HIGH-SPEED 2K x 8 REGISTERED CMOS PROM/RPROM
WS57C45-25 | WS57C45-35T | WS57C45-35S | WS57C45-35KMB | WS57C45-25T | |
---|---|---|---|---|---|
Description | HIGH-SPEED 2K x 8 REGISTERED CMOS PROM/RPROM | HIGH-SPEED 2K x 8 REGISTERED CMOS PROM/RPROM | HIGH-SPEED 2K x 8 REGISTERED CMOS PROM/RPROM | HIGH-SPEED 2K x 8 REGISTERED CMOS PROM/RPROM | HIGH-SPEED 2K x 8 REGISTERED CMOS PROM/RPROM |
Is it Rohs certified? | - | conform to | conform to | incompatible | conform to |
Parts packaging code | - | DIP | DIP | DIP | DIP |
package instruction | - | 0.300 INCH, CERDIP-24 | 0.300 INCH, PLASTIC, DIP-24 | 0.300 INCH, CERDIP-24 | 0.300 INCH, CERDIP-24 |
Contacts | - | 24 | 24 | 24 | 24 |
Reach Compliance Code | - | compli | compli | _compli | compli |
ECCN code | - | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | - | 15 ns | 15 ns | 15 ns | 12 ns |
I/O type | - | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | - | R-GDIP-T24 | R-PDIP-T24 | R-GDIP-T24 | R-GDIP-T24 |
JESD-609 code | - | e3 | e3 | e0 | e3 |
length | - | 32.005 mm | 32.005 mm | 32.005 mm | 32.005 mm |
memory density | - | 16384 bi | 16384 bi | 16384 bi | 16384 bi |
Memory IC Type | - | UVPROM | OTP ROM | UVPROM | UVPROM |
memory width | - | 8 | 8 | 8 | 8 |
Humidity sensitivity level | - | 1 | 1 | - | 1 |
Number of functions | - | 1 | 1 | 1 | 1 |
Number of terminals | - | 24 | 24 | 24 | 24 |
word count | - | 2048 words | 2048 words | 2048 words | 2048 words |
character code | - | 2000 | 2000 | 2000 | 2000 |
Operating mode | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | - | 70 °C | 70 °C | 125 °C | 70 °C |
organize | - | 2KX8 | 2KX8 | 2KX8 | 2KX8 |
Output characteristics | - | REGISTERED | REGISTERED | REGISTERED | REGISTERED |
Package body material | - | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
encapsulated code | - | WDIP | DIP | WDIP | WDIP |
Encapsulate equivalent code | - | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 |
Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | - | IN-LINE, WINDOW | IN-LINE | IN-LINE, WINDOW | IN-LINE, WINDOW |
Parallel/Serial | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | - | 225 | 225 | NOT SPECIFIED | 225 |
power supply | - | 5 V | 5 V | 5 V | 5 V |
Programming voltage | - | 13.5 V | 13.5 V | 13.5 V | 13.5 V |
Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | - | 5.08 mm | 4.32 mm | 5.08 mm | 5.08 mm |
Maximum standby current | - | 0.02 A | 0.02 A | 0.03 A | 0.02 A |
Maximum slew rate | - | 0.082 mA | 0.082 mA | 0.092 mA | 0.105 mA |
Maximum supply voltage (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | - | 5 V | 5 V | 5 V | 5 V |
surface mount | - | NO | NO | NO | NO |
technology | - | CMOS | CMOS | CMOS | CMOS |
Temperature level | - | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL |
Terminal surface | - | MATTE TIN | MATTE TIN | Tin/Lead (Sn/Pb) | MATTE TIN |
Terminal form | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | - | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | - | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |