technical information, please contact Advanced Thermal Solutions, Inc.
89-27 ACCESS ROAD, NORWOOD, MA 02062 USA | T: 781.769. 2800 F: 781.769.9979 | WWW.QATS.COM R2-0917
IIC interface driver design based on FPGA
IIC interface driver design based on FPGA...
雷北城 EE_FPGA Learning Park
This article explores what the bootstrap circuit in the circuit does.
The bootstrap circuit is also called a boost circuit. It uses electronic components such as bootstrap boost diodes and bootstrap boost capacitors to superimpose the capacitor discharge voltage and the...
wangerxian Power technology
[Silicon Labs Development Kit Review] 2-Power on/Change LED Flashing Speed
To use this kit, just download SimplicityStudio-5 and you can use itWhen installing this software, the antivirus software may report an error. I just choose not to block the installation. The installa...
dingzy_2002 Development Kits Review Area
24V VCC, why is the voltage only 12V after IRF3205 is turned on?
The circuit diagram and simulation are shown below Why does the IRF3205 measure only 12V after being turned on? It should be 24V? The oscilloscope has an offset for Y except for the purple line. Only ...
vincent.liu Analog electronics
Qorvo acquired NextInput. It seems that Qorvo has been acquiring companies all the time.
NextInput was founded in 2012.The company claims that when multiple sensors are placed under the display surface, a more power-efficient and lower-cost solution is obtained compared to capacitive touc...
alan000345 RF/Wirelessly
You are invited to attend the 2018 TI Embedded Products Seminar!
[font=微软雅黑][size=3]The 2018 TI Embedded Products Workshop is ready to go! TI will meet you in seven major cities across the country in November. Here you can find the most comprehensive TI embedded pr...
eric_wang TI Technology Forum

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号