W25X64VZPIG datasheet, PDF - EEWORLD Datasheet

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W25X64VZPIG: Description2M X 8 FLASH 2.7V PROM, PDSO8; Categorystorage storage; File Size2MB，48 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw

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W25X64VZPIG Overview

2M X 8 FLASH 2.7V PROM, PDSO8

W25X64VZPIG Parametric

Parameter Name	Attribute value
Maker	Winbond Electronics Corporation
Parts packaging code	SON
package instruction	HVSON,
Contacts	8
Reach Compliance Code	unknow
ECCN code	3A991.B.1.A
Maximum clock frequency (fCLK)	33 MHz
JESD-30 code	R-PDSO-N8
length	6 mm
memory density	67108864 bi
Memory IC Type	FLASH
memory width	1
Number of functions	1
Number of terminals	8
word count	67108864 words
character code	64000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	64MX1
Package body material	PLASTIC/EPOXY
encapsulated code	HVSON
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial	SERIAL
Programming voltage	2.7 V
Certification status	Not Qualified
Maximum seat height	0.8 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL
type	NOR TYPE
width	5 mm

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W25X16, W25X32, W25X64

16M-BIT, 32M-BIT, AND 64M-BIT

SERIAL FLASH MEMORY WITH

4KB SECTORS AND DUAL OUTPUT SPI

-1-

Publication Release Date:

March 21, 2007, Revision F

W25X16, W25X32, W25X64

Table of Contents

GENERAL DESCRIPTION ......................................................................................................... 4

FEATURES ................................................................................................................................. 4

PIN CONFIGURATION SOIC 208-MIL....................................................................................... 5

PIN CONFIGURATION WSON 6X5-MM .................................................................................... 5

PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 6

PIN DESCRIPTION SOIC 208-MIL, PDIP 300-MIL, AND WSON 6X5-MM ............................... 6

PIN CONFIGURATION SOIC 300-MIL....................................................................................... 7

PIN DESCRIPTION SOIC 300-MIL ............................................................................................ 7

8.1

8.2

8.3

8.4

8.5

8.6

8.7

10.

Package Types ............................................................................................................... 8

Chip Select (/CS) ............................................................................................................ 8

Serial Data Output (DO) ................................................................................................. 8

Write Protect (/WP)......................................................................................................... 8

HOLD (/HOLD) ............................................................................................................... 8

Serial Clock (CLK) .......................................................................................................... 8

Serial Data Input / Output (DIO) ..................................................................................... 8

BLOCK DIAGRAM ...................................................................................................................... 9

FUNCTIONAL DESCRIPTION ................................................................................................. 10

10.1

SPI OPERATIONS ....................................................................................................... 10

10.1.1

10.1.2

10.1.3

SPI Modes ....................................................................................................................10

Dual Output SPI............................................................................................................10

Hold Function ...............................................................................................................10

Write Protect Features..................................................................................................11

10.2

11.

WRITE PROTECTION.................................................................................................. 11

10.2.1

CONTROL AND STATUS REGISTERS................................................................................... 12

11.1

STATUS REGISTER .................................................................................................... 12

11.1.1

11.1.2

11.1.3

11.1.4

11.1.5

11.1.6

11.1.7

BUSY............................................................................................................................12

Write Enable Latch (WEL) ............................................................................................12

Block Protect Bits (BP2, BP1, BP0)..............................................................................12

Top/Bottom Block Protect (TB).....................................................................................12

Reserved Bits ...............................................................................................................12

Status Register Protect (SRP) ......................................................................................13

Status Register Memory Protection ..............................................................................14

Manufacturer and Device Identification.........................................................................16

Instruction Set...............................................................................................................17

Write Ensable (06h)......................................................................................................18

11.2

INSTRUCTIONS........................................................................................................... 16

11.2.1

11.2.2

11.2.3

-2-

W25X16, W25X32, W25X64

11.2.4

11.2.5

11.2.6

11.2.7

11.2.8

11.2.9

11.2.10

11.2.11

11.2.12

11.2.13

11.2.14

11.2.15

11.2.16

11.2.17

Write Disable (04h).......................................................................................................18

Read Status Register (05h) ..........................................................................................19

Write Status Register (01h) ..........................................................................................20

Read Data (03h) ...........................................................................................................21

Fast Read (0Bh) ...........................................................................................................22

Fast Read Dual Output (3Bh) .......................................................................................23

Page Program (02h) ...................................................................................................24

Sector Erase (20h) .....................................................................................................25

Block Erase (D8h) ......................................................................................................26

Chip Erase (C7h)........................................................................................................27

Power-down (B9h) ......................................................................................................28

Release Power-down / Device ID (ABh) .....................................................................29

Read Manufacturer / Device ID (90h) .........................................................................31

JEDEC ID (9Fh)..........................................................................................................32

12.

