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R1LV3216RSD-7SI#B0

Description
IC SRAM 32M PARALLEL 52TSOP II
Categorystorage    storage   
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Environmental Compliance
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R1LV3216RSD-7SI#B0 Overview

IC SRAM 32M PARALLEL 52TSOP II

R1LV3216RSD-7SI#B0 Parametric

Parameter NameAttribute value
Brand NameRenesas
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerRenesas Electronics Corporation
Parts packaging codeTSOP(2)
package instruction8.89 X 10.79 MM, 0.40 MM PITCH, ROHS COMPLIANT, PLASTIC, TSOP2-52
Contacts52
Manufacturer packaging codePTSB0052LB-A52
Reach Compliance Codecompliant
ECCN code3A991.B.2.A
Factory Lead Time1 week
Samacsys DescriptionSRAM- 32Mbit
Maximum access time70 ns
Spare memory width8
I/O typeCOMMON
JESD-30 codeR-PDSO-G52
length10.79 mm
memory density33554432 bit
Memory IC TypeSTANDARD SRAM
memory width16
Number of functions1
Number of terminals52
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize2MX16
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP52,.4,16
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply3/3.3 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum standby current0.000012 A
Minimum standby current2 V
Maximum slew rate0.055 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.4 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width8.89 mm
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