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WEDPN8M64V-125B2C

Description
8Mx64 Synchronous DRAM
Categorystorage    storage   
File Size461KB,15 Pages
ManufacturerWhite Electronic Designs Corporation
Websitehttp://www.wedc.com/
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WEDPN8M64V-125B2C Overview

8Mx64 Synchronous DRAM

WEDPN8M64V-125B2C Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerWhite Electronic Designs Corporation
package instructionBGA,
Reach Compliance Codeunknow
access modeFOUR BANK PAGE BURST
Maximum access time6 ns
Other featuresAUTO/SELF REFRESH
Spare memory width32
JESD-30 codeS-PBGA-B219
memory density536870912 bi
Memory IC TypeSYNCHRONOUS DRAM
memory width64
Number of functions1
Number of ports1
Number of terminals219
word count8388608 words
character code8000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize8MX64
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
self refreshYES
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED

WEDPN8M64V-125B2C Preview

White Electronic Designs
8Mx64 Synchronous DRAM
FEATURES
High Frequency = 100, 125, 133MHz
Package:
• 219 Plastic Ball Grid Array (PBGA), 21 x 21mm
Single 3.3V ±0.3V power supply
Unbuffered
Fully synchronous; all signals registered on positive edge of
system clock cycle
Internal pipelined operation; column address can be changed
every clock cycle
Internal banks for hiding row access/precharge
Programmable Burst length 1,2,4,8 or full page
4,096 refresh cycles
Commercial, Industrial and Military Temperature Ranges
Organized as 8M x 64
• User Configurable as 2 x 8M x 32 or
4 x 8M x 16
Weight: WEDPN8M64V-XB2X - 2 grams typical
WEDPN8M64V-XB2X
GENERAL DESCRIPTION
The 64MByte (512Mb) SDRAM is a high-speed CMOS,
dynamic random-access memory using 4 chips containing
134,217,728 bits. Each chip is internally configured as a
quad-bank DRAM with a synchronous interface. Each of
the chip’s 33,554,432-bit banks is organized as 4,096 rows
by 512 columns by 16 bits.
Read and write accesses to the SDRAM are burst oriented;
accesses start at a selected location and continue for
a programmed number of locations in a programmed
sequence. Accesses begin with the registration of an
ACTIVE command, which is then followed by a READ or
WRITE command. The address bits registered coincident
with the ACTIVE command are used to select the bank
and row to be accessed (BA0, BA1 select the bank; A0-
11 select the row). The address bits registered coincident
with the READ or WRITE command are used to select the
starting column location for the burst access.
The SDRAM provides for programmable READ or WRITE
burst lengths of 1, 2, 4 or 8 locations, or the full page, with
a burst terminate option. An AUTO PRECHARGE function
may be enabled to provide a self-timed row precharge that
is initiated at the end of the burst sequence.
The 512Mb SDRAM uses an internal pipelined architecture
to achieve high-speed operation. This architecture is
compatible with the 2n rule of prefetch architectures, but
it also allows the column address to be changed on every
clock cycle to achieve a high-speed, fully random access.
Precharging one bank while accessing one of the other
three banks will hide the precharge cycles and provide
seamless, high-speed, random-access operation.
BENEFITS
58% SPACE SAVINGS
Reduced part count
Reduced trace lengths for lower parasitic capacitance
Laminate interposer for optimum TCE match
Suitable for hi-reliability applications
Upgradeable to 16M x 64 density (WEDPN16M64V-XB2X)
* This product is subject to change without notice.
