|
74AVC16T245BX,518 |
74AVC16T245EV/G,51 |
74AVC16T245DGV,118 |
74AVC16T245DGV-Q1J |
Description |
IC TRNSLTR BIDIRECTIONAL 60HXQFN |
IC TRNSLTR BIDIRECTIONAL 56VFBGA |
IC TRNSLTR BIDIRECTIONAL 48TSSOP |
IC TRNSLTR BIDIRECTIONAL 48TSSOP |
Brand Name |
Nexperia |
Nexperia |
Nexperia |
Nexperia |
Maker |
Nexperia |
Nexperia |
Nexperia |
Nexperia |
package instruction |
HVBCC, |
VFBGA, |
TSSOP-48 |
4.40 MM, 0.40 MM PITCH, PLASTIC, MO-153, SOT480-1, TSSOP-48 |
Contacts |
QFN |
56 |
48 |
48 |
Manufacturer packaging code |
SOT1134-2 |
SOT702-1 |
SOT480-1 |
SOT480-1 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
series |
AVC |
AVC |
AVC |
AVC |
JESD-30 code |
R-PBCC-B60 |
R-PBGA-B56 |
R-PDSO-G48 |
R-PDSO-G48 |
length |
6 mm |
7 mm |
9.7 mm |
9.7 mm |
Logic integrated circuit type |
BUS TRANSCEIVER |
BUS TRANSCEIVER |
BUS TRANSCEIVER |
BUS TRANSCEIVER |
Number of digits |
8 |
8 |
8 |
8 |
Number of functions |
2 |
2 |
2 |
2 |
Number of ports |
2 |
2 |
2 |
2 |
Number of terminals |
60 |
56 |
48 |
48 |
Maximum operating temperature |
125 °C |
125 °C |
125 °C |
125 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Output characteristics |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
Output polarity |
TRUE |
TRUE |
TRUE |
TRUE |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
HVBCC |
VFBGA |
TSSOP |
TSSOP |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
propagation delay (tpd) |
10.2 ns |
10.2 ns |
10.2 ns |
10.2 ns |
Maximum seat height |
0.5 mm |
1 mm |
1.1 mm |
1.1 mm |
Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
Minimum supply voltage (Vsup) |
0.8 V |
0.8 V |
0.8 V |
0.8 V |
Nominal supply voltage (Vsup) |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
surface mount |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
Terminal form |
BUTT |
BALL |
GULL WING |
GULL WING |
Terminal pitch |
0.5 mm |
0.65 mm |
0.4 mm |
0.4 mm |
Terminal location |
BOTTOM |
BOTTOM |
DUAL |
DUAL |
width |
4 mm |
4.5 mm |
4.4 mm |
4.4 mm |
Base Number Matches |
1 |
1 |
1 |
1 |
Peak Reflow Temperature (Celsius) |
260 |
NOT SPECIFIED |
NOT SPECIFIED |
- |
Maximum time at peak reflow temperature |
30 |
NOT SPECIFIED |
NOT SPECIFIED |
- |
Parts packaging code |
- |
BGA |
TSSOP |
TSSOP |