IC MUX/DEMUX TRIPLE 2X1 16DIP
| Parameter Name | Attribute value |
| Brand Name | NXP Semiconductor |
| Is it Rohs certified? | conform to |
| Maker | NXP |
| Parts packaging code | DIP |
| package instruction | PLASTIC, DIP-16 |
| Contacts | 16 |
| Manufacturer packaging code | SOT38-4 |
| Reach Compliance Code | compliant |
| Analog Integrated Circuits - Other Types | SINGLE-ENDED MULTIPLEXER |
| JESD-30 code | R-PDIP-T16 |
| length | 21.6 mm |
| Nominal Negative Supply Voltage (Vsup) | |
| Number of channels | 2 |
| Number of functions | 3 |
| Number of terminals | 16 |
| Nominal off-state isolation | 50 dB |
| On-state resistance matching specifications | 5 Ω |
| Maximum on-state resistance (Ron) | 175 Ω |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 5/15 V |
| Certification status | Not Qualified |
| Maximum seat height | 4.7 mm |
| Maximum signal current | 0.01 A |
| Maximum supply current (Isup) | 0.6 mA |
| Maximum supply voltage (Vsup) | 15 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 15 V |
| surface mount | NO |
| Maximum disconnect time | 220 ns |
| Maximum connection time | 140 ns |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | NICKEL/PALLADIUM/GOLD (NI/PD/AU) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| width | 7.62 mm |
| Base Number Matches | 1 |
| HEF4053BP,652 | HEF4053BTT,112 | HEF4053BT/AUJ | HEF4053BTT,118 | |
|---|---|---|---|---|
| Description | IC MUX/DEMUX TRIPLE 2X1 16DIP | multiplexer switch ics trpl 2-CH mux/DEmux | multiplexer switch ics trpl sngl-pole dble- throw analog switch | multiplexer switch ics trpl 2-CH mux/DEmux |
| Brand Name | NXP Semiconductor | NXP Semiconduc | - | NXP Semiconductor |
| Is it Rohs certified? | conform to | conform to | - | conform to |
| Parts packaging code | DIP | TSSOP | - | TSSOP |
| package instruction | PLASTIC, DIP-16 | PLASTIC, SO-16 | - | PLASTIC, SO-16 |
| Contacts | 16 | 16 | - | 16 |
| Manufacturer packaging code | SOT38-4 | SOT403-1 | - | SOT403-1 |
| Reach Compliance Code | compliant | compli | - | compliant |
| Analog Integrated Circuits - Other Types | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | - | SINGLE-ENDED MULTIPLEXER |
| JESD-30 code | R-PDIP-T16 | R-PDSO-G16 | - | R-PDSO-G16 |
| length | 21.6 mm | 9.9 mm | - | 9.9 mm |
| Number of channels | 2 | 2 | - | 2 |
| Number of functions | 3 | 3 | - | 3 |
| Number of terminals | 16 | 16 | - | 16 |
| Nominal off-state isolation | 50 dB | 50 dB | - | 50 dB |
| On-state resistance matching specifications | 5 Ω | 5 Ω | - | 5 Ω |
| Maximum on-state resistance (Ron) | 175 Ω | 175 Ω | - | 175 Ω |
| Maximum operating temperature | 85 °C | 85 °C | - | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | - | -40 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| encapsulated code | DIP | SOP | - | SOP |
| Encapsulate equivalent code | DIP16,.3 | TSSOP16,.25 | - | TSSOP16,.25 |
| Package shape | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE | - | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | 260 | 260 | - | 260 |
| power supply | 5/15 V | 5/15 V | - | 5/15 V |
| Certification status | Not Qualified | Not Qualified | - | Not Qualified |
| Maximum seat height | 4.7 mm | 1.75 mm | - | 1.75 mm |
| Maximum signal current | 0.01 A | 0.01 A | - | 0.01 A |
| Maximum supply current (Isup) | 0.6 mA | 0.6 mA | - | 0.6 mA |
| Maximum supply voltage (Vsup) | 15 V | 15 V | - | 15 V |
| Minimum supply voltage (Vsup) | 3 V | 3 V | - | 3 V |
| Nominal supply voltage (Vsup) | 15 V | 15 V | - | 15 V |
| surface mount | NO | YES | - | YES |
| Maximum disconnect time | 220 ns | 220 ns | - | 220 ns |
| Maximum connection time | 140 ns | 140 ns | - | 140 ns |
| technology | CMOS | CMOS | - | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL |
| Terminal surface | NICKEL/PALLADIUM/GOLD (NI/PD/AU) | NICKEL PALLADIUM GOLD | - | NICKEL/PALLADIUM/GOLD (NI/PD/AU) |
| Terminal form | THROUGH-HOLE | GULL WING | - | GULL WING |
| Terminal pitch | 2.54 mm | 1.27 mm | - | 1.27 mm |
| Terminal location | DUAL | DUAL | - | DUAL |
| Maximum time at peak reflow temperature | 30 | 30 | - | 30 |
| width | 7.62 mm | 3.9 mm | - | 3.9 mm |
| Base Number Matches | 1 | 1 | - | 1 |
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