Discrete Approach
11.9
ACTUAL SIZE
21
22.3
WEDPN8M64V-XB2X
21
S
A
V
I
N
G
S
58%
Area
January 2005
Rev. 2
4 x 265mm
2
= 1060mm
2
1
441mm
2
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
FIGURE 1 – PIN CONFIGURATION
Top View
WEDPN8M64V-XB2X
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
DQ
1
2
DQ
0
3
DQ
14
4
DQ
15
5
V
SS
6
V
SS
7
A
9
8
A
10
9 10
A
11
A
8
11 12
V
CC
V
CC
13 14
DQ
16
DQ
17
15 16
DQ
31
V
SS
DQ
2
DQ
12
DQ
13
V
SS
V
SS
A
0
A
7
A
6
A
1
V
CC
V
CC
DQ
18
DQ
19
DQ
29
DQ
30
DQ
3
DQ
4
DQ
10
DQ
11
V
CC
V
CC
A
2
A
5
A
4
A
3
V
SS
V
SS
DQ
20
DQ
21
DQ
27
DQ
28
DQ
6
DQ
5
DQ
8
DQ
9
V
CC
V
CC
DNU
DNU
DNU
DNU
V
SS
V
SS
DQ
22
DQ
23
DQ
26
DQ
25
DQ
7
DQML0
V
CC
DQMH0
Vss
Vss
NC
BA
0
BA
1
NC
Vss
Vss
DQML1
V
SS
Vss
DQ
24
CAS
0
#
WE
0
#
V
CC
CLK
0
Vss
RAS
1
#
WE
1
#
V
SS
DQMH1
CLK
1
CS
0
#
RAS
0
#
V
CC
CKE
0
Vss
CAS
1
#
CS
1
#
V
SS
Vcc
CKE
1
V
SS
V
SS
V
CC
V
CC
V
SS
V
CC
V
SS
Vss
V
CC
V
CC
V
SS
V
SS
V
CC
V
CC
V
SS
V
CC
V
SS
V
SS
V
CC
V
CC
Vss
CKE
3
V
CC
CS
3
#
Vss
Vcc
CKE
2
V
SS
RAS
2
#
CS
2
#
Vss
CLK
3
V
CC
CAS
3
#
RAS
3
#
Vcc
CLK
2
V
SS
WE
2
#
CAS
2
#
DQ
56
DQMH3
V
CC
WE
3
#
DQML3
Vcc
Vcc
Vcc
Vss
Vss
Vss
Vss
DQMH2
V
SS
DQML2
DQ
39
DQ
57
DQ
58
DQ
55
DQ
54
Vcc
Vcc
Vcc
Vcc
Vss
Vss
Vss
Vss
DQ
41
DQ
40
DQ
37
DQ
38
DQ
60
DQ
59
DQ
53
DQ
52
V
SS
V
SS
Vcc
Vcc
Vss
Vss
V
CC
V
CC
DQ
43
DQ
42
DQ
36
DQ
35
DQ
62
DQ
61
DQ
51
DQ
50
V
CC
V
CC
Vss
Vss
Vcc
Vcc
V
SS
V
SS
DQ
45
DQ
44
DQ
34
DQ
33
Vss
DQ
63
DQ
49
DQ
48
V
CC
V
CC
Vss
Vss
Vcc
Vcc
V
SS
V
SS
DQ
47
DQ
46
DQ
32
V
CC
NOTE: DNU = Do Not Use; to be left unconnected for future upgrades.
NC = Not Connected Internally.
January 2005
Rev. 2
2
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
WEDPN8M64V-XB2X
FIGURE. 2 – FUNCTIONAL BLOCK DIAGRAM
WE
0
#
RAS
0
#
CAS
0
#
WE# RAS# CAS#
A
0-11
BA
0-1
CLK
0
CKE
0
CS
0
#
DQML
0
DQMH
0
A
0-11
BA
0-1
DQ
0
DQ
0
8M x 16
CLK
U0
CKE
CS#
DQML
DQMH
DQ
15
DQ
15
WE
1
#
RAS
1
#
CAS
1
#
WE# RAS# CAS#
A
0-11
BA
0-1
DQ
0
DQ
16
CLK
1
CKE
1
CS
1
#
DQML
1
DQMH
1
8M x 16
CLK
U1
CKE
CS#
DQML
DQMH
DQ
15
DQ
31
WE
2
#
RAS
2
#
CAS
2
#
WE# RAS# CAS#
A
0-11
BA
0-1
DQ
0
DQ
32
CLK
2
CKE
2
CS
2
#
DQML
2
DQMH
2
8M x 16
CLK
U2
CKE
CS#
DQML
DQMH
DQ
15
DQ
47
WE
3
#
RAS
3
#
CAS
3
#
WE# RAS# CAS#
A
0-11
BA
0-1
DQ
0
DQ
48
CLK
3
CKE
3
CS
3
#
DQML
3
DQMH
3
8M x 16
CLK
U3
CKE
CS#
DQML
DQMH
DQ
15
DQ
63
January 2005
Rev. 2
3
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
The 512Mb SDRAM is designed to operate in 3.3V, low-
power memory systems. An auto refresh mode is provided,
along with a power-saving, power-down mode.
