A range of dc rated multi-layer chip capacitors from
0.47pF to 22µF and in case sizes 0603 to 8060 in
C0G/NP0 and X7R dielectrics. Suitable for all general
purpose and high reliability applications where package
size and reliability are important. All are manufactured
using Syfer’s unique wet process and incorporate
precious metal electrodes.
Dissipation Factor
Ageing Rate
Range Dimensions – Standard MLCC Ranges
Length
(L1)
mm/inches
1.6 ± 0.2
0.063 ± 0.008
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
5.7 ± 0.4
0.225 ± 0.016
5.7 ± 0.4
0.225 ± 0.016
9.2 ± 0.5
0.36 ± 0.02
14.0 ± 0.5
0.55 ± 0.02
20.3 ± 0.5
0.8 ± 0.02
Width
(W)
mm/inches
0.8 ± 0.2
0.031 ± 0.008
1.25 ± 0.2
0.05 ± 0.008
1.6 ± 0.2
0.063 ± 0.008
2.5 ± 0.3
0.1 ± 0.012
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
6.30 ± 0.4
0.25 ± 0.016
5.0 ± 0.4
0.197 ± 0.016
6.3 ± 0.4
0.25 ± 0.016
10.16 ± 0.5
0.4 ± 0.02
12.7 ± 0.5
0.5 ± 0.02
15.24 ± 0.5
0.6 ± 0.02
Max. Thickness
(T)
mm/inches
0.8
0.013
1.3
0.051
1.6
0.063
2.0
0.08
2.0
0.08
2.5
0.1
2.5
0.1
4.2
0.16
4.2
0.16
2.5
0.1
4.2
0.16
2.5
0.1
Termination Band
(L2)
mm/inches
min
0.10
0.004
0.13
0.005
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.5
0.02
0.5
0.02
0.5
0.02
max
0.40
0.015
0.75
0.03
0.75
0.03
0.75
0.03
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.5
0.06
1.5
0.06
1.5
0.06
Size
0603
0805
1206
1210
1808
1812
1825
2220
2225
3640
5550
8060
Custom chip sizes not included in the table, but larger than 2225, can be considered with minimum tooling charges. Please refer specific requests direct to the sales office.
Max thickness relates to standard components and actual thickness may be considerably less. Thicker parts, or components with reduced maximum thickness, can be considered by request – please refer
Live Topic: A new generation of products based on the optimized design of Melexis second-generation position sensors, with higher performance and competitive costBrief introduction: This seminar mainl...
This chip has not been found. Does anyone know what it will be called after the name is changed? If it is discontinued, what should be used to replace it?...
Remote control firmware burning
Remote control firmware burning
The firmware here refers to the Hex or Bin file compiled from the source code , where Hex is a hexadecimal file and Bin is a binary file...
New Year's Day is here, and the Spring Festival can't be far behind. On this occasion of festive occasions, please allow EEWorld to send the most sincere blessings and... ahem, tangible feedback to ou...
In a project, the author came into contact with such a communication system. The communication architecture of the entire system is roughly as shown in the figure below, a typical one-master-multiple-...
14.1 Overview
The NuMicro M051 series has 64K/32K/16K/8K bytes of on-chip FLASH EEPROM for storing application programs (APROM). Users can update the program in FLASH through ISP/IAP. ...[Details]
When using DSP for digital signal processing, it is usually necessary to use a sampling circuit to sample the analog signal, and then use an A/D converter to convert it into a digital signal for data ...[Details]
Today (23), Tom Caulfield, CEO of wafer foundry giant GlobalFoundries, said that the chip industry's production capacity must be doubled in the next 8 to 10 years to solve the chip shortage and the g...[Details]
Introduction to S parameters
S (scattering) parameters are used to characterize electrical networks using matched impedances. Scattering here is the way that current or voltage is affected when the...[Details]
An investor asked on the investor interaction platform: Will Unilumin Technology's Mini LED share gradually increase in the future? Can production capacity be released? What is the MicroLED technolog...[Details]
BioSolar has filed a patent application for its Silicon Alloy Anode for High Power Batteries to protect its high-power battery plus silicon technology, which is designed for high-power batteries in a...[Details]
Often, when we use Wi-Fi technology, we always complain that the signal range is not wide enough or the signal is not strong enough. However, have you ever thought whether limited signal range and lim...[Details]
Collaborative robots
are
robots
that can physically interact with humans in a shared working environment
. They are designed to be flexible, safe and easy to use. They can improve prod...[Details]
It’s not easy to learn something. It took me 6 hours to finally understand filtering. The key was that I didn’t find a suitable example. STM8S provides six 32-bit filter registers. We will only discu...[Details]
How Silicon Carbide can Enable Next-generation Solid State Circuit Breakers ONSAR3163 How to use silicon carbide to create the next generation of solid-state circuit breakers Today, the performa...[Details]
The triode is a current amplifier device with three poles, namely the collector C, the base B, and the emitter E. It is divided into two types: NPN and PNP. We only take the common emitter amplifier ...[Details]
In order to understand how u-boot performs hardware ECC, let's briefly analyze the related functions. NandFlash performs read and write operations in pages as the smallest unit. The read operation ...[Details]
'/////////////////////////////////////////
'Read DS18B20 temperature data and display it on LCD
'Designer Ah Yi
'Compiler BASCOM-AVR1.11.8.1
'/////////////////////////////////////////
$reg...[Details]
China Energy Storage Network:
Energy Internet is a huge infrastructure. The network value of the energy Internet based on electricity is significant, which is manifested in economic value and...[Details]
On November 7, Nissan Motor said it plans to launch new energy vehicle models in China and plug-in hybrid vehicles in the United States.
The company also announced its latest goal: to shorten ...[Details]