Maxim Product Naming Conventions - Maxim
MAXIM PRODUCT NAMING CONVENTIONS
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SOURCED PARTS
PROPRIETARY PARTS
Product Numbers for Proprietary Parts
Most Maxim parts use our own part numbering system which consists of a base part
number followed by a suffix, plus optional additional designators.
Example:
(A) Base Part Number
The base part number identifies the product type, independent of package,
temperature, and other variants. Variants such as accuracy grade are usually denoted
in the suffix but sometime a variant will be assigned a new base part number.
(B) Suffix
Maxim parts have a three or four letter suffix.
• Four letter suffix
When a part has a four-letter suffix, the first letter of the suffix denotes product
grade (accuracy, speed, etc.) For example, the first "A" in MAX631ACPA
indicates 5% output accuracy. The product's full data sheet details the grades
that apply to that part. The remaining three letters conform to the rules for three-
letter suffixes.
• Three-letter suffix
The three letters denote
temperature range, package type,
and
number of pins.
The meanings are defined in the tables below.
Example: MAX696CWE
C = Operating Temperature Range C (0°C to +70°C)
W = Package Type W (SOIC 0.300")
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Maxim Product Naming Conventions - Maxim
E = Number of Pins category E (16 pins)
Please note that suffix codes are not always consistent across different product
types. Always refer to the data sheet for details and specifications.
Temperature Ranges
A
C
E
G
I
M
T
U
Automotive AEC-Q100 Grade -40°C to +125°C
1
Commercial
Extended
0°C to +70°C
-40°C to +85°C
Automotive AEC-Q100 Grade -40°C to +105°C
2
Industrial
Military
-20°C to +85°C
-55°C to +125°C
Automotive AEC-Q100 Grade -40°C to +150°C
0
Upper Commercial
0°C to +85°C
Package Type
A
B
C
C
C
D
E
F
G
G
H
H
SSOP (Shrink Small Outline Package) 209 mil (14, 16, 20, 24, 28 leads); 300 mil
(36 leads)
UCSP (Ultra-Small Chip Scale Pkg)
PLASTIC TO-92; TO-220
LQFP 1.4mm (7mm x 7mm thru 20mm x 20mm)
TQFP 1.0mm (7mm x 7mm thru 20mm x 20mm)
CERAMIC SIDEBRAZE 300 mil (8, 14, 16, 18, 20 leads); 600 mil (24, 28, 40, 48
leads)
QSOP (Quarter Small Outline Package)
CERAMIC FLATPACK
METAL CAN (Gold)
QFN (Plastic, Very Thin, Quad Flat No Lead - Punch Version) 0.9mm
SBGA (Super Ball Grid Array)
TQFP 1.0mm 5mm x 5mm (32 leads)
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Maxim Product Naming Conventions - Maxim
H
J
K
L
L
L
M
N
P
Q
R
S
T
T
T
TSSOP (Thin Shrink Small Outline Package) 4.4mm (8 leads)
CERDIP (Ceramic Dual-Inline) (N) 300 mil (8, 14, 16, 18, 20 leads); (W) 600 mil
(24, 28, 40 leads)
SOT 1.23mm (8 Leads)
LCC (Leadless Ceramic Chip Carrier) (18, 20, 28 leads)
FCLGA (Flip Chip Land Grid Array); THIN LGA (Thin Land Grid Array) 0.8mm
µDFN (Micro Dual Flat No Lead) (6, 8, 10 leads)
MQFP (Metric Quad Flat Pack) over 1.4mm; ED-QUAD (28mm x 28mm 160
leads)
PDIP (Narrow Plastic Dual-Inline) 300 mil (24, 28 leads)
PDIP (Plastic Dual-Inline) 300 mil (8, 14, 16, 18, 20 leads); 600 mil (24, 28, 40
leads)
PLCC (Plastic Leaded Chip Carrier)
CERDIP (Narrow Ceramic Dual-Inline) 300 mil (24, 28 leads)
SOIC (Narrow Plastic Small Outline) 150 mil
METAL CAN (Nickel)
TDFN (Plastic, Very Very Thin, Dual Flat No Lead - Sawn Version) 0.9mm (6, 8,
10, 14 leads)
THIN QFN (Plastic, Very Very Thin, Quad Flat No Lead - Sawn Version) 0.8mm
TQ THIN QFN (Plastic, Very Very Thin, Quad Flat No Lead - Sawn Version) 0.8mm
(8 leads)
U
U
U
V
W
W
X
X
SOT 1.23mm (3, 4, 5, 6 leads)
TSSOP (Thin Shrink Small Outline Package) 4.4mm (14, 16, 20, 24, 28, 38, 56
leads); 6.1mm (48 leads)
µMAX (Thin Shrink Small Outline Package) 3mm x 3mm (8, 10 leads)
U. TQFN (Ultra Thin QFN -Plastic Ultra Thin Quad Flat No Lead - Sawn version)
0.55mm
SOIC (Wide Plastic Small Outline) 300 mil
WLP (Wafer Level Pkg)
CSBGA 1.4mm
CVBGA 1.0mm
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Maxim Product Naming Conventions - Maxim
X
Y
Z
SC70
SIDEBRAZE (Narrow) 300 mil (24, 28 leads), ULTRA THIN LGA 0.5mm
THIN SOT 1mm (5, 6, 8 leads)
Number of Pins
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
R
S
T
U
V
8, 25, 46, 182
10, 64
12, 192
14, 128
16, 144
22, 256
24, 81
44, 126
28, 57
32, 49
5, 68, 265
9, 40
7, 48, 267
18, 56
42, 73
20, 96
2, 100
3, 84
4, 80
6, 160
38, 60
8 (0.200" pin circle, isolated case), 30, 196
W 10 (0.230" pin circle, isolated case), 169
X
Y
36, 45
8 (0.200" pin circle, case tied to pin 4), 52
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Maxim Product Naming Conventions - Maxim
Z
10 (0.230" pin circle, case tied to pin 5), 26, 72
(C) Additional Designators (optional)
The following characters may appear after the three- or four-letter suffix. They can
appear alone or in combination.
Additional Suffix Characters
/883B
Cxx, Gxx, or
TGxx**
D
/GG8, /GH9
Fully compliant MIL-STD-883 Military product. Parts have their own
datasheets, see: MIL-STD-883B Data Sheets.
Custom device. Often these relate to special labeling
requirements. Request a quote to learn details.
Indicates that the device has a Moisture Sensitivity Level (MSL) of >
1 and will therefore be drypacked before shipment.
Lead (SnPb) Finish for COTS Parts. Low Volume program
uses /GG8, High-Volume program uses /GH9. For more information
see: Lead (SnPb) Finish for COTS Parts.
Obsolescence Mitigation (OM) Program.
High reliability products that have not been certified to MIL-STD-
883.
/G0F
/HR
/PR, /PR2, /PR3 Ruggedized Plastic. These are commercial parts which have a
higher level of screening to appeal to customers who want
something between Commercial-Off-The-Shelf (COTS) and full
Military. See: Ruggedized Plastic Parts.
T, T&R, T10
Part is furnished on tape-and-reel. T or T&R indicates the standard
reel quantity for the given package, usually 2.5K. T10 indicates a
reel quantity of 10K.
Signifies cut tape.
Automotive Qualified. Automotive Qualified parts follow a strict
manufacturing and QA process to comply with quality levels
accepted by Automotive Industry Worldwide. See Automotive /V
Products.
"Waivered" device that does not meet data sheet specifications.
Indicates a lead-free (RoHS) qualified version. See our lead-free
information page.*
U
/V
W
+
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