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74AVC16T245BX,518

Description
IC TRNSLTR BIDIRECTIONAL 60HXQFN
Categorylogic    logic   
File Size943KB,28 Pages
ManufacturerNexperia
Websitehttps://www.nexperia.com
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74AVC16T245BX,518 Overview

IC TRNSLTR BIDIRECTIONAL 60HXQFN

74AVC16T245BX,518 Parametric

Parameter NameAttribute value
Brand NameNexperia
MakerNexperia
package instructionHVBCC,
ContactsQFN
Manufacturer packaging codeSOT1134-2
Reach Compliance Codecompliant
seriesAVC
JESD-30 codeR-PBCC-B60
JESD-609 codee4
length6 mm
Logic integrated circuit typeBUS TRANSCEIVER
Humidity sensitivity level2
Number of digits8
Number of functions2
Number of ports2
Number of terminals60
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeHVBCC
Package shapeRECTANGULAR
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)260
propagation delay (tpd)10.2 ns
Maximum seat height0.5 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)0.8 V
Nominal supply voltage (Vsup)1.2 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formBUTT
Terminal pitch0.5 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width4 mm
Base Number Matches1

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Description IC TRNSLTR BIDIRECTIONAL 60HXQFN IC TRNSLTR BIDIRECTIONAL 56VFBGA IC TRNSLTR BIDIRECTIONAL 48TSSOP IC TRNSLTR BIDIRECTIONAL 48TSSOP
Brand Name Nexperia Nexperia Nexperia Nexperia
Maker Nexperia Nexperia Nexperia Nexperia
package instruction HVBCC, VFBGA, TSSOP-48 4.40 MM, 0.40 MM PITCH, PLASTIC, MO-153, SOT480-1, TSSOP-48
Contacts QFN 56 48 48
Manufacturer packaging code SOT1134-2 SOT702-1 SOT480-1 SOT480-1
Reach Compliance Code compliant compliant compliant compliant
series AVC AVC AVC AVC
JESD-30 code R-PBCC-B60 R-PBGA-B56 R-PDSO-G48 R-PDSO-G48
length 6 mm 7 mm 9.7 mm 9.7 mm
Logic integrated circuit type BUS TRANSCEIVER BUS TRANSCEIVER BUS TRANSCEIVER BUS TRANSCEIVER
Number of digits 8 8 8 8
Number of functions 2 2 2 2
Number of ports 2 2 2 2
Number of terminals 60 56 48 48
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Output polarity TRUE TRUE TRUE TRUE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HVBCC VFBGA TSSOP TSSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
propagation delay (tpd) 10.2 ns 10.2 ns 10.2 ns 10.2 ns
Maximum seat height 0.5 mm 1 mm 1.1 mm 1.1 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 0.8 V 0.8 V 0.8 V 0.8 V
Nominal supply voltage (Vsup) 1.2 V 1.2 V 1.2 V 1.2 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal form BUTT BALL GULL WING GULL WING
Terminal pitch 0.5 mm 0.65 mm 0.4 mm 0.4 mm
Terminal location BOTTOM BOTTOM DUAL DUAL
width 4 mm 4.5 mm 4.4 mm 4.4 mm
Base Number Matches 1 1 1 1
Peak Reflow Temperature (Celsius) 260 NOT SPECIFIED NOT SPECIFIED -
Maximum time at peak reflow temperature 30 NOT SPECIFIED NOT SPECIFIED -
Parts packaging code - BGA TSSOP TSSOP

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