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SI53119-A03AGMR

Description
1:19 LOW-POWER PCIE FANOUT/ZERO-
Categorylogic    logic   
File Size1MB,35 Pages
ManufacturerSilicon Laboratories Inc
Environmental Compliance
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SI53119-A03AGMR Overview

1:19 LOW-POWER PCIE FANOUT/ZERO-

SI53119-A03AGMR Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSilicon Laboratories Inc
package instructionHVQCCN,
Reach Compliance Codecompliant
series53119
Input adjustmentDIFFERENTIAL MUX
JESD-30 codeS-XQCC-N72
length10 mm
Logic integrated circuit typePLL BASED CLOCK DRIVER
Number of functions1
Number of inverted outputs
Number of terminals72
Actual output times38
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialUNSPECIFIED
encapsulated codeHVQCCN
Package shapeSQUARE
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
propagation delay (tpd)4.5 ns
Same Edge Skew-Max(tskwd)0.05 ns
Maximum seat height0.95 mm
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
Temperature levelINDUSTRIAL
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width10 mm

SI53119-A03AGMR Related Products

SI53119-A03AGMR SI53119-A03AGM
Description 1:19 LOW-POWER PCIE FANOUT/ZERO- 1:19 LOW-POWER PCIE FANOUT/ZERO-
Is it Rohs certified? conform to conform to
Maker Silicon Laboratories Inc Silicon Laboratories Inc
package instruction HVQCCN, HVQCCN,
Reach Compliance Code compliant compliant
series 53119 53119
Input adjustment DIFFERENTIAL MUX DIFFERENTIAL MUX
JESD-30 code S-XQCC-N72 S-XQCC-N72
length 10 mm 10 mm
Logic integrated circuit type PLL BASED CLOCK DRIVER PLL BASED CLOCK DRIVER
Number of functions 1 1
Number of terminals 72 72
Actual output times 38 38
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Package body material UNSPECIFIED UNSPECIFIED
encapsulated code HVQCCN HVQCCN
Package shape SQUARE SQUARE
Package form CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
propagation delay (tpd) 4.5 ns 4.5 ns
Same Edge Skew-Max(tskwd) 0.05 ns 0.05 ns
Maximum seat height 0.95 mm 0.95 mm
Maximum supply voltage (Vsup) 3.465 V 3.465 V
Minimum supply voltage (Vsup) 3.135 V 3.135 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V
surface mount YES YES
Temperature level INDUSTRIAL INDUSTRIAL
Terminal form NO LEAD NO LEAD
Terminal pitch 0.5 mm 0.5 mm
Terminal location QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
width 10 mm 10 mm

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