All inputs and outputs are LVTTL compatible. SDRAMs offer
substantial advances in DRAM operating performance,
including the ability to synchronously burst data at a high
data rate with automatic column-address generation,
the ability to interleave between internal banks in order
to hide precharge time and the capability to randomly
change column addresses on each clock cycle during a
burst access.
WEDPN8M64V-XB2X
must be performed. After the AUTO REFRESH cycles
are complete, the SDRAM is ready for Mode Register
programming. Because the Mode Register will power up
in an unknown state, it should be loaded prior to applying
any operational command.
REGISTER DEFINITION
MODE REGISTER
The Mode Register is used to define the specific mode
of operation of the SDRAM. This definition includes the
selec-tion of a burst length, a burst type, a CAS latency,
an operating mode and a write burst mode, as shown in
Figure 3. The Mode Register is programmed via the LOAD
MODE REGISTER command and will retain the stored
information until it is programmed again or the device
loses power.
Mode register bits M0-M2 specify the burst length, M3
specifies the type of burst (sequential or interleaved),
M4-M6 specify the CAS latency, M7 and M8 specify the
operating mode, M9 specifies the WRITE burst mode, and
M10 and M11 are reserved for future use.
The Mode Register must be loaded when all banks are
idle, and the controller must wait the specified time before
initiating the subsequent operation. Violating either of these
requirements will result in unspecified operation.
FUNCTIONAL DESCRIPTION
Read and write accesses to the SDRAM are burst oriented;
accesses start at a selected location and continue for
a programmed number of locations in a programmed
sequence. Accesses begin with the registration of an
ACTIVE command which is then followed by a READ or
WRITE command. The address bits registered coincident
with the ACTIVE command are used to select the bank
and row to be accessed (BA
0
and BA
1
select the bank,
A
0-11
select the row). The address bits (A
0-8
) registered
coincident with the READ or WRITE command are used to
select the starting column location for the burst access.
Prior to normal operation, the SDRAM must be initialized.
The following sections provide detailed information
covering device initialization, register definition, command
descriptions and device operation.
BURST LENGTH
Read and write accesses to the SDRAM are burst oriented,
with the burst length being programmable, as shown
in Figure 3. The burst length determines the maximum
number of column locations that can be accessed for a
given READ or WRITE command. Burst lengths of 1, 2, 4
or 8 locations are available for both the sequential and the
interleaved burst types, and a full-page burst is available
for the sequential type. The full-page burst is used in
conjunction with the BURST TERMINATE command to
generate arbitrary burst lengths.
Reserved states should not be used, as unknown operation
or incompatibility with future versions may result.
When a READ or WRITE command is issued, a block of
columns equal to the burst length is effectively selected.
All accesses for that burst take place within this block,
meaning that the burst will wrap within the block if a
boundary is reached. The block is uniquely selected by
A
1-8
when the burst length is set to two; by A
2-8
when
the burst length is set to four; and by A
3-8
when the burst
4
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
INITIALIZATION
SDRAMs must be powered up and initialized in a
predefined manner. Operational procedures other than
those specified may result in undefined operation. Once
power is applied and the clock is stable (stable clock
is defined as a signal cycling within timing constraints
specified for the clock pin), the SDRAM requires a
100µs delay prior to issuing any command other than a
COMMAND INHIBIT or a NOP. Starting at some point
during this 100µs period and continuing at least through the
end of this period, COMMAND INHIBIT or NOP commands
should be applied.