ELECTRICAL CHARACTERISTICS (PRELIMINARY)............................................................. 33

12.1

12.2

12.3

12.4

12.5

12.6

12.7

12.8

12.9

12.10

12.11

Absolute Maximum Ratings .......................................................................................... 33

Operating Ranges......................................................................................................... 33

Endurance and Data Retention .................................................................................... 34

Power-up Timing and Write Inhibit Threshold .............................................................. 34

DC Electrical Characteristics ........................................................................................ 35

AC Measurement Conditions........................................................................................ 36

AC Electrical Characteristics ........................................................................................ 37

AC Electrical Characteristics (Cont’d) .......................................................................... 38

Serial Output Timing ..................................................................................................... 39

Input Timing................................................................................................................. 39

Hold Timing ................................................................................................................. 39

8-Pin SOIC 208-mil (Package Code SS)...................................................................... 40

8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 41

8-contact 6x5 WSON .................................................................................................... 42

8-contact 6x5 WSON (Cont’d) ...................................................................................... 43

16-Pin SOIC 300-mil (Winbond Package Code SF)..................................................... 44

13.

PACKAGE SPECIFICATION .................................................................................................... 40

13.1

13.2

13.3

13.4

13.5

14.

15.

ORDERING INFORMATION .................................................................................................... 45

REVISION HISTORY ................................................................................................................ 47

-3-

Publication Release Date:

March 21, 2007, Revision F

W25X16, W25X32, W25X64

1. GENERAL DESCRIPTION

The W25X16 (16M-bit), W25X32 (32M-bit), and W25X64 (64M-bit) Serial Flash memories provide a

storage solution for systems with limited space, pins and power. The 25X series offers flexibility and

performance well beyond ordinary Serial Flash devices. They are ideal for code download applications

as well as storing voice, text and data. The devices operate on a single 2.7V to 3.6V power supply

with current consumption as low as 5mA active and 1µA for power-down. All devices are offered in

space-saving packages.

The W25X16/32/64 array is organized into 8,192/16,384/32,768 programmable pages of 256-bytes

each. Up to 256 bytes can be programmed at a time using the Page Program instruction. Pages can

be erased in groups of 16 (sector erase), groups of 256 (block erase) or the entire chip (chip erase).

The W25X16/32/64 has 512/1024/2048 erasable sectors and 32/64/128 erasable blocks respectively.

The small 4KB sectors allow for greater flexibility in applications that require data and parameter

storage. (See figure 2.)

The W25X16/32/64 supports the standard Serial Peripheral Interface (SPI), and a high performance

dual output SPI using four pins: Serial Clock, Chip Select, Serial Data I/O and Serial Data Out. SPI

clock frequencies of up to 75MHz are supported allowing equivalent clock rates of 150MHz when

using the Fast Read Dual Output instruction. These transfer rates are comparable to those of 8 and

16-bit Parallel Flash memories.

A Hold pin, Write Protect pin and programmable write protect, with top or bottom array control features,

provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and

device identification.

2. FEATURES

•

Family of Serial Flash Memories

–

W25X16: 16M-bit / 2M-byte (2,097,152)

–

W25X32: 32M-bit / 4M-byte (4,194,304)

–

W25X64: 64M-bit / 8M-byte (8,388,608)

– 256-bytes per programmable page

– Uniform 4K-byte Sectors / 64K-byte Blocks

•

SPI with Single or Dual Outputs

– Clock, Chip Select, Data I/O, Data Out

– Optional Hold function for SPI flexibility

•

Data Transfer up to 150M-bits / second

– Clock operation to 75MHz

– Fast Read Dual Output instruction

–

Auto-increment Read capability

•

Flexible Architecture with 4KB sectors

– Sector Erase (4K-bytes)

– Block Erase (64K-byte)

–

Page program up to 256 bytes <2ms

–

Up to 100,000 erase/write cycles

–

20-year retention

•

Low Power Consumption, Wide

Temperature Range

– Single 2.7 to 3.6V supply

– 5mA active current, 1µA Power-down (typ)

– -40° to +85°C operating range

•

Software and Hardware Write Protection

– Write-Protect all or portion of memory

– Enable/Disable protection with /WP pin

–

Top or bottom array protection

•

Space Efficient Packaging

– 8-pin SOIC 208-mil (W25X16, X32)

– 8-pin PDIP 300-mil (W25X16, X32, X64)

– 16-pin SOIC 300-mil (W25X16, X32, X64)

– 8-pad WSON 6x5-mm (W25X16)

– 8-pad WSON 8x6-mm (W25X32, X64)

-4-

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