CD4086BFSH
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Renesas Electronics Corporation |
Reach Compliance Code | not_compliant |
Is Samacsys | N |
JESD-30 code | R-XDIP-T14 |
JESD-609 code | e0 |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | AND-OR-INVERT GATE |
MaximumI(ol) | 0.00036 A |
Number of terminals | 14 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP14,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5/15 V |
Prop。Delay @ Nom-Sup | 837 ns |
Certification status | Not Qualified |
Schmitt trigger | NO |
Filter level | 38535V;38534K;883S |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
total dose | 1M Rad(Si) V |
Base Number Matches | 1 |
CD4086BFSH | CD4086BFBR | CD4086BFSR | CD4086BFBH | CD4086BQSR | CD4086BQSH | |
---|---|---|---|---|---|---|
Description | CD4086BFSH | CD4086BFBR | CD4086BFSR | CD4086BFBH | CD4086BQSR | CD4086BQSH |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | _compli |
JESD-30 code | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDFP-F14 | R-XDFP-F14 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
Logic integrated circuit type | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE |
MaximumI(ol) | 0.00036 A | 0.00036 A | 0.00036 A | 0.00036 A | 0.00036 A | 0.00036 A |
Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
encapsulated code | DIP | DIP | DIP | DIP | DFP | DFP |
Encapsulate equivalent code | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | FL14,.3 | FL14,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK | FLATPACK |
power supply | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Schmitt trigger | NO | NO | NO | NO | NO | NO |
Filter level | 38535V;38534K;883S | 38535Q/M;38534H;883B | 38535V;38534K;883S | 38535Q/M;38534H;883B | 38535V;38534K;883S | 38535V;38534K;883S |
surface mount | NO | NO | NO | NO | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
total dose | 1M Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 1M Rad(Si) V | 100k Rad(Si) V | 1M Rad(Si) V |
Is Samacsys | N | N | N | N | - | - |
Prop。Delay @ Nom-Sup | 837 ns | 837 ns | 837 ns | 837 ns | 837 ns | - |
Base Number Matches | 1 | 1 | 1 | 1 | - | - |