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LTC4308CMS8#PBF

Description
IC ACCELERATOR I2C HOTSWAP 8MSOP
CategoryPower/power management    The power supply circuit   
File Size164KB,16 Pages
ManufacturerLinear ( ADI )
Websitehttp://www.analog.com/cn/index.html
Environmental Compliance
Download Datasheet Parametric Compare View All

LTC4308CMS8#PBF Overview

IC ACCELERATOR I2C HOTSWAP 8MSOP

LTC4308CMS8#PBF Parametric

Parameter NameAttribute value
Brand NameLinear Technology
Is it Rohs certified?conform to
MakerLinear ( ADI )
Parts packaging codeMSOP
package instructionTSSOP,
Contacts8
Manufacturer packaging codeMS8
Reach Compliance Codecompliant
ECCN codeEAR99
Adjustable thresholdNO
Analog Integrated Circuits - Other TypesPOWER SUPPLY SUPPORT CIRCUIT
JESD-30 codeS-PDSO-G8
JESD-609 codee3
length3 mm
Humidity sensitivity level1
Number of channels1
Number of functions1
Number of terminals8
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Package shapeSQUARE
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.1 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2.3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
Temperature levelCOMMERCIAL
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width3 mm
FEATURES
n
n
n
n
n
n
n
n
n
n
n
n
LTC4308
Low Voltage, Level Shifting
Hot Swappable 2-Wire Bus
Buffer with Stuck Bus Recovery
DESCRIPTION
The LTC
®
4308 hot swappable, 2-wire bus buffer allows
I/O card insertion into a live backplane without corrup-
tion of the data and clock busses. The LTC4308 provides
bidirectional buffering, keeping the backplane and card
capacitances isolated. Negative offset from output to
input allows communication between output bus devices
with high V
OL
and devices on the low voltage input side,
where bus supplies can be as low as 0.9V. If SDAOUT or
SCLOUT are low for 30ms, the LTC4308 will automati-
cally break the Input-Output connection. At this time the
LTC4308 automatically generates up to 16 clock pulses
on SCLOUT in an attempt to free the bus. A connection
will resume if the stuck bus is cleared.
During insertion, the SDAOUT and SCLOUT lines are pre-
charged to 1V to minimize bus disturbances. When driven
high, the ENABLE input allows the LTC4308 to connect after
a stop bit or bus idle condition. Driving ENABLE low breaks
the connection between SDAIN and SDAOUT, SCLIN and
SCLOUT. READY is an open-drain output which indicates
that the backplane and card sides are connected.
L,
LT, LTC and LTM are registered trademarks of Linear Technology Corporation. Hot Swap
is a trademark of Linear Technology Corporation. All other trademarks are the property of their
respective owners. Protected by U.S. Patents including 7032051, 6650174, 6356140.
Optimized for Low Voltage Systems Down to 0.9V
Bidirectional Buffer with Stuck Bus Recovery
–200mV Offset In-Out/+300mV Offset Out-In
30ms Stuck Bus Timeout
Compatible with Non-Compliant V
OL
I
2
C Devices
Prevents SDA and SCL Corruption During Live
Board Insertion and Removal from Backplane
±6kV Human Body Model (HBM) ESD Protection
Isolates Input SDA and SCL Lines from Output
Compatible with I
2
C™, I
2
C Fast Mode and SMBus
READY Open-Drain Output
1V Precharge on SDAOUT and SCLOUT Lines
Small 8-Lead (3mm × 3mm × 0.75mm) DFN and
8-Lead MSOP Packages
APPLICATIONS
n
n
n
n
n
Live Board Insertion
Servers
Capacitance Buffer/Bus Extender
RAID Systems
ATCA
TYPICAL APPLICATION
The LTC4308 in a 1.2V
Microcontroller Application
1.2V
0.01μF
2.7k
2.7k
10k
2.7k
2.7k
5V
1.2V to 5V Level Shifting
SDAOUT
2V/DIV
CH1
V
CC
LTC4308
SCLIN
SCLOUT
CARD_SCL
SDAIN
0.5V/DIV
CH2
MICRO-
CONTROLLER
SDAIN
ENABLE
SDAOUT
CARD_SDA
4308 TA01a
READY
GND
READY
1μs/DIV
4308 TA01b
4308f
1

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Description IC ACCELERATOR I2C HOTSWAP 8MSOP IC ACCELERATOR I2C HOTSWAP 8MSOP IC ACCELERATOR I2C HOTSWAP 8DFN IC ACCELERATOR I2C HOTSWAP 8MSOP IC ACCELERATOR I2C HOTSWAP 8DFN IC ACCELERATOR I2C HOTSWAP 8DFN IC ACCELERATOR I2C HOTSWAP 8DFN IC ACCELERATOR I2C HOTSWAP 8MSOP
Brand Name Linear Technology Linear Technology Linear Technology Linear Technology Linear Technology Linear Technology Linear Technology Linear Technology
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to conform to
Maker Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI ) Linear ( ADI )
Parts packaging code MSOP MSOP DFN MSOP DFN DFN DFN MSOP
package instruction TSSOP, TSSOP, HVSON, TSSOP, HVSON, HVSON, HVSON, TSSOP,
Contacts 8 8 8 8 8 8 8 8
Manufacturer packaging code MS8 MS8 DD MS8 DD DD DD MS8
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Adjustable threshold NO NO NO NO NO NO NO NO
Analog Integrated Circuits - Other Types POWER SUPPLY SUPPORT CIRCUIT POWER SUPPLY SUPPORT CIRCUIT POWER SUPPLY SUPPORT CIRCUIT POWER SUPPLY SUPPORT CIRCUIT POWER SUPPLY SUPPORT CIRCUIT POWER SUPPLY SUPPORT CIRCUIT POWER SUPPLY SUPPORT CIRCUIT POWER SUPPLY SUPPORT CIRCUIT
JESD-30 code S-PDSO-G8 S-PDSO-G8 S-PDSO-N8 S-PDSO-G8 S-PDSO-N8 S-PDSO-N8 S-PDSO-N8 S-PDSO-G8
JESD-609 code e3 e3 e3 e3 e3 e3 e3 e3
length 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm
Humidity sensitivity level 1 1 1 1 1 1 1 1
Number of channels 1 1 1 1 1 1 1 1
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 8 8 8 8 8 8 8 8
Maximum operating temperature 70 °C 85 °C 70 °C 70 °C 70 °C 85 °C 85 °C 85 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP TSSOP HVSON TSSOP HVSON HVSON HVSON TSSOP
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260 260 260
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.1 mm 1.1 mm 0.8 mm 1.1 mm 0.8 mm 0.8 mm 0.8 mm 1.1 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES
Temperature level COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn)
Terminal form GULL WING GULL WING NO LEAD GULL WING NO LEAD NO LEAD NO LEAD GULL WING
Terminal pitch 0.65 mm 0.65 mm 0.5 mm 0.65 mm 0.5 mm 0.5 mm 0.5 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 30 30 30 30 30 30 30
width 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm
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