|
TC75S59F,LF |
TC75S59F(TE85L,F) |
TC75S59FE(TE85L,F) |
TC75S59FU(TE85L,F) |
Description |
IC C0MP GP CMOS OPEN DRAIN SMV |
cmos type OP amp smv |
IC COMP GP CMOS ESV |
IC C0MP GP CMOS PUSH-PULL USV |
Is it Rohs certified? |
- |
conform to |
conform to |
conform to |
Maker |
- |
Toshiba Semiconductor |
Toshiba Semiconductor |
Toshiba Semiconductor |
package instruction |
- |
TSOP, TSOP5/6,.11,37 |
DFP, FL5/6,.047,20 |
TSSOP, TSSOP5/6,.08 |
Reach Compliance Code |
- |
unknown |
unknown |
unknown |
Amplifier type |
- |
COMPARATOR |
COMPARATOR |
COMPARATOR |
Maximum input offset voltage |
- |
7000 µV |
7000 µV |
7000 µV |
JESD-30 code |
- |
R-PDSO-G5 |
R-PDFP-F5 |
R-PDSO-G5 |
Number of functions |
- |
1 |
1 |
1 |
Number of terminals |
- |
5 |
5 |
5 |
Maximum operating temperature |
- |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
- |
-40 °C |
-40 °C |
-40 °C |
Package body material |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
- |
TSOP |
DFP |
TSSOP |
Encapsulate equivalent code |
- |
TSOP5/6,.11,37 |
FL5/6,.047,20 |
TSSOP5/6,.08 |
Package shape |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
- |
SMALL OUTLINE, THIN PROFILE |
FLATPACK |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
power supply |
- |
3/5 V |
3/5 V |
3/5 V |
Certification status |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Nominal response time |
- |
170 ns |
170 ns |
170 ns |
Maximum slew rate |
- |
0.22 mA |
0.22 mA |
0.22 mA |
surface mount |
- |
YES |
YES |
YES |
technology |
- |
CMOS |
CMOS |
CMOS |
Temperature level |
- |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
- |
GULL WING |
FLAT |
GULL WING |
Terminal pitch |
- |
0.95 mm |
0.5 mm |
0.635 mm |
Terminal location |
- |
DUAL |
DUAL |
DUAL |