LPC1830FET100,551 datasheet, PDF

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LPC1830FET100,551: DescriptionIC MCU 32BIT ROMLESS 100TFBGA; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，153 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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LPC1830FET100,551 Overview

IC MCU 32BIT ROMLESS 100TFBGA

LPC1830FET100,551 Parametric

Parameter Name	Attribute value
Source Url Status Check Date	2013-06-14 00:00:00
Brand Name	NXP Semiconductor
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	BGA
package instruction	TFBGA, BGA100,10X10,32
Contacts	100
Manufacturer packaging code	SOT926-1
Reach Compliance Code	compliant
Samacsys Description	ARM Microcontrollers - MCU Cortex-M3 200kB SRAM 200 kB SRAM
Has ADC	YES
Address bus width	24
bit size	32
CPU series	CORTEX-M3
maximum clock frequency	25 MHz
DAC channel	YES
DMA channel	YES
External data bus width	32
JESD-30 code	S-PBGA-B100
JESD-609 code	e1
length	9 mm
Humidity sensitivity level	3
Number of I/O lines	49
Number of terminals	100
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA100,10X10,32
Package shape	SQUARE
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
power supply	2.5/3.3 V
Certification status	Not Qualified
RAM (bytes)	204800
rom(word)	65536
ROM programmability	FLASH
Maximum seat height	1.2 mm
speed	180 MHz
Maximum supply voltage	3.6 V
Minimum supply voltage	2.2 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	9 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

LPC1830FET100,551 Related Products

	LPC1830FET100,551	LPC1830FBD144,551	LPC1810FET100,551	LPC1850FET180,551	OM13010,598	P0402H2803FNWA	935309019551
Description	IC MCU 32BIT ROMLESS 100TFBGA	IC MCU 32BIT ROMLESS 144LQFP	IC MCU 32BIT ROMLESS 100TFBGA	IC MCU 32BIT ROMLESS 180TFBGA	DEMO BOARD LPC1800	Fixed Resistor, Thin Film, 0.063W, 280000ohm, 50V, 1% +/-Tol, 50ppm/Cel, Surface Mount, 0402, CHIP	RISC Microcontroller
Source Url Status Check Date	2013-06-14 00:00:00	2013-06-14 00:00:00	2013-06-14 00:00:00	2013-06-14 00:00:00	-	-	-
Brand Name	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	-	-	-
Is it Rohs certified?	conform to	conform to	conform to	conform to	-	conform to	-
Maker	NXP	NXP	NXP	NXP	-	-	NXP
Parts packaging code	BGA	QFP	BGA	BGA	-	-	-
package instruction	TFBGA, BGA100,10X10,32	LFQFP, QFP144,.87SQ,20	TFBGA, BGA100,10X10,32	TFBGA, BGA180,14X14,32	-	CHIP	,
Contacts	100	144	100	180	-	-	-
Manufacturer packaging code	SOT926-1	SOT486-1	SOT926-1	SOT570-3	-	-	-
Reach Compliance Code	compliant	compliant	compliant	compliant	-	compliant	unknown
Has ADC	YES	YES	YES	YES	-	-	-
Address bus width	24	24	24	24	-	-	-
bit size	32	32	32	32	-	-	-
CPU series	CORTEX-M3	CORTEX-M3	CORTEX-M3	CORTEX-M3	-	-	-
maximum clock frequency	25 MHz	25 MHz	25 MHz	25 MHz	-	-	-
DAC channel	YES	YES	YES	YES	-	-	-
DMA channel	YES	YES	YES	YES	-	-	-
External data bus width	32	32	32	32	-	-	-
JESD-30 code	S-PBGA-B100	S-PQFP-G144	S-PBGA-B100	S-PBGA-B180	-	-	-
JESD-609 code	e1	e3	e1	e1	-	e2	-
length	9 mm	20 mm	9 mm	12 mm	-	-	-
Humidity sensitivity level	3	3	3	3	-	-	-
Number of I/O lines	49	83	49	118	-	-	-
Number of terminals	100	144	100	180	-	2	-
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	-	155 °C	-
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-	-55 °C	-
PWM channel	NO	YES	NO	YES	-	-	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	-	-
encapsulated code	TFBGA	LFQFP	TFBGA	TFBGA	-	-	-
Encapsulate equivalent code	BGA100,10X10,32	QFP144,.87SQ,20	BGA100,10X10,32	BGA180,14X14,32	-	-	-
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	-	-	-
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	-	SMT	-
Peak Reflow Temperature (Celsius)	260	260	260	260	-	-	-
power supply	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	-	-	-
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	-	-
RAM (bytes)	204800	204800	139264	204800	-	-	-
rom(word)	65536	65536	65536	65536	-	-	-
ROM programmability	FLASH	FLASH	FLASH	FLASH	-	-	-
Maximum seat height	1.2 mm	1.6 mm	1.2 mm	1.2 mm	-	-	-
speed	180 MHz	180 MHz	180 MHz	180 MHz	-	-	-
Maximum supply voltage	3.6 V	3.6 V	3.6 V	3.6 V	-	-	-
Minimum supply voltage	2.2 V	2.2 V	2.2 V	2.2 V	-	-	-
Nominal supply voltage	3.3 V	3.3 V	3.3 V	3.3 V	-	-	-
surface mount	YES	YES	YES	YES	-	YES	-
technology	CMOS	CMOS	CMOS	CMOS	-	THIN FILM	-
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-	-	-
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Tin (Sn)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	-	Tin/Silver (Sn/Ag) - with Nickel (Ni) barrier	-
Terminal form	BALL	GULL WING	BALL	BALL	-	-	-
Terminal pitch	0.8 mm	0.5 mm	0.8 mm	0.8 mm	-	-	-
Terminal location	BOTTOM	QUAD	BOTTOM	BOTTOM	-	-	-
Maximum time at peak reflow temperature	30	30	30	30	-	-	-
width	9 mm	20 mm	9 mm	12 mm	-	-	-
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	-	-	MICROCONTROLLER, RISC

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