ATS-03D-03-C2-R0 datasheet, PDF

ATS-03D-03-C2-R0: DescriptionHEATSINK 40X40X15MM XCUT T766; CategoryThermal management products; File Size134KB，1 Pages; ManufacturerERP; Environmental Compliance

Download Datasheet Parametric View All

ATS-03D-03-C2-R0 Overview

HEATSINK 40X40X15MM XCUT T766

Parameter Name	Attribute value
type	top installation
cooling package	Classification (BGA, LGA, CPU, ASIC...)
Joining method	Push your feet
shape	square, fins
length	1.575"（40.00mm）
width	1.575"（40.00mm）
diameter	-
Height from base (fin height)	0.590"（15.00mm）
Power dissipation at different temperature rises	-
Thermal resistance at different forced airflows	15.85°C/W @ 100 LFM
Thermal resistance under natural conditions	-
Material	aluminum
Material plating	blue anodized

EEWORLD University - Mechanics in Electronic Packaging: Mechanics in Electronic Packaging : https://training.eeworld.com.cn/course/5211Mechanics in Electronic Packaging Liu Sheng, Huazhong University of Science and Technology...; 木犯001号 Analog electronics

Nandflash mass production burning mine clearance strategy: Nandflash chips are widely used in electronic products for their high cost performance and large storage capacity. However, in this large-volume and high-quality application field, many customers are ...; ohahaha PCB Design

Synplicity releases DSP software to accelerate algorithm implementation in silicon: Synplicity recently announced that it has enhanced its Synplify DSP solution to further accelerate the implementation of DSP algorithms in chips. Synplify DSP software is Synplicity's ESL synthesis pl...; frozenviolet Automotive Electronics

WZ-S Formaldehyde Sensor: [color=rgb(68, 68, 68)][backcolor=transparent][font=Tahoma,]Has anyone used the WZ-S formaldehyde sensor component?[/font][/backcolor][/color] [color=rgb(68, 68, 68)][backcolor=transparent][font=Tahom...; gaoyingjia stm32/stm8

There is a lot of knowledge in IO chip troubleshooting: Good stuff to share with everyone...; feifei PCB Design

There is a problem with the inner electrical layer segmentation. Let the experts take a look.: [size=14px]There is no power network in the highlighted part of the inner electrical layer image. Should I set this part of the network to GND or NO Net or divide it into a power network? I don't know...; li6666 PCB Design

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components