74HC9115N,112 datasheet, PDF - EEWORLD Datasheet

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74HC9115N,112: DescriptionIC BUFFER NON-INVERT 6V 20DIP; Categorylogic logic; File Size155KB，8 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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74HC9115N,112 Overview

IC BUFFER NON-INVERT 6V 20DIP

74HC9115N,112 Parametric

Parameter Name	Attribute value
Brand Name	NXP Semiconductor
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	DIP
package instruction	DIP-20
Contacts	20
Manufacturer packaging code	SOT146-1
Reach Compliance Code	compliant
series	HC/UH
JESD-30 code	R-PDIP-T20
JESD-609 code	e4
length	26.73 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	BUFFER
MaximumI(ol)	0.004 A
Number of functions	9
Number of entries	1
Number of terminals	20
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Output characteristics	OPEN-DRAIN
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP20,.3
Package shape	RECTANGULAR
Package form	IN-LINE
method of packing	TUBE
Peak Reflow Temperature (Celsius)	260
power supply	2/6 V
propagation delay (tpd)	33 ns
Certification status	Not Qualified
Schmitt trigger	YES
Maximum seat height	4.2 mm
Maximum supply voltage (Vsup)	6 V
Minimum supply voltage (Vsup)	2 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	7.62 mm

74HC9115N,112 Related Products

	74HC9115N,112	74HCT9115D,118	74HCT9115D,112	74HCT9115N,112
Description	IC BUFFER NON-INVERT 6V 20DIP	IC BUFFER NON-INVERT 5.5V 20SO	IC BUFFER NON-INVERT 5.5V 20SO	IC BUFFER NON-INVERT 5.5V 20DIP
Brand Name	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor
Is it Rohs certified?	conform to	conform to	conform to	conform to
Maker	NXP	NXP	NXP	NXP
Parts packaging code	DIP	SOP	SOP	DIP
package instruction	DIP-20	SO-20	SO-20	DIP,
Contacts	20	20	20	20
Manufacturer packaging code	SOT146-1	SOT163-1	SOT163-1	SOT146-1
Reach Compliance Code	compliant	unknown	unknown	unknown
series	HC/UH	HCT	HCT	HCT
JESD-30 code	R-PDIP-T20	R-PDSO-G20	R-PDSO-G20	R-PDIP-T20
JESD-609 code	e4	e4	e4	e4
length	26.73 mm	12.8 mm	12.8 mm	26.73 mm
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	BUFFER	BUFFER	BUFFER	BUFFER
Number of functions	9	9	9	9
Number of entries	1	1	1	1
Number of terminals	20	20	20	20
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
Output characteristics	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	SOP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE
Peak Reflow Temperature (Celsius)	260	260	260	260
propagation delay (tpd)	33 ns	47 ns	47 ns	47 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.2 mm	2.65 mm	2.65 mm	4.2 mm
Maximum supply voltage (Vsup)	6 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	2 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	30	30	30
width	7.62 mm	7.5 mm	7.5 mm	7.62 mm
Base Number Matches	-	1	1	1

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