Once the 100µs delay has been satisfied with at least
one COMMAND INHIBIT or NOP command having been
applied, a PRECHARGE command should be applied. All
banks must be precharged, thereby placing the device in
the all banks idle state.
Once in the idle state, two AUTO REFRESH cycles
January 2005
Rev. 2
White Electronic Designs
length is set to eight. The remaining (least significant)
address bit(s) is (are) used to select the starting location
within the block. Full-page bursts wrap within the page if
the boundary is reached.
WEDPN8M64V-XB2X
either sequential or interleaved; this is referred to as the
burst type and is selected via bit M3.
The ordering of accesses within a burst is determined by
the burst length, the burst type and the starting column
address, as shown in Table 1.
BURST TYPE
Accesses within a given burst may be programmed to be
FIGURE 3 – MODE REGISTER DEFINITION
A
11
A
10
A
9
A
8
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
Address Bus
TABLE 1 – BURST DEFINITION
Burst
Length
2
A1
0
0
1
1
A1
0
0
1
1
0
0
1
1
Starting Column
Address
A0
0
1
A0
0
1
0
1
A0
0
1
0
1
0
1
0
1
Order of Accesses Within a Burst
Type = Sequential
0-1
1-0
0-1-2-3
1-2-3-0
2-3-0-1
3-0-1-2
0-1-2-3-4-5-6-7
1-2-3-4-5-6-7-0
2-3-4-5-6-7-0-1
3-4-5-6-7-0-1-2
4-5-6-7-0-1-2-3
5-6-7-0-1-2-3-4
6-7-0-1-2-3-4-5
7-0-1-2-3-4-5-6
Cn, Cn + 1, Cn + 2
Cn + 3, Cn + 4...
…Cn - 1,
Cn…
Type = Interleaved
0-1
1-0
0-1-2-3
1-0-3-2
2-3-0-1
3-2-1-0
0-1-2-3-4-5-6-7
1-0-3-2-5-4-7-6
2-3-0-1-6-7-4-5
3-2-1-0-7-6-5-4
4-5-6-7-0-1-2-3
5-4-7-6-1-0-3-2
6-7-4-5-2-3-0-1
7-6-5-4-3-2-1-0
Not Supported
Mode Register (Mx)
Reserved* WB Op Mode CAS Latency
BT
Burst Length
*Should program
M11, M10 = 0, 0
to ensure compatibility
with future devices.
M2 M1M0
0 0 0
0 0 1
0 1 0
0 1 1
1 0 0
1 0 1
1 1 0
1 1 1
1
2
4
8
Burst Length
M3 = 0
M3 = 1
1
2
4
8
Reserved
Reserved
Reserved
Reserved
4
Reserved
Reserved
Reserved
Full Page
8
M3
0
1
Burst Type
Sequential
Interleaved
A2
0
0
0
0
1
1
1
1
M6 M5 M4
0 0 0
0 0 1
0 1 0
0 1 1
1 0 0
1 0 1
1 1 0
1 1 1
CAS Latency
Reserved
Reserved
2
3
Reserved
Reserved
Reserved
Reserved
Full
Page
(y)
n = A
0-9/8/7
(location 0-y)
M8
0
-
M7
0
-
M6-M0
Defined
-
Operating Mode
Standard Operation
All other states reserved
M9
0
1
Write Burst Mode
Programmed Burst Length
Single Location Access
NOTES:
1. For full-page accesses: y = 512.
2. For a burst length of two, A
1-8
select the block-of-two burst; A0 selects the starting
column within the block.
3. For a burst length of four, A
2-8
select the block-of-four burst; A0-1 select the starting
column within the block.
