HEATSINK 30X30X25MM L-TAB T766
Parameter Name | Attribute value |
type | top installation |
cooling package | Classification (BGA, LGA, CPU, ASIC...) |
Joining method | Push your feet |
shape | square, fins |
length | 1.181"(30.00mm) |
width | 1.181"(30.00mm) |
diameter | - |
Height from base (fin height) | 0.984"(25.00mm) |
Power dissipation at different temperature rises | - |
Thermal resistance at different forced airflows | 10.79°C/W @ 100 LFM |
Thermal resistance under natural conditions | - |
Material | aluminum |
Material plating | blue anodized |