4. For a burst length of eight, A
3-8
select the block-of-eight burst; A
0-2
select the
starting column within the block.
5. For a full-page burst, the full row is selected and A
0-8
select the starting column.
6. Whenever a boundary of the block is reached within a given sequence above, the
following access wraps within the block.
7. For a burst length of one, A
0-8
select the unique column to be accessed, and Mode
Register bit M3 is ignored.
January 2005
Rev. 2
5
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

WEDPN8M64V-125B2C Related Products

WEDPN8M64V-125B2C WEDPN8M64V-100B2M WEDPN8M64V-133B2M WEDPN8M64V-XB2X WEDPN8M64V-125B2M WEDPN8M64V-133B2I WEDPN8M64V-133B2C WEDPN8M64V-125B2I WEDPN8M64V-100B2C WEDPN8M64V-100B2I
Description 8Mx64 Synchronous DRAM 8Mx64 Synchronous DRAM 8Mx64 Synchronous DRAM 8Mx64 Synchronous DRAM 8Mx64 Synchronous DRAM 8Mx64 Synchronous DRAM 8Mx64 Synchronous DRAM 8Mx64 Synchronous DRAM 8Mx64 Synchronous DRAM 8Mx64 Synchronous DRAM
Is it Rohs certified? incompatible incompatible incompatible - incompatible incompatible incompatible incompatible incompatible incompatible
Maker White Electronic Designs Corporation White Electronic Designs Corporation White Electronic Designs Corporation - White Electronic Designs Corporation White Electronic Designs Corporation White Electronic Designs Corporation White Electronic Designs Corporation White Electronic Designs Corporation White Electronic Designs Corporation
package instruction BGA, BGA, BGA, - BGA, BGA, BGA, BGA, BGA, BGA,
Reach Compliance Code unknow unknow unknow - unknow unknow unknow unknow unknow unknow
access mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST - FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Maximum access time 6 ns 7 ns 5.5 ns - 6 ns 5.5 ns 5.5 ns 6 ns 7 ns 7 ns
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH - AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
Spare memory width 32 32 32 - 32 32 32 32 32 32
JESD-30 code S-PBGA-B219 S-PBGA-B219 S-PBGA-B219 - S-PBGA-B219 S-PBGA-B219 S-PBGA-B219 S-PBGA-B219 S-PBGA-B219 S-PBGA-B219
memory density 536870912 bi 536870912 bi 536870912 bi - 536870912 bi 536870912 bi 536870912 bi 536870912 bi 536870912 bi 536870912 bi
Memory IC Type SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM - SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM
memory width 64 64 64 - 64 64 64 64 64 64
Number of functions 1 1 1 - 1 1 1 1 1 1
Number of ports 1 1 1 - 1 1 1 1 1 1
Number of terminals 219 219 219 - 219 219 219 219 219 219
word count 8388608 words 8388608 words 8388608 words - 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words
character code 8000000 8000000 8000000 - 8000000 8000000 8000000 8000000 8000000 8000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 125 °C 125 °C - 125 °C 85 °C 70 °C 85 °C 70 °C 85 °C
Minimum operating temperature - -55 °C -55 °C - -55 °C -40 °C - -40 °C - -40 °C
organize 8MX64 8MX64 8MX64 - 8MX64 8MX64 8MX64 8MX64 8MX64 8MX64
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA - BGA BGA BGA BGA BGA BGA
Package shape SQUARE SQUARE SQUARE - SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY - GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
self refresh YES YES YES - YES YES YES YES YES YES
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V - 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V - 3 V 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V - 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES - YES YES YES YES YES YES
technology CMOS CMOS CMOS - CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL MILITARY MILITARY - MILITARY INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL
Terminal form BALL BALL BALL - BALL BALL BALL BALL BALL BALL
Terminal pitch 1.27 mm 1.27 mm 1.27 mm - 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM BOTTOM - BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED

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